Andreas C Fischer

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Frank NiklausProfessor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, SwedenVerifisert e-postadresse på kth.se
Göran StemmeProfessor, Micro and Nanosystems, KTH Royal Institute of Technology, SwedenVerifisert e-postadresse på ee.kth.se
Niclas RoxhedAssistant Professor, KTH Royal Institute of TechnologyVerifisert e-postadresse på ee.kth.se
Fredrik ForsbergKTH Royal Institute of TechnologyVerifisert e-postadresse på ee.kth.se
Anderson David SmithAssociate Professor, Chalmers University of TechnologyVerifisert e-postadresse på kth.se
Max C. LemmeProfessor, RWTH Aachen University, Germany, Director, AMO GmbHVerifisert e-postadresse på eld.rwth-aachen.de
Mikael ÖstlingKTH Royal Institute of TechnologyVerifisert e-postadresse på kth.se
Stephan SchröderSenseairVerifisert e-postadresse på senseair.com
Sam VaziriStanford UniversityVerifisert e-postadresse på stanford.edu
Anna DelinProfessor of Computational Nanomagnetism, KTH, StockholmVerifisert e-postadresse på kth.se
Mikael SternerPh.D. from KTH Royal Institute of TechnologyVerifisert e-postadresse på kth.se
Simon J. BleikerPhD Student in Micro and Nanosystmes, KTH Royal Institute of TechnologyVerifisert e-postadresse på kth.se
Alan PaussaVerifisert e-postadresse på uniud.it
tommy haraldssonCTO Mercene LabsVerifisert e-postadresse på kth.se
Kristinn B. GylfasonProfessor, Micro and Nanosystems, KTH Royal Institute of TechnologyVerifisert e-postadresse på kth.se
Lyubov BelovaProfessor, Royal Institute of TechnologyVerifisert e-postadresse på kth.se
B. Gunnar MalmProfessor in Integrated Devices and Circuits, KTH Royal Institute of TechnologyVerifisert e-postadresse på kth.se
Wouter van der WijngaartKTH Royal Institute of TechnologyVerifisert e-postadresse på kth.se
Mohammadreza KolahdouzUniversity of TehranVerifisert e-postadresse på ut.ac.ir
Miku J. LaaksoPhD student in KTH, School of Electrical Engineering and Computer Science, Micro and NanosystemVerifisert e-postadresse på kth.se

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Andreas C Fischer

Ph.D. from KTH Royal Institute of Technology in Stockholm, Sweden

Verifisert e-postadresse på ee.kth.se

MEMS 3D integration 3D packaging 2-photon polymerization Additive Manufacturing


Tittel Sorter etter sitater Sorter etter år Sorter etter tittel	Sitert av Sitert av	År
Handbook of silicon based MEMS materials and technologies M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Krockel, ... William Andrew, 2015	739*	2015
Electromechanical piezoresistive sensing in suspended graphene membranes AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ... Nano letters 13 (7), 3237-3242, 2013	450	2013
Integrating MEMS and ICs AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 2015	436*	2015
Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015	363	2015
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016	153	2016
Pressure sensors based on suspended graphene membranes AD Smith, S Vaziri, F Niklaus, AC Fischer, M Sterner, A Delin, M Östling, ... Solid-State Electronics 88, 89-94, 2013	105	2013
Graphene-based CO 2 sensing and its cross-sensitivity with humidity AD Smith, K Elgammal, X Fan, MC Lemme, A Delin, M Råsander, ... RSC advances 7 (36), 22329-22339, 2017	98	2017
Flexible and stretchable microneedle patches with integrated rigid stainless steel microneedles for transdermal biointerfacing M Rajabi, N Roxhed, RZ Shafagh, T Haraldson, AC Fischer, W Wijngaart, ... PloS one 11 (12), e0166330, 2016	92	2016
Unconventional applications of wire bonding create opportunities for microsystem integration AC Fischer, JG Korvink, N Roxhed, G Stemme, U Wallrabe, F Niklaus Journal of Micromechanics and Microengineering 23 (8), 083001, 2013	92	2013
High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires FN Simon J Bleiker, Andreas C Fischer, Umer Shah, Nutapong Somjit, Tommy ... Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015	63*	2015
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires AC Fischer, SJ Bleiker, T Haraldsson, N Roxhed, G Stemme, F Niklaus Journal of Micromechanics and Microengineering 22 (10), 105001, 2012	48	2012
CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration FN Fredrik Forsberg, Adriana Lapadatu, Gjermund Kittilsland, Stian Martinsen ... Selected Topics in Quantum Electronics, IEEE Journal of 21 (4), 1-11, 2015	42*	2015
3D Free‐Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching AC Fischer, LM Belova, YGM Rikers, BG Malm, HH Radamson, ... Advanced Functional Materials 22 (19), 4004-4008, 2012	41	2012
Chapter 26: Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS AC Fischer, M Mäntysalo, F Niklaus, M Tilli, T Motooka, VM Airaksinen, ... Handbook of Silicon Based MEMS Materials and Technologies (Second Edi􏰀on), 2015	37*	2015
Low-cost uncooled microbolometers for thermal imaging N Roxhed, F Niklaus, AC Fischer, F Forsberg, L Höglund, P Ericsson, ... Proc. SPIE, 772611, 2010	32	2010
Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires AC Fischer, N Roxhed, T Haraldsson, N Heinig, G Stemme, F Niklaus Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International …, 2011	27	2011
Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays F Forsberg, N Roxhed, AC Fischer, B Samel, P Ericsson, N Hoivik, ... Infrared physics & technology 60, 251-259, 2013	25	2013
Stress-Minimized Packaging of Inertial Sensors by Double-Sided Bond Wire Attachment SH Stephan Schroder, Frank Niklaus, Alexandra Nafari, Eskild R Westby ... Microelectromechanical Systems, Journal of 24 (4), 781-789, 2015	24*	2015
Wire-bonded through-silicon vias with low capacitive substrate coupling AC Fischer, M Grange, N Roxhed, R Weerasekera, D Pamunuwa, ... Journal of Micromechanics and Microengineering 21, 085035, 2011	22	2011
Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays P Ericsson, AC Fischer, F Forsberg, N Roxhed, B Samel, S Savage, ... SPIE Defense, Security, and Sensing, 801216-801216-10, 2011	21	2011

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