| Study of 15µm pitch solder microbumps for 3D IC integration A Yu, JH Lau, SW Ho, A Kumar, WY Hnin, DQ Yu, MC Jong, V Kripesh, ... Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 6-10, 2009 | 89 | 2009 |
| Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5 Ag solder and electroless Ni–P metallization on Cu substrate A Kumar, Z Chen, SG Mhaisalkar, CC Wong, PS Teo, V Kripesh Thin Solid Films 504 (1), 410-415, 2006 | 88 | 2006 |
| Fabrication of high aspect ratio TSV and assembly with fine-pitch low-cost solder microbump for Si interposer technology with high-density interconnects A Yu, JH Lau, SW Ho, A Kumar, WY Hnin, WS Lee, MC Jong, VN Sekhar, ... Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 78 | 2011 |
| Wafer level embedding technology for 3D wafer level embedded package A Kumar, X Dingwei, VN Sekhar, S Lim, C Keng, G Sharma, VS Rao, ... Proceedings of the 59th electronic components and technology conference …, 2009 | 71 | 2009 |
| Solutions strategies for die shift problem in wafer level compression molding G Sharma, A Kumar, VS Rao, SW Ho, V Kripesh Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 66 | 2011 |
| Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps A Yu, JH Lau, SW Ho, A Kumar, HW Yin, JM Ching, V Kripesh, D Pinjala, ... Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 350-354, 2009 | 62 | 2009 |
| Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5 Ag solder A Kumar, M He, Z Chen Surface and Coatings Technology 198 (1), 283-286, 2005 | 61 | 2005 |
| Design and development of a multi-die embedded micro wafer level package V Kripesh, VS Rao, A Kumar, G Sharma, KC Houe, Z Xiaowu, KY Mong, ... Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, 1544 …, 2008 | 59 | 2008 |
| Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder A Kumar, M He, Z Chen, PS Teo Thin Solid Films 462, 413-418, 2004 | 58 | 2004 |
| A novel method to predict die shift during compression molding in embedded wafer level package CH Khong, A Kumar, X Zhang, G Sharma, SR Vempati, K Vaidyanathan, ... Proc. Electron. Compon. Technol. Conf, 535-541, 2009 | 56 | 2009 |
| Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5 Ag reaction couple A Kumar, Z Chen Journal of electronic materials 40 (2), 213-223, 2011 | 49 | 2011 |
| Application of piezoresistive stress sensors in ultra thin device handling and characterization X Zhang, A Kumar, QX Zhang, YY Ong, SW Ho, CH Khong, V Kripesh, ... Sensors and Actuators A: Physical 156 (1), 2-7, 2009 | 48 | 2009 |
| Embedded wafer level packages with laterally placed and vertically stacked thin dies G Sharma, VS Rao, A Kumar, N Su, LY Ying, KC Houe, S Lim, VN Sekhar, ... Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 1537 …, 2009 | 42 | 2009 |
| Alternative materials for high numerical aperture extreme ultraviolet lithography mask stacks O Wood, S Raghunathan, P Mangat, V Philipsen, V Luong, P Kearney, ... SPIE Proceedings 9422, 2015 | 39 | 2015 |
| Effect of electromigration on the mechanical performance of Sn-3.5 Ag solder joints with Ni and Ni-P metallizations A Kumar, Y Yang, CC Wong, V Kripesh, Z Chen Journal of Electronic Materials 38 (1), 78-87, 2009 | 39 | 2009 |
| Interfacial reaction between Sn-rich solders and Ni-based metallization M He, A Kumar, PT Yeo, GJ Qi, Z Chen Thin Solid Films 462, 387-394, 2004 | 37 | 2004 |
| Development of fine pitch solder microbumps for 3D chip stacking A Yu, A Kumar, SW Ho, HW Yin, JH Lau, KC Houe, SLP Siang, X Zhang, ... Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th, 387-392, 2008 | 36 | 2008 |
| Effect of interfacial reaction on the tensile strength of Sn-3.5 Ag/Ni-P and Sn-37Pb/Ni-P solder joints Z Chen, M He, A Kumar, GJ Qi Journal of electronic materials 36 (1), 17-25, 2007 | 34 | 2007 |
| Effect of phosphorus content on Cu/Ni-P/Sn-3.5 Ag solder joint strength after multiple reflows Z Chen, A Kumar, M Mona Journal of electronic materials 35 (12), 2126-2134, 2006 | 34 | 2006 |
| Residual stress analysis in thin device wafer using piezoresistive stress sensor A Kumar, X Zhang, QX Zhang, MC Jong, G Huang, LWS Vincent, ... Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 27 | 2011 |
