Praveen Kumar

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Indranath DuttaWashington State UniversityVerifisert e-postadresse på wsu.edu
Vikram JayaramIndian Institute of ScienceVerifisert e-postadresse på iisc.ac.in
Terence G. LangdonProfessor, University of Southampton, and Professor Emeritus, University of Southern CaliforniaVerifisert e-postadresse på usc.edu
Rudra PratapVice-Chancellor, Plaksha University, Mohali, Punjab; Professor at CeNSE, IISc, BangaloreVerifisert e-postadresse på iisc.ac.in
Megumi KawasakiAssociate Professor, Materials Science & Sch. of Mech., Indu. & Manu. Eng. Oregon State UniversityVerifisert e-postadresse på oregonstate.edu
Aloke PaulProfessor, Department of Materials Engineering, Indian Institute of Science, BangaloreVerifisert e-postadresse på iisc.ac.in
michael kassnerChoong Hoon Cho Chair and Professor of Materials Science and Mechanical Engineering at USCVerifisert e-postadresse på usc.edu
Piyush JagtapIndian Institute of Technology, RoorkeeVerifisert e-postadresse på mt.iitr.ac.in
Santanu TalukderAssistant Professor at IISER BhopalVerifisert e-postadresse på iiserb.ac.in
Ganesh SubbarayanProfessor of Mechanical Engineering, Purdue UniversityVerifisert e-postadresse på purdue.edu
Varun A BahetiAssistant Professor, Metallurgical & Materials EngineeringVerifisert e-postadresse på mt.iitr.ac.in
Shobhit Pratap SinghFederal Institute for Materials Research and Testing (BAM), Berlin,GermanyVerifisert e-postadresse på bam.de
Dipali SonawaneMax-Planck-Institut für Eisenforschung,DüsseldorfVerifisert e-postadresse på mpie.de
SYED IDREES AFZAL JALALIAssistant Research Professor at John's Hopkins UniversityVerifisert e-postadresse på jh.edu
kamanio ChattopadhyayIndian Institute of ScienceVerifisert e-postadresse på iisc.ac.in
Somaiah Nalla, PhDIndian Institute of Science, BangaloreVerifisert e-postadresse på iisc.ac.in
Rishi RajUniversity of Colorado/Cornell UniversityVerifisert e-postadresse på colorado.edu
Devi Lal, PhDAssistant Professor, IIT JammuVerifisert e-postadresse på iitjammu.ac.in
Tarang MungoleHitachi High-Tech America and Washington State UniversityVerifisert e-postadresse på wsu.edu
Babak TalebanpourPhD, Washington State UniversityVerifisert e-postadresse på wsu.edu

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Praveen Kumar

Indian Institute of Science, Bangalore, India

Verifisert e-postadresse på iisc.ac.in - Startside

Materials Engineering


Tittel Sorter etter sitater Sorter etter år Sorter etter tittel	Sitert av Sitert av	År
Review: overcoming the paradox of strength and ductility in ultrafine-grained materials at low temperatures P Kumar, M Kawasaki, TG Langdon J Mater Sci 51 (1), 7-18, 2016	135	2016
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties I Dutta, P Kumar, G Subbarayan JOM Journal of the Minerals, Metals and Materials Society 61 (6), 29-38, 2009	125	2009
Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV) P Kumar, I Dutta, MS Bakir Journal of electronic materials 41 (2), 322-335, 2012	117	2012
Harper-Dorn creep ME Kassner, P Kumar, W Blum International journal of plasticity 23 (6), 980-1000, 2007	100	2007
Mechanical characteristics of a Zn–22% Al alloy processed to very high strains by ECAP P Kumar, C Xu, TG Langdon Materials Science and Engineering: A 429 (1-2), 324-328, 2006	81	2006
Nano‐and Micro‐Mechanical Properties of Ultrafine‐Grained Materials Processed by Severe Plastic Deformation Techniques M Kawasaki, B Ahn, P Kumar, J Jang, TG Langdon Advanced Engineering Materials, 2017	64	2017
Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011	64	2011
The significance of grain boundary sliding in the superplastic Zn–22% Al alloy after processing by ECAP P Kumar, C Xu, TG Langdon Materials Science and Engineering: A 410, 447-450, 2005	56	2005
Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias I Dutta, P Kumar, MS Bakir JOM Journal of the Minerals, Metals and Materials Society 63 (10), 70-77, 2011	52	2011
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions Z Huang, P Kumar, I Dutta, JHL Pang, R Sidhu, M Renavikar, R Mahajan Journal of Electronic Materials, 1-15, 2011	51	2011
Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Journal of Alloys and Compounds 727, 832-840, 2017	50	2017
Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Acta Materialia 131, 260-270, 2017	50	2017
Fifty years of Harper–Dorn creep: a viable creep mechanism or a Californian artifact? P Kumar, ME Kassner, TG Langdon Journal of materials science 42 (2), 409-420, 2007	50	2007
Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications I Dutta, R Raj, P Kumar, T Chen, CM Nagaraj, J Liu, M Renavikar, ... Journal of electronic materials 38 (12), 2735-2745, 2009	49	2009
The contribution of grain boundary sliding in tensile deformation of an ultrafine-grained aluminum alloy having high strength and high ductility T Mungole, P Kumar, M Kawasaki, TG Langdon Journal of Materials Science 50 (10), 3549-3561, 2015	46	2015
A critical examination of the paradox of strength and ductility in ultrafine-grained metals T Mungole, P Kumar, M Kawasaki, TG Langdon Journal of Materials Research 29 (21), 2534-2546, 2014	44	2014
Electric current induced flow of liquid metals: Mechanism and substrate-surface effects P Kumar, J Howarth, I Dutta Journal of Applied Physics 115, 044915, 2014	43	2014
Recrystallization and Ag₃Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys U Sahaym, B Talebanpour, S Seekins, I Dutta, P Kumar, P Borgesen IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013	41	2013
Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffraction P Jagtap, A Chakraborty, P Eisenlohr, P Kumar Acta Materialia 134, 346-359, 2017	40	2017
Wrinkling of atomic planes in ultrathin Au nanowires A Roy, S Kundu, K Müller, A Rosenauer, S Singh, P Pant, MP Gururajan, ... Nano letters 14 (8), 4859-4866, 2014	39	2014

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