| Recent advances in nano-materials for packaging of electronic devices S Zhang, X Xu, T Lin, P He Journal of Materials Science: Materials in Electronics 30 (15), 13855–13868, 2019 | 158 | 2019 |
| Two-step separation of chitin from shrimp shells using citric acid and deep eutectic solvents with the assistance of microwave D Zhao, WC Huang, N Guo, S Zhang, C Xue, X Mao Polymers 11 (3), 409, 2019 | 126 | 2019 |
| Molecular level manipulation of charge density for solid-liquid TENG system by proton irradiation D Wang, XX Wang, ML Jin, P He, S Zhang Nano Energy 103, 107819, 2022 | 113 | 2022 |
| An ultrastable ionic chemiresistor skin with an intrinsically stretchable polymer electrolyte ML Jin, S Park, JS Kim, SH Kwon, S Zhang, MS Yoo, S Jang, HJ Koh, ... Advanced Materials 30 (20), 1706851, 2018 | 106 | 2018 |
| Corrosion behavior of Sn‑based lead‑free solder alloys: a review S Li, X Wang, Z Liu, Y Jiu, S Zhang, J Geng, X Chen, S Wu, P He, W Long Journal of Materials Science: Materials in Electronics, 2020 | 99 | 2020 |
| Effect of boron on the structural stability, mechanical properties, and electronic structures of γ′-Ni3Al in TLP joints of nickel-based single-crystal alloys Y Wu, J Chen, L Zhang, J Ji, Q Wang, S Zhang Materials Today Communications 31, 103375, 2022 | 88 | 2022 |
| The mixture of silver nanowires and nanosilver-coated copper micronflakes for electrically conductive adhesives to achieve high electrical conductivity with low percolation … Q Wang, S Zhang, G Liu, T Lin, P He Journal of Alloys and Compounds 820, 153184, 2020 | 88 | 2020 |
| Ultrathin nanofibrous membranes containing insulating microbeads for highly sensitive flexible pressure sensors T Jin, Y Pan, GJ Jeon, HI Yeom, S Zhang, KW Paik, SHK Park ACS applied materials & interfaces 12 (11), 13348-13359, 2020 | 88 | 2020 |
| Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake J Kim, J Kim, S Song, S Zhang, J Cha, K Kim, H Yoon, Y Jung, KW Paik, ... Carbon 113, 379-386, 2017 | 80 | 2017 |
| Challenges and recent prospectives of 3D heterogeneous integration S Zhang, Z Li, H Zhou, R Li, S Wang, KW Paik, P He E-Prime-Advances in Electrical Engineering, Electronics and Energy 2, 100052, 2022 | 76 | 2022 |
| Preparation and characterization of Sn-3.0 Ag-0.5 Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating S Zhang, S Zhang, H Zhou, KW Paik, T Ding, W Long, S Zhong, P He Materials Characterization 207, 113512, 2024 | 65 | 2024 |
| The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface S Wang, X Chen, K Luo, H Zhou, R Li, P He, KW Paik, S Zhang Journal of Materials Research and Technology 27, 5332-5339, 2023 | 65 | 2023 |
| Cu-Cu joining using citrate coated ultra-small nano-silver pastes S Zhang, Q Wang, T Lin, P Zhang, P He, KW Paik Journal of Manufacturing Processes 62, 546-554, 2021 | 64 | 2021 |
| Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review J Wang, J Chen, L Zhang, Z Zhang, Y Han, X Hu, H Lu, S Zhang Journal of Advanced Joining Processes 6, 100125, 2022 | 63 | 2022 |
| In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects J Liu, J Xu, KW Paik, P He, S Zhang Journal of Materials Science & Technology 169, 42-52, 2024 | 61 | 2024 |
| Eutectic high-entropy alloys and their applications in materials processing engineering: A review J Liu, Z Li, D Lin, Z Tang, X Song, P He, S Zhang, H Bian, W Fu, Y Song Journal of Materials Science & Technology, 2024 | 60 | 2024 |
| Equilibrium phase diagram design and structural optimization of SAC/Sn-Pb composite structure solder joint for preferable stress distribution S Xu, X Jing, P Zhu, H Jin, KW Paik, P He, S Zhang Materials Characterization 206, 113389, 2023 | 60 | 2023 |
| Highly mechanical and high-temperature properties of Cu–Cu joints using citrate-coated nanosized Ag paste in air Q Wang, S Zhang, T Lin, P Zhang, P He, KW Paik Progress in Natural Science: Materials International, 2021 | 60 | 2021 |
| Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties M Yang, SW Kim, S Zhang, DY Park, CW Lee, YH Ko, H Yang, Y Xiao, ... Journal of Materials Chemistry C 6 (27), 7207-7218, 2018 | 60 | 2018 |
| A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives S Zhang, X Qi, M Yang, Y Cao, T Lin, P He, KW Paik Journal of Materials Science: Materials in Electronics 30, 9171-9183, 2019 | 57 | 2019 |
Dr. MING LIANG JINKAISTZweryfikowany adres z kaist.ac.kr