| Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials S Ki, J Shim, S Oh, E Koh, D Seo, S Ryu, J Kim, Y Nam International Journal of Heat and Mass Transfer 170, 121012, 2021 | 62 | 2021 |
| Performance analysis of gravity-driven oil–water separation using membranes with special wettability S Oh, S Ki, S Ryu, MC Shin, J Lee, C Lee, Y Nam Langmuir 35 (24), 7769-7782, 2019 | 40 | 2019 |
| An energy-efficient battery thermal management system incorporating a porous metal-based multiscale flow manifold S Ki, J Lee, S Kim, J Seong, J Shim, S Oh, S Cho, S Bang, D Seo, J Kim, ... Energy Conversion and Management 269, 116147, 2022 | 32 | 2022 |
| A bio-inspired, low pressure drop liquid cooling system for high-power IGBT modules for EV/HEV applications S Ki, J Lee, S Ryu, S Bang, K Kim, Y Nam International Journal of Thermal Sciences 161, 106708, 2021 | 27 | 2021 |
| Superhydrophilic catenoidal aluminum micropost evaporator wicks S Bang, S Ryu, S Ki, K Song, J Kim, J Kim, Y Nam International Journal of Heat and Mass Transfer 158, 120011, 2020 | 26 | 2020 |
| Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs) J Lee, S Ki, D Seo, J Kim, Y Nam Applied Thermal Engineering 173, 115230, 2020 | 25 | 2020 |
| Optimizing Energy-Efficient jet impingement cooling using an artificial neural network (ANN) surrogate model for high heat flux Semiconductors S Kim, S Ki, S Bang, S Han, J Seo, C Ahn, S Maeng, BJ Lee, Y Nam Applied Thermal Engineering 239, 122101, 2024 | 13 | 2024 |
| Sustainable Thermal Regulation of Electronics via Mitigated Supercooling of Porous Gallium‐Based Phase Change Materials S Ki, S Shin, S Cho, S Bang, D Choi, Y Nam Advanced Science 11 (23), 2310185, 2024 | 7 | 2024 |
| Enhanced capillary and heat transfer performance of asymmetric micropost wicks S Bang, J Kim, S Ryu, S Ki, YJ Heo, C Lee, Y Nam International Communications in Heat and Mass Transfer 146, 106935, 2023 | 6 | 2023 |
| Compact liquid cooling module incorporating metal foam and fin hybrid structures for high power IGBTs J Lee, S Ki, Y Nam 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 6 | 2019 |
| Rapid enhancement of thermal conductivity by incorporating oxide-free copper nanoparticle clusters for highly conductive liquid metal-based thermal interface materials S Ki, J Shim, S Oh, S Ryu, J Kim, Y Nam 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 601-606, 2021 | 3 | 2021 |
| Intermittent spray cooling on rationally-designed hierarchical surfaces for enhanced evaporative heat transfer performance J Shim, S Ki, D Seo, B Moon, S Bang, Y Nam International Communications in Heat and Mass Transfer 153, 107354, 2024 | 2 | 2024 |
| Artificial neural network (ANN)-based multi-objective optimization of the vapor chamber with liquid supply layer for high heat flux applications S Bang, S Kim, S Ki, J Seo, J Kim, BJ Lee, Y Nam International Communications in Heat and Mass Transfer 159, 108302, 2024 | 1 | 2024 |
| Compact liquid cooling system for high power IGBT modules in EV/HEV applications S Ki, J Lee, S Ryu, Y Nam International Heat Transfer Conference Digital Library, 2018 | 1 | 2018 |
| Thermal interface material, method of manufacturing the same, and semiconductor packages including the same S Ryu, S Ki, Y Nam, J Kim, B Lee, S Hwang US Patent App. 18/437,385, 2024 | | 2024 |
| Optimizing the vapor chamber with liquid supply layers for high heat flux applications using an ANN-based multi-objective genetic algorithm S Bang, S Kim, S Ki, J Seo, J Kim, BJ Lee, Y Nam 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| Porous Liquid Metal-Based Phase Change Materials For Sustainable Thermal Buffer S Ki, S Shin, S Cho, S Bang, H Lee, D Choi, Y Nam 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| Semiconductor package with a heat dissipation member J Lee, Y Nam, S Ki, J Kim, T Kim US Patent App. 18/512,640, 2024 | | 2024 |
| Thermal interface material and semiconductor packages including the same S Ryu, S Ki, Y Nam, J Kim, B Lee, S Hwang US Patent 11,935,812, 2024 | | 2024 |
| Oxide-Free Copper Nanoparticle Incorporated Gallium-Based Liquid Metal Alloy for High-Performance Thermal Interface Materials S Ki, Y Nam, J Shim, S Oh, S Ryu, J Kim 2021 Materials Research Society (MRS) Fall Meeting & Exhibit, 2021 | | 2021 |
Youngsuk NamAssociate Professor, Dept. of Mechanical Engineering at KAISTZweryfikowany adres z kaist.ac.kr
