| Near–hysteresis-free soft tactile electronic skins for wearables and reliable machine learning H Yao, W Yang, W Cheng, YJ Tan, HH See, S Li, HPA Ali, BZH Lim, Z Liu, ... Proceedings of the National Academy of Sciences 117 (41), 25352-25359, 2020 | 158 | 2020 |
| Progress and roadmap for intelligent self‐healing materials in autonomous robotics YJ Tan, GJ Susanto, HP Anwar Ali, BCK Tee Advanced Materials 33 (19), 2002800, 2021 | 135 | 2021 |
| Gecko-inspired dry adhesive based on micro–nanoscale hierarchical arrays for application in climbing devices HK Raut, A Baji, HH Hariri, H Parveen, GS Soh, HY Low, KL Wood ACS applied materials & interfaces 10 (1), 1288-1296, 2018 | 97 | 2018 |
| Bioinspired prosthetic interfaces P Li, HP Anwar Ali, W Cheng, J Yang, BCK Tee Advanced Materials Technologies 5 (3), 1900856, 2020 | 67 | 2020 |
| Effects of Interface Shear Strength during Failure of Semicoherent Metal–Metal Nanolaminates: An Example of Accumulative Roll-bonded Cu/Nb I Radchenko, HP Anwar Ali, SK Tippabhotla, AS Budiman Acta Materialia, 2018 | 56 | 2018 |
| Environment-resilient graphene vibrotactile sensitive sensors for machine intelligence H Yao, P Li, W Cheng, W Yang, Z Yang, HPA Ali, H Guo, BCK Tee ACS Materials Letters 2 (8), 986-992, 2020 | 40 | 2020 |
| The roles of interfaces and other microstructural features in Cu/Nb nanolayers as revealed by in situ beam bending experiments inside an scanning electron microscope (SEM) HPA Ali, I Radchenko, N Li, A Budiman Materials Science and Engineering: A 738, 253-263, 2018 | 36 | 2018 |
| Advances in In situ microfracture experimentation techniques: A case of nanoscale metal–metal multilayered materials HPA Ali, A Budiman Journal of Materials Research 34 (9), 1449-1468, 2019 | 19 | 2019 |
| Fabrication of PVDF hierarchical fibrillar structures using electrospinning for dry-adhesive applications R Sahay, H Parveen, A Baji, VA Ganesh, AS Ranganath Journal of Materials Science 52, 2435-2441, 2017 | 18 | 2017 |
| An overview of design cognition between experts and novices JTJ Yuan, KY Kong, H Parveen, H Zhixiang, G Rajasekaran, JK Behera, ... Proceedings of International Conference on Advanced Design Research and …, 2014 | 18 | 2014 |
| Effect of multilayer interface through in situ fracture of Cu/Nb and Al/Nb metallic multilayers HPA Ali, I Radchenko, N Li, A Budiman Journal of Materials Research 34 (9), 1564-1573, 2019 | 17 | 2019 |
| Dynamic modeling of intrinsic self-healing polymers using deep learning HP Anwar Ali, Z Zhao, YJ Tan, W Yao, Q Li, BCK Tee ACS Applied Materials & Interfaces 14 (46), 52486-52498, 2022 | 13 | 2022 |
| Interface-mediated plasticity and fracture in nanoscale Cu/Nb multilayers as revealed by in situ clamped microbeam bending AS Budiman, R Sahay, HPA Ali, SK Tippabhotla, I Radchenko, ... Materials Science and Engineering: A 803, 140705, 2021 | 13 | 2021 |
| Additive Manufacturing Enabled by Electrospinning for Tougher Bio‐Inspired Materials K Agarwal, Y Zhou, HP Anwar Ali, I Radchenko, A Baji, AS Budiman Advances in Materials Science and Engineering 2018 (1), 8460751, 2018 | 13 | 2018 |
| On the adhesion of hierarchical electrospun fibrous structures and prediction of their pull-off strength VAGAB Rahul Sahay, Hashina Parveen Anwar Ali, Anupama Sargur Ranganath RSC Advances 6, 47883-47889, 2016 | 11 | 2016 |
| Probing plasticity and strain-rate effects of indium submicron pillars using synchrotron Laue X-ray microdiffraction HPA Ali, N Tamura, AS Budiman IEEE Transactions on Device and Materials Reliability 18 (4), 490-497, 2018 | 9 | 2018 |
| Designing novel multilayered nanocomposites for high-performance coating materials with online strain monitoring capability HP Anwar Ali, I Radchenko, J Zhou, L Qing, A Budiman Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 2019 | 8 | 2019 |
| F Alshammari O Iqbal, H Ali, N Li, AI Al-Sulami K, 0 | 7 | |
| Carbon nanotube interconnects for IC chips HP Anwar Ali Massachusetts Institute of Technology, 2006 | 6 | 2006 |
| Designing Novel Metallic Multilayer Nanocomposites Through Atomic Engineering of Interfaces–Influence of Heat of Mixing HP Anwar Ali, A Budiman Procedia Engineering 215, 226-237, 2017 | 3 | 2017 |
Arief S. BudimanAssistant Professor, Singapore University of Technology & Design (SUTD)Geverifieerd e-mailadres voor sutd.edu.sg
