Artikelen met mandaten voor openbare toegang - Wanli Li (李 万里)Meer informatie
Nergens beschikbaar: 10
Large-scale and galvanic replacement free synthesis of Cu@ Ag core–shell nanowires for flexible electronics
B Zhang, W Li, J Jiu, Y Yang, J Jing, K Suganuma, CF Li
Inorganic Chemistry 58 (5), 3374-3381, 2019
Mandaten: US Department of Energy
Alloying and embedding of Cu-core/Ag-shell nanowires for ultrastable stretchable and transparent electrodes
B Zhang, W Li, M Nogi, C Chen, Y Yang, T Sugahara, H Koga, ...
ACS applied materials & interfaces 11 (20), 18540-18547, 2019
Mandaten: US Department of Energy
A tube-shaped solid–liquid-interfaced triboelectric–electromagnetic hybrid nanogenerator for efficient ocean wave energy harvesting
X Sun, C Shang, H Ma, C Li, L Xue, Q Xu, Z Wei, W Li, Y Yalikun, YC Lai, ...
Nano Energy 100, 107540, 2022
Mandaten: National Natural Science Foundation of China
Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics
B Zhang, W Li, Y Yang, C Chen, CF Li, K Suganuma
Journal of Materials Science 54 (8), 6381-6392, 2019
Mandaten: US Department of Energy
Highly conductive Ag paste for recoverable wiring and reliable bonding used in stretchable electronics
CF Li, W Li, H Zhang, J Jiu, Y Yang, L Li, Y Gao, ZQ Liu, K Suganuma
ACS Applied Materials & Interfaces 11 (3), 3231-3240, 2018
Mandaten: US Department of Energy
Electric-current-assisted sintering of nanosilver paste for copper bonding
Y Mei, L Li, X Li, W Li, H Yan, Y Xie
Journal of Materials Science: Materials in Electronics 28, 9155-9166, 2017
Mandaten: National Natural Science Foundation of China
Pressureless sinter-joining of micron-Ag flake pastes at 160° C enabled by solvent and interface engineering
W Li, Y Li, Y Wang, Y Liu, C Chen, J Zhang, H Yan
Journal of Materials Processing Technology 322, 118207, 2023
Mandaten: National Natural Science Foundation of China
Unraveling the Mechanism of Plasma‐Induced Curing of Particle‐Free Complex Inks for Manufacturing of High‐Performance Flexible Copper Films and Patterns
J Zhang, C Liang, P Rui, X Wu, Q Ge, X Hou, Q Sun, Y Wang, W Li
Advanced Materials Technologies 8 (15), 2300332, 2023
Mandaten: National Natural Science Foundation of China
Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks
W Li, Y Li, L Li, H Yan, T Minari
Applied Surface Science 646, 158967, 2024
Mandaten: National Natural Science Foundation of China
Enhancing properties of low-temperature pressureless Ag sinter-joining by optimizing solvents and hybrid particles
Y Li, Y Wang, H Yan, W Li, J Zhang
2023 24th International Conference on Electronic Packaging Technology (ICEPT …, 2023
Mandaten: National Natural Science Foundation of China
Ergens beschikbaar: 4
Reduced graphene oxide conformally wrapped silver nanowire networks for flexible transparent heating and electromagnetic interference shielding
Y Yang, S Chen, W Li, P Li, J Ma, B Li, X Zhao, Z Ju, H Chang, L Xiao, ...
Acs Nano 14 (7), 8754-8765, 2020
Mandaten: Chinese Academy of Sciences, National Natural Science Foundation of China
Highly Densified Cu Wirings Fabricated from Air‐Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility
W Li, Y Yang, B Zhang, CF Li, J Jiu, K Suganuma
Advanced Materials Interfaces 5 (19), 1800798, 2018
Mandaten: US Department of Energy
Supersaturated solid-solution interfaces of Cu core/Ag shell structures with enhanced thermal stability and oxidation resistance
W Li, F Lang, C Liang, K Tong, Y Yang, J Jiu, J Zhang, H Wang, ...
Corrosion Science 201, 110269, 2022
Mandaten: Japan Science and Technology Agency
Layer‐By‐Layer Printing Strategy for High‐Performance Flexible Electronic Devices with Low‐Temperature Catalyzed Solution‐Processed SiO2
Q Sun, T Gao, X Li, W Li, X Li, K Sakamoto, Y Wang, L Li, M Kanehara, ...
Small Methods 5 (8), 2100263, 2021
Mandaten: National Natural Science Foundation of China
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