| Hygrothermal aging effects on buried molecular structures at epoxy interfaces JN Myers, C Zhang, KW Lee, J Williamson, Z Chen Langmuir 30 (1), 165-171, 2014 | 43 | 2014 |
| Fluidic cooling systems and methods for electronic components EG Colgan, FL Pompeo, GG Daves, HT Toy, BK Furman, DL Edwards, ... US Patent 7,079,393, 2006 | 42 | 2006 |
| Plasma treatment effect on polymer buried interfacial structure and property NW Ulrich, J Andre, J Williamson, KW Lee, Z Chen Physical Chemistry Chemical Physics 19 (19), 12144-12155, 2017 | 28 | 2017 |
| Nondestructive characterization of molecular structures at buried copper/epoxy interfaces and their relationship to locus of failure analysis JN Myers, X Zhang, Y Xiu, Y Wei, JM Williamson, KW Lee, Z Chen IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 19 | 2015 |
| The Degradation Mechanisms of Underfills Subjected to High Temperature Long Term Aging P Lall, Y Zhang, J Suhling, J Williamson 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 18 | 2020 |
| Evaluation of the quality of BGA solder balls in FCBGA packages subjected to thermal cycling reliability test using laser ultrasonic inspection technique VVB Reddy, IC Ume, J Williamson, SK Sitaraman IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 15 | 2021 |
| Degradation mechanisms of epoxy molding compound subjected to high temperature long term aging P Lall, Y Zhang, J Williamson 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 14 | 2021 |
| Effect of High Temperature Long Term Aging on Stress-Strain Behavior of Underfills P Lall, Y Zhang, JC Suhling, JM Williamson TECHCON 2020, 2020 | 12 | 2020 |
| Modeling of effect of underfill properties on flip chip bumps and solder balls of FCBGA package in automotive underhood applications P Lall, M Kasturi, J Suhling, J Williamson 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 11 | 2021 |
| Distinct molecular structures of edge and middle positions of plasma treated covered polymer film surfaces relevant in the microelectronics industry NW Ulrich, X Li, JN Myers, J Williamson, X Lu, Z Chen IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017 | 10 | 2017 |
| Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging P Lall, Y Zhang, H Wu, J Suhling, E Davis, J Williamson International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | 9 | 2021 |
| Probing molecular structures of buried interfaces in thick multilayered microelectronic packages NW Ulrich, M Xiao, X Zou, J Williamson, Z Chen IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (7 …, 2018 | 8 | 2018 |
| Thermal cycling reliability of lead free solder joints on multi-terminal passive components GT Ostrowicki, J Williamson, V Gupta, SP Gurrum 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 127-134, 2015 | 8 | 2015 |
| Correlation studies between laser ultrasonic inspection data and finite-element modeling results in evaluation of solder joint quality in microelectronic packages VVB Reddy, S Gupta, J Williamson, SK Sitaraman Journal of Electronic Packaging 144 (1), 011009, 2022 | 7 | 2022 |
| Semiconductor substrate having stress-absorbing surface layer JM Williamson, N Shahidi, JC Arroyo US Patent 9,673,065, 2017 | 6 | 2017 |
| Integrated circuit package and method of manufacture JM Williamson, N Shahidi, Y Pang US Patent 9,281,269, 2016 | 6 | 2016 |
| Non-hermetic encapsulant removal for module rework P Coico, J Covell, B Peterson, F Pompeo, D Sylvester, TL Tai, ... US Patent App. 10/605,431, 2005 | 6 | 2005 |
| Improve interconnect reliability of BGA substrate with stacked vias by reducing carbon inclusion in the interface between via and land pad K Zeng, J Williamson 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 150-156, 2018 | 5 | 2018 |
| Variation in build-up substrate layer thicknesses and its impact on FCBGA BLR performance J Williamson Solid State Technology 58 (8), 12-14, 2015 | 5 | 2015 |
| Effect of thermal aging on the interface fracture toughness of the pcb-uf interface P Lall, P Choudhury, J Williamson 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 4 | 2021 |
