| Methods and systems to enhance process uniformity S Singh, A Tso, J Zhang, Z Li, H Zhang, D Lubomirsky US Patent App. 14/554,250, 2016 | 586* | 2016 |
| Direct lift process apparatus K Nguyen, S Singh, A Sabharwal US Patent 9,978,632, 2018 | 327 | 2018 |
| Wafer dicing using femtosecond-based laser and plasma etch W Lei, B Eaton, MR Yalamanchili, S Singh, A Kumar, JM Holden US Patent 8,642,448, 2014 | 132 | 2014 |
| Apparatus and Methods for Dry Etch With Edge, Side and Back Protection S Singh, GJ Scott, A Sabharwal, A Kumar US Patent 10,170,277, 2019 | 103 | 2019 |
| Auxiliary electrode encased in cation exchange membrane tube for electroplating cell S Singh, H Hafezi, M Birang, A Rosenfeld, J Behnke US Patent 7,727,364, 2010 | 77 | 2010 |
| Shaping a plasma with a magnetic field to control etch rate uniformity JM Yamartino, PK Loewenhardt, D Lubomirsky, S Singh US Patent 6,673,199, 2004 | 77 | 2004 |
| Electroplating apparatus and method based on an array of anodes S Singh, M Birang, NY Kovarsky, A Rosenfeld US Patent 7,935,240, 2011 | 67 | 2011 |
| Dynamic ion radical sieve and ion radical aperture for an inductively coupled plasma (ICP) reactor S Singh, GJ Scott, A Kumar US Patent 9,287,093, 2016 | 65 | 2016 |
| Biosynthesis of gold nanoparticles, scope and application: a review S Tikariha, S Singh, S Banerjee, AS Vidyarthi International Journal of Pharmaceutical Sciences and Research 3 (6), 1603, 2012 | 64 | 2012 |
| Electrochemical processing cell MX Yang, D Lubomirsky, Y Dordi, S Singh, S Tulshibagwale, N Kovarsky US Patent 7,247,222, 2007 | 46 | 2007 |
| Hybrid laser and plasma etch wafer dicing using substrate carrier S Singh, B Eaton, A Kumar, W Lei, JM Holden, MR Yalamanchili, TJ Egan US Patent 8,912,077, 2014 | 45 | 2014 |
| Laser, plasma etch, and backside grind process for wafer dicing W Lei, B Eaton, MR Yalamanchili, S Singh, A Kumar US Patent 8,845,854, 2014 | 40 | 2014 |
| Wafer dicing used hybrid multi-step laser scribing process with plasma etch W Lei, B Eaton, MR Yalamanchili, S Singh, A Kumar US Patent 8,652,940, 2014 | 37 | 2014 |
| Laser and plasma etch wafer dicing using water-soluble die attach film W Lei, MR Yalamanchili, B Eaton, S Singh, A Kumar US Patent 8,507,363, 2013 | 37 | 2013 |
| Thermodynamic analysis of vapor absorption refrigeration system and calculation of COP S Kaushik, S Singh International Journal for Research in Applied Science and Engineering …, 2014 | 30 | 2014 |
| In-situ deposited mask layer for device singulation by laser scribing and plasma etch MR Yalamanchili, W Lei, B Eaton, S Singh, A Kumar, B Wu US Patent 8,598,016, 2013 | 30 | 2013 |
| Water soluble mask for substrate dicing by laser and plasma etch W Lei, S Singh, MR Yalamanchili, B Eaton, A Kumar US Patent 8,703,581, 2014 | 28 | 2014 |
| Multi-step and asymmetrically shaped laser beam scribing W Lei, B Eaton, MR Yalamanchili, S Singh, A Kumar, JM Holden US Patent 8,557,683, 2013 | 27 | 2013 |
| Phytochemical analysis of some indigenous plants potent against ectoparasite A Kumar, S Singh, K Mahour, VS Vihan, K Gururaj Asian J Exp Biol Sci 2 (3), 506-509, 2011 | 27 | 2011 |
| Method and apparatus of a substrate etching system and process SV Pamarthy, JC Farr, K Sirajuddin, ER Gold, JP Cruse, S Olszewski, ... US Patent App. 12/407,548, 2009 | 27 | 2009 |
