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Sadasivan Shankar
Sadasivan Shankar
Alte numeSadasivan (Sadas) Shankar, S. Shankar, Sadas Shankar
Adresă de e-mail confirmată pe stanford.edu - Pagina de pornire
Titlu
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Anul
Die stacking (3D) microarchitecture
B Black, M Annavaram, N Brekelbaum, J DeVale, L Jiang, GH Loh, ...
2006 39th Annual IEEE/ACM International Symposium on Microarchitecture …, 2006
8062006
Microelectronic packaging
M Datta, T Osaka, JW Schultze
CRC press, 2004
1202004
Physical bioenergetics: Energy fluxes, budgets, and constraints in cells
X Yang, M Heinemann, J Howard, G Huber, S Iyer-Biswas, G Le Treut, ...
Proceedings of the National Academy of Sciences 118 (26), e2026786118, 2021
1112021
The ultimate CMOS device and beyond
KJ Kuhn, U Avci, A Cappellani, MD Giles, M Haverty, S Kim, R Kotlyar, ...
2012 International Electron Devices Meeting, 8.1. 1-8.1. 4, 2012
962012
Phase stability in nanoscale material systems: extension from bulk phase diagrams
S Bajaj, MG Haverty, R Arróyave, S Shankar
Nanoscale 7 (21), 9868-9877, 2015
932015
Three-dimensional wafer-scale copper chemical–mechanical planarization model
DG Thakurta, DW Schwendeman, RJ Gutmann, S Shankar, L Jiang, ...
Thin solid films 414 (1), 78-90, 2002
742002
Simulation of grain boundary effects on electronic transport in metals, and detailed causes of scattering
B Feldman, S Park, M Haverty, S Shankar, ST Dunham
physica status solidi (b) 247 (7), 1791-1796, 2010
672010
A finite element model of electromigration induced void nucleation, growth and evolution in interconnects
AF Bower, S Shankar
Modelling and Simulation in Materials Science and Engineering 15 (8), 923, 2007
522007
Nanowire structures having wrap-around contacts
SM Cea, CE Weber, PH Keys, S Kim, MG Haverty, S Shankar
US Patent 10,483,385, 2019
512019
Neuromorphic intermediate representation: A unified instruction set for interoperable brain-inspired computing
JE Pedersen, S Abreu, M Jobst, G Lenz, V Fra, FC Bauer, DR Muir, ...
Nature Communications 15 (1), 8122, 2024
322024
Band offsets and dielectric properties of the amorphous Si3N4/Si (100) interface: A first-principles study
T Anh Pham, T Li, HV Nguyen, S Shankar, F Gygi, G Galli
Applied Physics Letters 102 (24), 2013
312013
First-principles investigations of the dielectric properties of crystalline and amorphous Si3N4 thin films
TA Pham, T Li, S Shankar, F Gygi, G Galli
Applied Physics Letters 96 (6), 2010
312010
Numerical simulations and experimental measurements of stress relaxation by interface diffusion in a patterned copper interconnect structure
N Singh, AF Bower, D Gan, S Yoon, PS Ho, J Leu, S Shankar
Journal of applied physics 97 (1), 2005
292005
Characterization and control of Cu electroplating chemistries for on-chip metallization
VM Dubin, RR Brewer, H Simka, S Shankar
Future FAB Intl 13, 244-251, 2002
282002
A FEM/VOF hybrid formulation for underfill encapsulation modeling
D Pantuso, L Jiang, S Shankar, S Skokov
Computers & structures 81 (8-11), 879-885, 2003
272003
Trends in energy estimates for computing in ai/machine learning accelerators, supercomputers, and compute-intensive applications
S Shankar, A Reuther
2022 IEEE High Performance Extreme Computing Conference (HPEC), 1-8, 2022
242022
A three-dimensional model of electromigration and stress induced void nucleation in interconnect structures
N Singh, AF Bower, S Shankar
Modelling and Simulation in Materials Science and Engineering 18 (6), 065006, 2010
232010
Microscopic modeling of the dielectric properties of silicon nitride
TA Pham, T Li, S Shankar, F Gygi, G Galli
Physical Review B—Condensed Matter and Materials Physics 84 (4), 045308, 2011
222011
Density functional theory and beyond—opportunities for quantum methods in materialsmodeling semiconductor technology
S Shankar, H Simka, M Haverty
Journal of Physics: Condensed Matter 20 (6), 064232, 2008
212008
Minimization of microelectronic interconnect thickness variations
L Jiang, S Shankar
US Patent 6,883,153, 2005
212005
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