| Physical fault injection and side-channel attacks on mobile devices: A comprehensive analysis C Shepherd, K Markantonakis, N Van Heijningen, D Aboulkassimi, ... Computers & Security 111, 102471, 2021 | 57 | 2021 |
| Low-temperature low-cost 58 Bismuth–42 Tin alloy forensic chip re-balling and re-soldering T Heckmann, T Souvignet, S Lepeer, D Naccache Digital Investigation 19, 60-68, 2016 | 13 | 2016 |
| Forensic smartphone analysis using adhesives: Transplantation of package on package components T Heckmann, K Markantonakis, D Naccache, T Souvignet Digital Investigation 26, 29-39, 2018 | 12 | 2018 |
| Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics T Heckmann, T Souvignet, D Naccache Digital Investigation 21, 53-64, 2017 | 9 | 2017 |
| New diagnostic forensic protocol for damaged secure digital memory cards F Thomas-Brans, T Heckmann, K Markantonakis, D Sauveron IEEE Access 10, 33742-33757, 2022 | 8 | 2022 |
| Medical Equipment Used for Forensic Data Extraction: A low-cost solution for forensic laboratories not provided with expensive diagnostic or advanced repair equipment T Heckmann, T Souvignet, D Sauveron, D Naccache Forensic Science International: Digital Investigation 36, 301092, 2021 | 8 | 2021 |
| Removing epoxy underfill between neighbouring components using acid for component chip-off T Heckmann, JP McEvoy, K Markantonakis, RN Akram, D Naccache Digital Investigation 29, 198-209, 2019 | 7 | 2019 |
| A forensic analysis of the Google Home: Repairing compressed data without error correction H Barral, GA Jaloyan, F Thomas-Brans, M Regnery, R Géraud-Stewart, ... Forensic Science International: Digital Investigation 42, 301437, 2022 | 6 | 2022 |
| Reverse engineering secure systems using physical attacks T Heckmann Université Paris sciences et lettres, 2018 | 5 | 2018 |
| Preservation of DNA privacy during the large scale detection of COVID-19 M Hollenstein, D Naccache, PB Rønne, PYA Ryan, R Weil, O Yifrach-Stav arXiv preprint arXiv:2007.09085, 2020 | 3 | 2020 |
| Decrease of energy deposited during laser decapsulation attacks by dyeing and pigmenting the ECA: Application to the forensic micro-repair of wire bonding T Heckmann, T Souvignet, D Naccache Digital Investigation 29, 210-218, 2019 | 2 | 2019 |
| Case of study for in situ memory reading on damaged MultiMedia Card F Thomas-Brans, A Fukami, Q Clement, T Heckmann, D Sauveron Forensic Science International: Digital Investigation 48, 301698, 2024 | 1 | 2024 |
| From Lucky Luke to Lock Bits TR Souvignet, T Heckmann, T Bolle IEEE Security & Privacy 18 (2), 61-66, 2020 | 1 | 2020 |
| Code dalloz de la cybersécurité 2024 annoté et commenté 2ème édition M Sejean, T Heckmann, N Valère, N Emmanuel, N Anne-Thida, ... | | 2023 |
| Code dalloz de la cybersécurité 2022 annoté et commenté M Sejean, T Heckmann, N Valère, N Emmanuel, N Anne-Thida, ... | | 2022 |
| Glossary to Support Applied International Research on Decision Making for High Conflict Urban Marches and Parades L Hauff, T Heckmann Collective Dynamics 6, 1-17, 2021 | | 2021 |
| Medical Equipment for Mobile Phone Transplantation T Heckmann Europol-Forensic Expert Forum 2020, 2020 | | 2020 |
| Digital Forensics–Key Technologies Used T Heckmann Digital Forensics Workshop, 2019 | | 2019 |
| Origines de l'expertise judiciaire scientifique T Heckmann 4ème NUIT DES SCIENCES & LETTRES DE L'ÉCOLE NORMALE SUPÉRIEURE, Les Origines, 2019 | | 2019 |
| P0131-Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics T Heckmann, T Souvignet, D Naccache 8th European Academy of Forensic Science Conference, 2018 | | 2018 |
David NaccacheENS (Equipe Securité) & visiting RHUL (ISG)Patvirtintas el. paštas ens.fr
