| Blockchain inspired RFID-based information architecture for food supply chain S Mondal, KP Wijewardena, S Karuppuswami, N Kriti, D Kumar, P Chahal IEEE Internet of Things Journal 6 (3), 5803-5813, 2019 | 347 | 2019 |
| Analysis of the Nicolson-Ross-Weir method for characterizing the electromagnetic properties of engineered materials EJ Rothwell, JL Frasch, SM Ellison, P Chahal, RO Ouedraogo Progress In Electromagnetics Research 157, 31-47, 2016 | 209 | 2016 |
| A novel integrated decoupling capacitor for MCM-L technology P Chahal, RR Tummala, MG Allen, M Swaminathan IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 164 | 1998 |
| Selective fabrication of SiC/Si diodes by excimer laser under ambient conditions A Kaur, P Chahal, T Hogan IEEE Electron Device Letters 37 (2), 142-145, 2015 | 156 | 2015 |
| Terahertz characterization of dielectric substrates for component design and nondestructive evaluation of packages JA Hejase, PR Paladhi, PP Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 118 | 2011 |
| Printed diodes: Materials processing, fabrication, and applications Y Chu, C Qian, P Chahal, C Cao Advanced Science 6 (6), 1801653, 2019 | 100 | 2019 |
| Unified AC model for the resonant tunneling diode Q Liu, A Seabaugh, P Chahal, FJ Morris IEEE Transactions on electron devices 51 (5), 653-657, 2004 | 77 | 2004 |
| Demonstration of RF and microwave passive circuits through 3-D printing and selective metalization JA Byford, MIM Ghazali, S Karuppuswami, BL Wright, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (3 …, 2017 | 76 | 2017 |
| Zero bias resonant tunnel Schottky contact diode for wide-band direct detection P Chahal, F Morris, G Frazier IEEE electron device letters 26 (12), 894-896, 2005 | 68 | 2005 |
| Design of a split-ring resonator sensor for near-field microwave imaging S Mukherjee, X Shi, L Udpa, S Udpa, Y Deng, P Chahal IEEE Sensors Journal 18 (17), 7066-7076, 2018 | 67 | 2018 |
| 3-D printed air substrates for the design and fabrication of RF components MIM Ghazali, S Karuppuswami, A Kaur, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017 | 65 | 2017 |
| Affordable 3D printed microwave antennas MIM Ghazali, E Gutierrez, JC Myers, A Kaur, B Wright, P Chahal 2015 IEEE 65th electronic components and technology conference (ECTC), 240-246, 2015 | 63 | 2015 |
| Improvements and recent advances in nanocomposite capacitors using a colloidal technique V Agarwal, P Chahal, RR Tummala, MG Allen 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998 | 52 | 1998 |
| Metamaterial inspired periodic structure used for microfluidic sensing JA Byford, KY Park, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1997-2002, 2015 | 50 | 2015 |
| A chip-first microwave package using multimaterial aerosol jet printing MT Craton, X Konstantinou, JD Albrecht, P Chahal, J Papapolymerou IEEE Transactions on Microwave Theory and Techniques 68 (8), 3418-3427, 2020 | 48 | 2020 |
| RFID coupled passive digital ammonia sensor for quality control of packaged food S Karuppuswami, S Mondal, D Kumar, P Chahal IEEE Sensors Journal 20 (9), 4679-4687, 2020 | 47 | 2020 |
| A passive harmonic RFID tag and interrogator development S Mondal, P Chahal IEEE Journal of Radio Frequency Identification 3 (2), 98-107, 2019 | 42 | 2019 |
| A wireless RFID compatible sensor tag using gold nanoparticle markers for pathogen detection in the liquid food supply chain S Karuppuswami, LL Matta, EC Alocilja, P Chahal IEEE sensors letters 2 (2), 1-4, 2018 | 42 | 2018 |
| Affordable terahertz components using 3D printing A Kaur, JC Myers, MIM Ghazali, J Byford, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2071-2076, 2015 | 41 | 2015 |
| A multiple angle method for THz time-domain material characterization JA Hejase, EJ Rothwell, P Chahal IEEE Transactions on Terahertz Science and Technology 3 (5), 656-665, 2013 | 41 | 2013 |
Saranraj KaruppuswamiGlobal Technical Specialist RF/EMI/EMC, General MotorsZweryfikowany adres z msu.edu
