| Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering M Yang, H Ji, S Wang, YH Ko, CW Lee, J Wu, M Li Journal of Alloys and Compounds 679, 18-25, 2016 | 112 | 2016 |
| Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds M Yang, Y Cao, S Joo, H Chen, X Ma, M Li Journal of Alloys and Compounds 582, 688-695, 2014 | 73 | 2014 |
| Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints M Yang, M Li, L Wang, Y Fu, J Kim, L Weng Journal of electronic materials 40, 176-188, 2011 | 68 | 2011 |
| Ultrasonic assisted squeeze casting of a wrought aluminum alloy G Chen, M Yang, Y Jin, H Zhang, F Han, Q Chen, Z Zhao Journal of Materials Processing Technology 266, 19-25, 2019 | 66 | 2019 |
| Interfacial reactions of eutectic Sn3. 5Ag and pure tin solders with Cu substrates during liquid-state soldering M Yang, M Li, C Wang Intermetallics 25, 86-94, 2012 | 66 | 2012 |
| Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties M Yang, SW Kim, S Zhang, DY Park, CW Lee, YH Ko, H Yang, Y Xiao, ... Journal of Materials Chemistry C 6 (27), 7207-7218, 2018 | 59 | 2018 |
| A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives S Zhang, X Qi, M Yang, Y Cao, T Lin, P He, KW Paik Journal of Materials Science: Materials in Electronics 30, 9171-9183, 2019 | 57 | 2019 |
| Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate M Yang, YH Ko, J Bang, TS Kim, CW Lee, M Li Materials Characterization 124, 250-259, 2017 | 48 | 2017 |
| Growth behavior of Cu6Sn5 grains formed at an Sn3. 5Ag/Cu interface M Yang, M Li, L Wang, Y Fu, J Kim, L Weng Materials Letters 65 (10), 1506-1509, 2011 | 44 | 2011 |
| Effect of grain orientation on mechanical properties and thermomechanical response of Sn-based solder interconnects H Chen, B Yan, M Yang, X Ma, M Li Materials Characterization 85, 64-72, 2013 | 41 | 2013 |
| Textured growth of Cu6Sn5 grains formed at a Sn3. 5Ag/Cu interface M Li, M Yang, J Kim Materials Letters 66 (1), 135-137, 2012 | 37 | 2012 |
| Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates M Yang, YH Ko, J Bang, TS Kim, CW Lee, S Zhang, M Li Journal of Alloys and Compounds 701, 533-541, 2017 | 36 | 2017 |
| A study on the optimization of anisotropic conductive films for Sn-3Ag-0.5 Cu-Based flex-on-board application at a 250 C bonding temperature S Zhang, M Yang, Y Wu, J Du, T Lin, P He, M Huang, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (3 …, 2018 | 35 | 2018 |
| Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging M Yang, M Li, J Kim Intermetallics 31, 177-185, 2012 | 34 | 2012 |
| Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method M Yang, S Yang, H Ji, YH Ko, CW Lee, J Wu, M Li Journal of Materials Processing Technology 236, 84-92, 2016 | 22 | 2016 |
| The effect of NaOH on room-temperature sintering of Ag nanoparticles for high-performance flexible electronic application Y Xiao, ZH Zhang, M Yang, HF Yang, MY Li, Y Cao Materials Letters 222, 16-20, 2018 | 21 | 2018 |
| Solid-state interfacial reaction of eutectic Sn3. 5Ag and pure tin solders with polycrystalline Cu substrate M Yang, H Chen, X Ma, M Li, Y Cao, J Kim Journal of Materials Science 49, 3652-3664, 2014 | 17 | 2014 |
| Mechanism of solder joint cracks in anisotropic conductive films bonding and solutions: Delaying hot-bar lift-up time and adding silica fillers S Zhang, M Yang, M Jin, WC Huang, T Lin, P He, P Lin, KW Paik Metals 8 (1), 42, 2018 | 16 | 2018 |
| Improvement in thermomechanical reliability of low cost Sn-based BGA interconnects by Cr addition J Bang, DY Yu, M Yang, YH Ko, JW Yoon, H Nishikawa, CW Lee Metals 8 (8), 586, 2018 | 11 | 2018 |
| Rapid formation of Cu–Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste B Hu, F Yang, Y Peng, H Ji, S Yang, M Yang, M Li Journal of Materials Science: Materials in Electronics 30, 8071-8079, 2019 | 8 | 2019 |
Yong-Ho KoKorea Institute of Industrial Technology (KITECH)Zweryfikowany adres z kitech.re.kr