Helical spiral inductor between stacking die HT Yen, CW Luo, CW Kuo, MC Jeng US Patent 8,941,212, 2015 | 86 | 2015 |
3D transmission lines for semiconductors YL Lin, HT Yen, FW Kuo, HH Chen, CW Kuo US Patent 8,912,581, 2014 | 74 | 2014 |
Bond wire antenna HT Yen US Patent 9,362,613, 2016 | 68 | 2016 |
Methods and apparatus for inductors and transformers in packages HT Yen, YL Lin, CY Lu, CW Kuo, LIU Tzuan-Horng, HP Hu, MC Jeng US Patent 8,896,094, 2014 | 66 | 2014 |
Integrated antenna structure on separate semiconductor die HT Yen, YL Lin, CW Kuo, HH Chen, MC Jeng US Patent 8,754,818, 2014 | 61 | 2014 |
System and method for modeling through silicon via HT Yen, YL Lin, CW Kuo US Patent 9,633,149, 2017 | 59 | 2017 |
Methods and apparatus for transmission lines in packages YL Lin, HT Yen, CW Kuo, MC Jeng US Patent 9,171,798, 2015 | 52 | 2015 |
Transformer with bypass capacitor HT Yen, YL Lin, YT Lu, CW Kuo, HH Chen US Patent 8,552,812, 2013 | 47 | 2013 |
Integrated circuit ground shielding structure YL Lin, HT Yen, HH Chen, CP Jou US Patent 8,659,126, 2014 | 42 | 2014 |
Integrated circuits and methods of forming the same HT Yen, HP Hu, JC Lu, CW Kuo, MF Chen, S Liu US Patent 8,362,591, 2013 | 38 | 2013 |
A physical de-embedding method for silicon-based device applications HT Yen, TJ Yeh, S Liu PIERS online 5 (4), 301-305, 2009 | 36 | 2009 |
Integrated inductor structure and integrated transformer structure HT Yen, YS Jean, TH Yeh US Patent 10,153,078, 2018 | 35 | 2018 |
Structure and method for a transformer with magnetic features HT Yen, YL Lin, YT Lu, C Huan-Neng, HH Chen US Patent 8,610,247, 2013 | 34 | 2013 |
Through-substrate via waveguides HT Yen, HP Hu, CW Kuo, S Liu US Patent 8,502,338, 2013 | 32 | 2013 |
3D inductor and transformer HT Yen, CW Kuo, HP Hu, S Liu, MF Chen, JC Lu US Patent 8,471,358, 2013 | 31 | 2013 |
Inductor with magnetic material CW Luo, HT Yen, CW Kuo, MC Jeng US Patent 9,041,152, 2015 | 27 | 2015 |
Structures of planar transformer and balanced-to-unbalanced transformer HT Yen US Patent 10,340,880, 2019 | 26 | 2019 |
Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps HT Yen, YL Lin, CH Lee, CW Kuo, HH Chen, MC Jeng US Patent 8,399,961, 2013 | 26 | 2013 |
TSV RF de-embedding method and modeling for 3DIC HT Yen, Y Lin, C Hu, SB Jan, CC Hsieh, MF Chen, CW Kuo, HH Chen, ... 2012 SEMI Advanced Semiconductor Manufacturing Conference, 394-397, 2012 | 26 | 2012 |
Compact vertical inductors extending in vertical planes HT Yen, C Huan-Neng, YL Lin, CW Kuo, MS Chen, HH Chen, MC Jeng US Patent 9,559,053, 2017 | 24 | 2017 |