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Hsiao-Tsung Yen
Hsiao-Tsung Yen
Geverifieerd e-mailadres voor qti.qualcomm.com
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Helical spiral inductor between stacking die
HT Yen, CW Luo, CW Kuo, MC Jeng
US Patent 8,941,212, 2015
862015
3D transmission lines for semiconductors
YL Lin, HT Yen, FW Kuo, HH Chen, CW Kuo
US Patent 8,912,581, 2014
742014
Bond wire antenna
HT Yen
US Patent 9,362,613, 2016
682016
Methods and apparatus for inductors and transformers in packages
HT Yen, YL Lin, CY Lu, CW Kuo, LIU Tzuan-Horng, HP Hu, MC Jeng
US Patent 8,896,094, 2014
662014
Integrated antenna structure on separate semiconductor die
HT Yen, YL Lin, CW Kuo, HH Chen, MC Jeng
US Patent 8,754,818, 2014
612014
System and method for modeling through silicon via
HT Yen, YL Lin, CW Kuo
US Patent 9,633,149, 2017
592017
Methods and apparatus for transmission lines in packages
YL Lin, HT Yen, CW Kuo, MC Jeng
US Patent 9,171,798, 2015
522015
Transformer with bypass capacitor
HT Yen, YL Lin, YT Lu, CW Kuo, HH Chen
US Patent 8,552,812, 2013
472013
Integrated circuit ground shielding structure
YL Lin, HT Yen, HH Chen, CP Jou
US Patent 8,659,126, 2014
422014
Integrated circuits and methods of forming the same
HT Yen, HP Hu, JC Lu, CW Kuo, MF Chen, S Liu
US Patent 8,362,591, 2013
382013
A physical de-embedding method for silicon-based device applications
HT Yen, TJ Yeh, S Liu
PIERS online 5 (4), 301-305, 2009
362009
Integrated inductor structure and integrated transformer structure
HT Yen, YS Jean, TH Yeh
US Patent 10,153,078, 2018
352018
Structure and method for a transformer with magnetic features
HT Yen, YL Lin, YT Lu, C Huan-Neng, HH Chen
US Patent 8,610,247, 2013
342013
Through-substrate via waveguides
HT Yen, HP Hu, CW Kuo, S Liu
US Patent 8,502,338, 2013
322013
3D inductor and transformer
HT Yen, CW Kuo, HP Hu, S Liu, MF Chen, JC Lu
US Patent 8,471,358, 2013
312013
Inductor with magnetic material
CW Luo, HT Yen, CW Kuo, MC Jeng
US Patent 9,041,152, 2015
272015
Structures of planar transformer and balanced-to-unbalanced transformer
HT Yen
US Patent 10,340,880, 2019
262019
Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps
HT Yen, YL Lin, CH Lee, CW Kuo, HH Chen, MC Jeng
US Patent 8,399,961, 2013
262013
TSV RF de-embedding method and modeling for 3DIC
HT Yen, Y Lin, C Hu, SB Jan, CC Hsieh, MF Chen, CW Kuo, HH Chen, ...
2012 SEMI Advanced Semiconductor Manufacturing Conference, 394-397, 2012
262012
Compact vertical inductors extending in vertical planes
HT Yen, C Huan-Neng, YL Lin, CW Kuo, MS Chen, HH Chen, MC Jeng
US Patent 9,559,053, 2017
242017
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