Nanostructure of calcium silicate hydrate gels in cement paste X Zhang, W Chang, T Zhang, CK Ong Journal of the American Ceramic Society 83 (10), 2600-2604, 2000 | 151 | 2000 |
Revisiting subcortical brain volume correlates of autism in the ABIDE dataset: effects of age and sex W Zhang, W Groen, M Mennes, C Greven, J Buitelaar, N Rommelse Psychological medicine 48 (4), 654-668, 2018 | 57 | 2018 |
Electron-beam assisted platinum deposition as a protective layer for FIB and TEM applications WY Kwong, WY Zhang ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005 …, 2005 | 32 | 2005 |
A simplified model for parameter estimation and circuit analysis of inductive-adder modulator W Zhang, W Ng, C Pai, J Sandberg, Y Tan, Y Tian IEEE Transactions on Dielectrics and Electrical Insulation 14 (4), 913-920, 2007 | 17 | 2007 |
Photoluminescence and photoelectron spectroscopic analysis of InGaAsN grown by metalorganic chemical vapor deposition W Chang, J Lin, W Zhou, SJ Chua, ZC Feng Applied physics letters 79 (27), 4497-4499, 2001 | 14 | 2001 |
Application of IR-OBIRCH to the failure analysis of CMOS integrated circuits L Soon, DTM Ling, M Kuan, KW Yee, D Cheong, G Zhang Proceedings of the 10th International Symposium on the Physical and Failure …, 2003 | 12 | 2003 |
Study of TDDB reliability in misaligned via chain structures W Liu, YK Lim, JB Tan, WY Zhang, H Liu, SY Siah 2012 IEEE International Reliability Physics Symposium (IRPS), 3A. 4.1-3A. 4.6, 2012 | 11 | 2012 |
Infrared reflection investigation of ion‐implanted and post‐implantation‐annealed epitaxially grown 6H‐SiC W Chang, ZC Feng, J Lin, R Liu, ATS Wee, K Tone, JH Zhao Surface and Interface Analysis: An International Journal devoted to the …, 2002 | 11 | 2002 |
New insight in BEOL TDDB Cu diffusion mechanism: A constant current stress approach T Shen, H Jiang, W Zhang, T Cahyadi, EC Chua, C Capasso 2014 IEEE International Reliability Physics Symposium, 3A. 5.1-3A. 5.5, 2014 | 6 | 2014 |
Study of electric field—based lifetime projection method in IMD TDDB W Zhang, X Zeng, W Liu, YK Lim, JF Liu, EC Chua 2010 IEEE International Reliability Physics Symposium, 938-942, 2010 | 6 | 2010 |
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology G Zhang, CM Tan, KT Tan, KY Sim, WY Zhang Microelectronics Reliability 44 (9-11 SPEC. ISS.), 1843-1848, 2004 | 6 | 2004 |
An overview of the fast injection-extraction kicker systems of the Brookhaven AGS-booster complex W Zhang, R Sanders, A Soukas, J Tuozzolo Proceedings of the 1999 Particle Accelerator Conference (Cat. No. 99CH36366 …, 1999 | 6 | 1999 |
1.5 GeV FFAG accelerator as injector to the BNL-AGS AG Ruggiero, M Blaskiewicz, T Roser, D Trbojevic, N Tsoupas, W Zhang Proc. 2004 European Particle Accelerator Conf, 5-9, 2004 | 5 | 2004 |
Surface and interface properties of ion implanted 4H-silicon carbide WY Chang, ZC Feng, J Lin, F Yan, JH Zhao International Journal of Modern Physics B 16 (01n02), 151-158, 2002 | 5 | 2002 |
Optical characterization of ion-implanted 4H-SiC ZC Feng, F Yan, WY Chang, JH Zhao, J Lin Materials Science Forum 389 (1), 647-650, 2002 | 5 | 2002 |
Optimization of the Hadron Ring Stripline Injection Kicker for the EIC M Sangroula, C Liaw, C Liu, N Tsoupas, S Verdú-Andrés, S Xiao, ... Brookhaven National Lab.(BNL), Upton, NY (United States), 2021 | 4 | 2021 |
Effect of chemical mechanical polishing scratch on TDDB reliability and its reduction in 45nm BEOL process W Liu, YK Lim, F Zhang, WY Zhang, CQ Chen, BC Zhang, JB Tan, ... 2009 IEEE International Reliability Physics Symposium, 613-618, 2009 | 4 | 2009 |
Infrared reflectance study of 3C-SiC grown on Si by chemical vapor deposition ZC Feng, CW Huang, WY Chang, J Zhao, CC Tin, WJ Lu, WE Collins Materials science forum 527, 695-698, 2006 | 4 | 2006 |
A PFN and transmission line simulation method for energy discharge systems W Zhang, SY Zhang, AV Soukas, WW Frey Nineteenth IEEE Symposium on Power Modulators, 74-79, 1990 | 4 | 1990 |
附加质量法在梨园混凝土面板堆石坝压实度检测中的应用 张维熙, 钱启立 水利水电技术 44 (5), 27-30, 2013 | 3 | 2013 |