| Toward clean and crackless transfer of graphene X Liang, BA Sperling, I Calizo, G Cheng, CA Hacker, Q Zhang, Y Obeng, ... ACS nano 5 (11), 9144-9153, 2011 | 1050 | 2011 |
| Metrology for the next generation of semiconductor devices NG Orji, M Badaroglu, BM Barnes, C Beitia, BD Bunday, U Celano, ... Nature electronics 1 (10), 532-547, 2018 | 439 | 2018 |
| Electrochemistry and Langmuir trough studies of fullerene C60 and C70 films C Jehoulet, YS Obeng, YT Kim, F Zhou, AJ Bard Journal of the American Chemical Society 114 (11), 4237-4247, 1992 | 351 | 1992 |
| Langmuir films of C60 at the air-water interface YS Obeng, AJ Bard Journal of the American Chemical Society 113 (16), 6279-6280, 1991 | 253 | 1991 |
| Electrogenerated chemiluminescence. 53. Electrochemistry and emission from adsorbed monolayers of a tris (bipyridyl) ruthenium (II)-based surfactant on gold and tin oxide … YS Obeng, AJ Bard Langmuir 7 (1), 195-201, 1991 | 230 | 1991 |
| Nanoporous ultralow dielectric constant organosilicates templated by triblock copolymers S Yang, PA Mirau, CS Pai, O Nalamasu, E Reichmanis, JC Pai, YS Obeng, ... Chemistry of materials 14 (1), 369-374, 2002 | 174 | 2002 |
| Influence of Metal–MoS2 Interface on MoS2 Transistor Performance: Comparison of Ag and Ti Contacts H Yuan, G Cheng, L You, H Li, H Zhu, W Li, JJ Kopanski, YS Obeng, ... ACS applied materials & interfaces 7 (2), 1180-1187, 2015 | 131 | 2015 |
| Chemical mechanical planarization of copper: role of oxidants and inhibitors S Deshpande, SC Kuiry, M Klimov, Y Obeng, S Seal Journal of The Electrochemical Society 151 (11), G788, 2004 | 112 | 2004 |
| Passivated copper surfaces YS Obeng, JS Obeng US Patent 6,323,131, 2001 | 109 | 2001 |
| A detailed failure analysis examination of the effect of thermal cycling on Cu TSV reliability C Okoro, JW Lau, F Golshany, K Hummler, YS Obeng IEEE Transactions on Electron Devices 61 (1), 15-22, 2013 | 105 | 2013 |
| Langmuir-Blodgett and electrochemical studies of fullerene films LOS Bulhoes, YS Obeng, AJ Bard Chemistry of materials 5 (1), 110-114, 1993 | 99 | 1993 |
| Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces H Lu, B Fookes, Y Obeng, S Machinski, KA Richardson Materials Characterization 49 (1), 35-44, 2002 | 97 | 2002 |
| Applicability of dynamic mechanical analysis for CMP polyurethane pad studies H Lu, Y Obeng, KA Richardson Materials Characterization 49 (2), 177-186, 2002 | 83 | 2002 |
| Graphene: Is it the future for semiconductors? An overview of the material, devices, and applications Y Obeng, P Srinivasan The Electrochemical Society Interface 20 (1), 47, 2011 | 70 | 2011 |
| Method of polishing YS Obeng US Patent 5,735,963, 1998 | 69 | 1998 |
| Apparatus and method for continuous delivery and conditioning of a polishing slurry YS Obeng, LD Schultz US Patent 6,048,256, 2000 | 68 | 2000 |
| Self-assembled monolayers of parent and derivatized [n] staffane-3, 3 (n-1)-dithiols on polycrystalline gold electrodes YS Obeng, ME Laing, AC Friedli, HC Yang, D Wang, EW Thulstrup, ... Journal of the American Chemical Society 114 (25), 9943-9952, 1992 | 67 | 1992 |
| Integrated circuit manufacturing YS Obeng US Patent 5,417,802, 1995 | 65 | 1995 |
| Nondestructive measurement of the residual stresses in copper through-silicon vias using synchrotron-based microbeam X-ray diffraction C Okoro, LE Levine, R Xu, K Hummler, YS Obeng IEEE Transactions on Electron Devices 61 (7), 2473-2479, 2014 | 45 | 2014 |
| Integrated circuit fabrication process YS Obeng, SC Vitkavage US Patent 6,083,810, 2000 | 44 | 2000 |
Joseph J KopanskiNational Institute of Standards and TechnologyAdresă de e-mail confirmată pe nist.gov
