Cemal Basaran

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	Toate	Din 2020
Referințe bibliografice	6610	2126
h-index	46	25
i10-index	137	71

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Tarek RagabAssociate Professor, Arkansas State UniversityAdresă de e-mail confirmată pe astate.edu
Douglas C HopkinsProfessor of Electrical and Computer EngineeringAdresă de e-mail confirmată pe NCSU.EDU
Alexander N. CartwrightPresident, University of Central FloridaAdresă de e-mail confirmată pe ucf.edu
JUAN GOMEZProfessor-Universidad EAFITAdresă de e-mail confirmată pe eafit.edu.co
Shidong LiIBM, University at Buffalo, Tongji UniversityAdresă de e-mail confirmată pe us.ibm.com
Wei YaoSemiconductorAdresă de e-mail confirmată pe buffalo.edu
Yanbiao ChuIntel CorporationAdresă de e-mail confirmată pe intel.com
Hsiao Wei LeeDrexel UniversityAdresă de e-mail confirmată pe drexel.edu
Weixiang zhangAdresă de e-mail confirmată pe buffalo.edu
Andrew J. SchultzChemical and Biological Engineering, University at BuffaloAdresă de e-mail confirmată pe buffalo.edu
David KofkeDistinguished Professor of Chemical & Biological Engineering, University at Buffalo, SUNYAdresă de e-mail confirmată pe buffalo.edu
Michael S SellersChief Technologist, Booz Allen HamiltonAdresă de e-mail confirmată pe buffalo.edu
Bicheng ChenCPNETAdresă de e-mail confirmată pe cpnet.io
Tribikram KunduProfessor of Civil Engineering & Engineering Mechanics, Aerospace & Mechanical Engineering, University of Arizona Adresă de e-mail confirmată pe email.arizona.edu
Chandrakant DesaiRegents' Profesoor (emeritus), Univ. of ArizonaAdresă de e-mail confirmată pe email.arizona.edu
Noushad Bin Jamal M, PhDDanmarks Tekniske UniversitetAdresă de e-mail confirmată pe dtu.dk
Adam LipskiBydgoszcz University of Science and TechnologyAdresă de e-mail confirmată pe pbs.edu.pl
Halina EgnerProfessor of MechanicsAdresă de e-mail confirmată pe pk.edu.pl
Hamidreza FakhriPhD, PE, Bechtel Corporation; University at BuffaloAdresă de e-mail confirmată pe buffalo.edu
Ravi Ranade, PhD, PEAssociate Professor, University at Buffalo, State University of New YorkAdresă de e-mail confirmată pe buffalo.edu

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Cemal Basaran

Professor of Civil Engineering

Adresă de e-mail confirmată pe buffalo.edu - Pagina de pornire

Unified Mechanics Theory


Titlu Sortați după descrierea bibliografică Sortați după an Sortați după titlu	Citat de Citat de	Anul
Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing H Ye, C Basaran, D Hopkins Applied Physics Letters 82 (7), 1045-1047, 2003	311	2003
A thermodynamic framework for damage mechanics of solder joints C Basaran, CY Yan	261	1998
An irreversible thermodynamics theory for damage mechanics of solids C Basaran, S Nie International Journal of Damage Mechanics 13 (3), 205-223, 2004	258	2004
Failure modes and FEM analysis of power electronic packaging H Ye, M Lin, C Basaran Finite Elements in Analysis and Design 38 (7), 601-612, 2002	226	2002
Moiré interferogram phase extraction: a ridge detection algorithm for continuous wavelet transforms H Liu, AN Cartwright, C Basaran Applied optics 43 (4), 850-857, 2004	161	2004
A thermodynamic model for electrical current induced damage C Basaran, M Lin, H Ye International Journal of Solids and Structures 40 (26), 7315-7327, 2003	139	2003
A micromechanical model for effective elastic properties of particulate composites with imperfect interfacial bonds S Nie, C Basaran International Journal of Solids and Structures 42 (14), 4179-4191, 2005	126	2005
Thermomechanical behavior of micron scale solder joints under dynamic loads Y Zhao, C Basaran, A Cartwright, T Dishongh Mechanics of Materials 32 (3), 161-173, 2000	108	2000
Damage mechanics of electromigration induced failure C Basaran, M Lin Mechanics of Materials 40 (1-2), 66-79, 2008	96	2008
A damage mechanics-based fatigue life prediction model for solder joints H Tang, C Basaran J. Electron. Packag. 125 (1), 120-125, 2003	96	2003
Joule heating in single-walled carbon nanotubes T Ragab, C Basaran Journal of Applied Physics 106 (6), 2009	94	2009
An analytical model for thermal stress analysis of multi-layered microelectronic packaging Y Wen, C Basaran Mechanics of Materials 36 (4), 369-385, 2004	92	2004
Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations C Basaran, R Chandaroy Applied Mathematical Modelling 22 (8), 601-627, 1998	90	1998
The size effect in mechanical properties of finite-sized graphene nanoribbon Y Chu, T Ragab, C Basaran Computational Materials Science 81, 269-274, 2014	88	2014
Measuring intrinsic elastic modulus of Pb/Sn solder alloys C Basaran, J Jiang Mechanics of Materials 34 (6), 349-362, 2002	86	2002
Thermomechanical analysis of solder joints under thermal and vibrational loading C Basaran, R Chandaroy J. Electron. Packag. 124 (1), 60-66, 2002	84	2002
A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects J Gomez, C Basaran International Journal of Solids and Structures 42 (13), 3744-3772, 2005	80	2005
Damage mechanics of microelectronics solder joints under high current densities H Ye, C Basaran, DC Hopkins, D Frear, JK Lin 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004	79	2004
Implementation of a thermodynamic framework for damage mechanics of solder interconnects in microelectronics packaging C Basaran, H Tang International Journal of Damage Mechanics 11 (1), 87-108, 2002	78	2002
Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept: Part 1—Theory and formulation C Basaran, CS Desai, T Kundu	77*	1998

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