Kim S Siow

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Mohd Farhanulhakim Mohd Razip WeeInstitute of Microengineering and Nanoelectronics (IMEN)Patvirtintas el. paštas ukm.edu.my
Pei Yuen NgUKM Faculty of PharmacyPatvirtintas el. paštas ukm.edu.my
Ebrahim MahmoudiSenior Lecturer, Universiti Kebangsaan Malaysia Department of Chemical and Process EngineeringPatvirtintas el. paštas ukm.edu.my
Yunhui Mei or Yun-Hui MeiTianjin Unversity and Tiangong UniversityPatvirtintas el. paštas tju.edu.cn
Zuruzi Abu SamahAlfaisal University, Kingdom of Saudi ArabiaPatvirtintas el. paštas alfaisal.edu
Lee Khai ErnProfessor, Universiti Kebangsaan MalaysiaPatvirtintas el. paštas ukm.edu.my
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSEPatvirtintas el. paštas vt.edu
Mohd Ambri MohamedInstitute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan MalaysiaPatvirtintas el. paštas ukm.edu.my
Amir ZulkefliStaff Engineer at Infineon Technologies | Reliability EngineeringPatvirtintas el. paštas infineon.com
Prof. Abdelkrim KhelifProfessor, College of Science and Engineering, Hamad Bin Khalifa UniversityPatvirtintas el. paštas femto-st.fr
Dr Ahmad Rifqi Md ZainIMEN, Universiti Kebangsaan Malaysia (UKM)Patvirtintas el. paštas ukm.edu.my
Mahmoud AddoucheFEMTO-ST, CNRSPatvirtintas el. paštas femto-st.fr
Mazlin Bin MokhtarProfessor of Environmental Chemistry, Universiti Kebangsaan MalaysiaPatvirtintas el. paštas ukm.edu.my
Abdul Wahab Mohammad, FAScProfessor, Chemical Engineering and Desalination, University of SharjahPatvirtintas el. paštas sharjah.ac.ae
gires usupProfessor of Marine Science, Universiti Kebangsaan MalaysiaPatvirtintas el. paštas ukm.edu.my
Xin LiTianjin UniversityPatvirtintas el. paštas tju.edu.cn
Azrul Azlan HamzahProfessor of Microelectromechanical Systems (MEMS), IMEN, Universiti Kebangsaan MalaysiaPatvirtintas el. paštas ukm.edu.my
Muhamad Ramdzan BuyongInstitute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan MalaysiaPatvirtintas el. paštas ukm.edu.my
Chwee Teck (C.T.) LimNUSS Professor, FRS FNAI FAIMBE FIAMBE FAAET FSAE FSNAS FIUPESM FIESPatvirtintas el. paštas nus.edu.sg
Nai Mui HoonBME, NUSPatvirtintas el. paštas nus.edu.sg

Stebėti

Kim S Siow

Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (National

Patvirtintas el. paštas ukm.edu.my

sintered silver electronics packaging mechanical behavior of materials plasma treatment


Pavadinimas Rūšiuoti pagal šaltinius Rūšiuoti pagal metus Rūšiuoti pagal pavadinimą	Cituota Cituota	Metai
Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review KS Siow, L Britcher, S Kumar, HJ Griesser Plasma processes and polymers 3 (6‐7), 392-418, 2006	1195	2006
Mechanical properties of nano-silver joints as die attach materials KS Siow Journal of Alloys and Compounds 514, 6-19, 2012	455	2012
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? KS Siow Journal of Electronic Materials 43 (4), 947-961, 2014	366	2014
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C ST Chua, KS Siow Journal of Alloys and Compounds 687, 486-498, 2016	193	2016
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints TF Chen, KS Siow Journal of Alloys and Compounds 866, 158783, 2021	180	2021
Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study KS Siow, YT Lin Journal of Electronic Packaging 138 (2), 020804, 2016	179	2016
XPS Study of Sulfur and Phosphorus Compounds with Different Oxidation States K SIOW, L Britcher, S Kumar, H JGriesser Sains Malaysiana 47 (8), 1913-1922, 2018	165	2018
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging KS Siow Materials, Process, Equipment, and Reliability, Springer International …, 2019	88	2019
Mechanical properties of nanocrystalline copper and nickel KS Siow, AAO Tay, P Oruganti Materials science and technology 20 (3), 285-294, 2004	86	2004
Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review KS Siow, S Kumar, HJ Griesser Plasma Processes and Polymers 12 (1), 8-24, 2015	76	2015
Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 6 (9), 583-592, 2009	66	2009
Plasma polymerized carvone as an antibacterial and biocompatible coating YW Chan, KS Siow, PY Ng, U Gires, BY Majlis Materials Science and Engineering: C 68, 861-871, 2016	65	2016
Unveiling the damage evolution of SAC305 during fatigue by entropy generation X Long, Y Guo, Y Su, KS Siow, C Chen International Journal of Mechanical Sciences 244, 108087, 2023	59	2023
Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 11 (2), 133-141, 2014	59	2014
Pitting corrosion of duplex stainless steels KS Siow, TY Song, JH Qiu Anti Corrosion Methods and Materials 48 (1), 31-37, 2001	54	2001
QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups KS Siow, L Britcher, S Kumar, HJ Griesser Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019	50	2019
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm²) power chips for electronics packaging Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu Journal of Materials Processing Technology 255, 644-649, 2018	48	2018
Public benefit and risk perceptions of nanotechnology development: Psychological and sociological aspects NA Kamarulzaman, KE Lee, KS Siow, M Mokhtar Technology in Society 62, 101329, 2020	43	2020
Electrical conductivity of porous silver made from sintered nanoparticles AS Zuruzi, KS Siow Electronic Materials Letters 11 (2), 308-314, 2015	39	2015
Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material KS Siow, ST Chua JOM 71 (9), 3066-3075, 2019	33	2019

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