| Fabrication process for on-board geometries using a polymer composite-based selective metallization for next-generation electronics packaging S Acharya, SS Chouhan, J Delsing Processes 9 (9), 1634, 2021 | 10 | 2021 |
| An Additive Production approach for Microvias and Multilayered polymer substrate patterning of 2.5 μm feature sizes S Acharya, SS Chouhan, J Delsing 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1304-1308, 2020 | 9 | 2020 |
| Interoperability levels and challenges of digital twins in cyber-physical systems S Acharya, AA Khan, T Päivärinta Journal of Industrial Information Integration, 100714, 2024 | 7 | 2024 |
| Realization of Embedded Passives using an additive Covalent bonded metallization approach S Acharya, SS Chouhan, J Delsing 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 6 | 2019 |
| Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process S Acharya, SS Chouhan, J Delsing Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (NOR …, 2019 | 6 | 2019 |
| Twins Interoperability through Service Oriented Architecture: A use-case of Industry 4.0. S Acharya, O Wintercorn, A Tripathy, M Hanif, J Van Deventer, ... 40th Annual Symposium for Computer Science, TKTP-2023 3506 (ISSN 1613-0073 …, 2023 | 3 | 2023 |
| Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method) S Acharya, S Sattar, SS Chouhan, J Delsing Processes 10 (4), 636, 2022 | 3 | 2022 |
| A Fully Additive Fabrication Approach for sub-10-Micrometer Microvia Suitable for 3-D System-in-Package Integration R Imani, S Chouhan, J Putaala, O Nousiainen, J Hagberg, S Myllymäki, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1926-1931, 2023 | 2 | 2023 |
| A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards R Imani, S Acharya, J Putaala, S Chouhan, J Hagberg, S Myllymäki, ... IPC APEX EXPO 2023 Technical Conference Proceedings, 2023 | 2 | 2023 |
| A Fully Additive Approach for the Fabrication of Split-Ring Resonator Metasurfaces R Imani, S Chouhan, J Delsing, S Acharya 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1834-1840, 2022 | 2 | 2022 |
| Analyzing design parameters of nano-magnetic technology based converter circuit BK Bhoi, NK Misa, SS Chouhan, S Acharya VLSI Design and Test: 23rd International Symposium, VDAT 2019, Indore, India …, 2019 | 2 | 2019 |
| Advanced fuzzy logic model for volume based traffic signal control BK Bhoi, A Panda, S Acharya Journal of Embedded Systems, Science and Education publishing 1 (1), 1-6, 2013 | 2 | 2013 |
| Visualisation, representation and interoperation of digital twins with open-source software frameworks M Kelanti, H Bomström, S Acharya, O Wintercorn, J van Deventer, ... Automation Days, 2023 | 1 | 2023 |
| Interoperability Challenges and Opportunities in Vehicle-in-the-loop Testings: Insights from NUVE Lab's Hybrid Setup S Acharya, A Tripathy, J Alatalo, P Seppänen, A Lamponen, J Säkkinen, ... Scandinavian Simulation Society, 339-347, 2025 | | 2025 |
| Digital Twin-based Condition Monitoring with Distributed Data Mapping of OPC UA and ISO 10303 STEP Standard A Tripathy, R Chevuri, T Tran, S Acharya, J Deventer, C Paniagua, ... Proceedings of the 4th Eclipse Security, AI, Architecture and Modelling …, 2024 | | 2024 |
| Software-Defined Vehicle Support and Coordination Project E Peltonen, V Basnayake, O Timonen, H Hietala, Y Xu, S Acharya, ... | | 2024 |
| Vehicle-in-the-Loop: Towards Vehicle-Integrated Interoperable Testing Platform P Ella, A Sarthak, B Henri, K Markus, L Toni, S Jukka, P Tero Markku’s software, systems and services: professor Markku Oivo’s celebration …, 2024 | | 2024 |
| An SBU fully additive production approach for Board-level Electronics Packaging (SBU-CBM Method) S Acharya Luleå University of Technology, 2021 | | 2021 |
| A novel micro-electronic strain device fabrication and 2D materials characterization S Acharya Department of Metallurgy Engineering and Materials Science, IIT Indore, 2017 | | 2017 |
| DEVELOPMENT OF PRAGMATIC RESEARCH ARTIFACTS ON DIGITAL TWIN TECHNOLOGY USING DSR THEORIES S Acharya, M Hanif, T Päivärinta | | |
Jerker DelsingProfessor Luleå University of Technology, EISLABAdresă de e-mail confirmată pe ltu.se