| Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review KS Siow, L Britcher, S Kumar, HJ Griesser Plasma processes and polymers 3 (6‐7), 392-418, 2006 | 1166 | 2006 |
| Mechanical properties of nano-silver joints as die attach materials KS Siow Journal of alloys and compounds 514, 6-19, 2012 | 452 | 2012 |
| Are sintered silver joints ready for use as interconnect material in microelectronic packaging? KS Siow Journal of electronic materials 43 (4), 947-961, 2014 | 362 | 2014 |
| Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C ST Chua, KS Siow Journal of Alloys and Compounds 687, 486-498, 2016 | 194 | 2016 |
| Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints TF Chen, KS Siow Journal of Alloys and Compounds 866, 158783, 2021 | 179 | 2021 |
| Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study KS Siow, YT Lin Journal of Electronic Packaging 138 (2), 020804, 2016 | 178 | 2016 |
| XPS study of sulfur and phosphorus compounds with different oxidation states KS Siow, L Britcher, S Kumar, HJ Griesser Sains Malaysiana 47 (8), 1913-1922, 2018 | 166 | 2018 |
| Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability KS Siow Springer, 2019 | 86* | 2019 |
| Mechanical properties of nanocrystalline copper and nickel KS Siow, AAO Tay, P Oruganti Materials science and technology 20 (3), 285-294, 2004 | 86 | 2004 |
| Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review KS Siow, S Kumar, HJ Griesser Plasma Processes and Polymers 12 (1), 8-24, 2015 | 75 | 2015 |
| Sulfonated surfaces by sulfur dioxide plasma surface treatment of plasma polymer films KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 6 (9), 583-592, 2009 | 65 | 2009 |
| Plasma polymerized carvone as an antibacterial and biocompatible coating YW Chan, KS Siow, PY Ng, U Gires, BY Majlis Materials Science and Engineering: C 68, 861-871, 2016 | 63 | 2016 |
| Deposition and XPS and FTIR analysis of plasma polymer coatings containing phosphorus KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 11 (2), 133-141, 2014 | 59 | 2014 |
| Pitting corrosion of duplex stainless steels KS Siow, TY Song, JH Qiu Anti-Corrosion Methods and Materials 48 (1), 31-37, 2001 | 54 | 2001 |
| QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups KS Siow, L Britcher, S Kumar, HJ Griesser Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019 | 51 | 2019 |
| Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu Journal of Materials Processing Technology 255, 644-649, 2018 | 48 | 2018 |
| Unveiling the damage evolution of SAC305 during fatigue by entropy generation X Long, Y Guo, Y Su, KS Siow, C Chen International Journal of Mechanical Sciences 244, 108087, 2023 | 43 | 2023 |
| Public benefit and risk perceptions of nanotechnology development: Psychological and sociological aspects NA Kamarulzaman, KE Lee, KS Siow, M Mokhtar Technology in Society 62, 101329, 2020 | 42 | 2020 |
| Electrical conductivity of porous silver made from sintered nanoparticles AS Zuruzi, KS Siow Electronic Materials Letters 11 (2), 308-314, 2015 | 39 | 2015 |
| Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material KS Siow, ST Chua JOM 71 (9), 3066-3075, 2019 | 34 | 2019 |
