340-GHz low-cost and high-gain on-chip higher order mode dielectric resonator antenna for THz applications CH Li, TY Chiu
IEEE Transactions on Terahertz Science and Technology 7 (3), 284-294, 2017
113 2017 A 340-GHz heterodyne receiver front end in 40-nm CMOS for THz biomedical imaging applications CH Li, CL Ko, MC Kuo, DC Chang
IEEE transactions on terahertz science and technology 6 (4), 625-636, 2016
73 2016 A 1.2-V 5.2-mW 20–30-GHz Wideband Receiver Front-End in 0.18-um CMOS CH Li, CN Kuo, MC Kuo
IEEE 60 (11), 3502-3512, 2012
70 * 2012 A compact 0.9-/2.6-GHz dual-band RF energy harvester using SiP technique CH Li, MC Yu, HJ Lin
IEEE Microwave and Wireless Components Letters 27 (7), 666-668, 2017
51 2017 A 210-GHz amplifier in 40-nm digital CMOS technology CL Ko, CH Li, CN Kuo, MC Kuo, DC Chang
IEEE transactions on microwave theory and techniques 61 (6), 2438-2446, 2013
46 2013 A 37.5-mW 8-dBm-EIRP 15.5 CH Li, TY Chao, CW Lai, WC Chen, CL Ko, CN Kuo, YT Cheng, MC Kuo, ...
IEEE Transactions on Microwave Theory and Techniques 63 (2), 470-480, 2015
38 2015 A 0.6-V 0.33-mW 5.5-GHz receiver front-end using resonator coupling technique CH Li, YL Liu, CN Kuo
IEEE transactions on microwave theory and techniques 59 (6), 1629-1638, 2011
33 2011 A 340 GHz triple-push oscillator with differential output in 40 nm CMOS CH Li, CL Ko, CN Kuo, MC Kuo, DC Chang
IEEE Microwave and Wireless Components Letters 24 (12), 863-865, 2014
32 2014 A flip-chip-assembled W-band receiver in 90-nm CMOS and IPD technologies CH Li, WT Hsieh, TY Chiu
IEEE Transactions on Microwave Theory and Techniques 67 (4), 1628-1639, 2019
27 2019 Single flip-chip packaged dielectric resonator antenna for CMOS terahertz antenna array gain enhancement CH Li, TY Chiu
IEEE Access 7, 7737-7746, 2019
26 2019 A low-cost DC-to-84-GHz broadband bondwire interconnect for SoP heterogeneous system integration CH Li, CL Ko, CN Kuo, MC Kuo, DC Chang
IEEE transactions on microwave theory and techniques 61 (12), 4345-4352, 2013
26 2013 Low-loss low-cost substrate-integrated waveguide and filter in GaAs IPD technology for terahertz applications TY Chiu, CH Li
IEEE Access 9, 86346-86357, 2021
21 2021 A 147 GHz fully differential D-band amplifier design in 65-nm CMOS CNK Chun-Hsing Li, Chih-Wei Lai
Asia-Pacific Microw. Conf. (APMC, 2013
21 2013 An interconnecting technology for RF MEMS heterogeneous chip integration TY Chao, CH Li, YC Chen, HY Chen, YT Cheng, CN Kuo
IEEE transactions on electron devices 57 (4), 928-938, 2010
19 2010 A balunless frequency multiplier with differential output by current flow manipulation CH Li, WM Wu
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (7 …, 2018
16 2018 Low-loss single-band, dual-band, and broadband mm-wave and (sub-) THz interconnects for THz SoP heterogeneous system integration CH Li, TY Chiu
IEEE transactions on terahertz science and technology 12 (2), 130-143, 2021
14 2021 A low-cost broadband bondwire interconnect for heterogeneous system integration CH Li, CL Ko, CN Kuo, MC Kuo, DC Chang
2013 IEEE MTT-S International Microwave Symposium Digest (MTT), 1-4, 2013
13 2013 A 340-GHz high-gain flip-chip packaged dielectric resonator antenna for THz imaging applications TY Chiu, C Wang, WT Hsieh, HJ Lin, TY Lin, R Liu, DC Chang, CH Li
2017 IEEE International Symposium on Radio-Frequency Integration Technology …, 2017
10 2017 Constant loss contours of matching networks for millimeter-wave LNA design CL Ko, CH Li, MC Kuo, DC Chang
IEEE Microwave and Wireless Components Letters 26 (11), 939-941, 2016
10 2016 Broadband connection structure and method CH Li, CN Kuo
US Patent 9,450,650, 2016
9 2016 