| Three-dimensional semiconductor devices and methods of fabricating the same JH Lim, JJ Shim, HJ Kim, KH Kim, CS Mun US Patent App. 13/286,384, 2012 | 415 | 2012 |
| Methods of fabricating semiconductor devices including channel layers having improved defect density and surface roughness characteristics J Lim, C Hong, BU Yoon, SK Yun, SH Choi, SY Han US Patent 7,678,625, 2010 | 261 | 2010 |
| Resistive Random Access Memory Devices Including Sidewall Resistive Layers and Related Methods SH Choi, IG Baek, SK Yun, J Lim, CK Hong, BU Yoon US Patent App. 12/062,042, 2008 | 85 | 2008 |
| Methods of Manufacturing Three Dimensional Semiconductor Devices HJ Kim, SY Park, JH Lim, K Kim, CS Mun US Patent App. 13/231,525, 2012 | 81 | 2012 |
| Effects of phosphoric acid stabilizer on copper and tantalum nitride CMP NH Kim, JH Lim, SY Kim, EG Chang Materials letters 57 (29), 4601-4604, 2003 | 52 | 2003 |
| Methods of manufacturing three-dimensional semiconductor devices M Pyo, HJ Kim, JH Lim, K Kim, B Yoon, JH Han US Patent 8,633,104, 2014 | 47 | 2014 |
| Vertical memory devices YH Son, K Kim, BJ Kim, P Nam, KC Park, YS Sohn, J Lee, J Lim, WB Jung, ... US Patent 9,997,534, 2018 | 38 | 2018 |
| Multiple mold structure methods of manufacturing vertical memory devices HJ Kim, D Eom, J Lim, MJ Pyo, B Yoon, K Kim US Patent 8,664,101, 2014 | 37 | 2014 |
| Semiconductor memory device YH Son, J Lee, K Kim, B Kim, PO Nam, P Kwangchul, YS Sohn, JH Lim, ... US Patent 10,103,163, 2018 | 24 | 2018 |
| Non-volatile memory device including etch stop layer pattern J Lim, K Bae, HJ Kim, K Kim, C Seo, Y Pyon US Patent 8,912,592, 2014 | 21 | 2014 |
| Memory device and method of manufacturing the same PO Nam, YH Son, KH Kim, BJ Kim, KC Park, YS Sohn, ILEE Jin, JH Lim, ... US Patent 9,893,077, 2018 | 19 | 2018 |
| Methods of manufacturing semiconductor devices HJ Kim, KH Hwang, K Kim, H Choi, DC Yoo, C Park, J Lim, MJ Pyo, ... US Patent 8,822,287, 2014 | 16 | 2014 |
| Semi-abrasive free slurry with acid colloidal silica for copper chemical mechanical planarization NH Kim, JH Lim, SY Kim, EG Chang Journal of Materials Science: Materials in Electronics 16, 629-632, 2005 | 16 | 2005 |
| Methods of manufacturing semiconductor devices T Kim, K Kim, JH Sim, JJ Shin, J Lim, HM Park US Patent 8,283,248, 2012 | 15 | 2012 |
| Methods of recycling a substrate including using a chemical mechanical polishing process JH Lim, C Hong, BU Yoon, DL Bae, SK Yun, SH Choi US Patent App. 11/945,359, 2008 | 11 | 2008 |
| Roles of phosphoric acid in slurry for Cu and TaN CMP SY Kim, JH Lim, CH Yu, NH Kim, EG Chang Transactions on Electrical and Electronic Materials 4 (2), 1-4, 2003 | 11 | 2003 |
| Semiconductor device and method of fabricating the same PO Nam, YH Son, K Kim, B Kim, P Kwangchul, YS Sohn, J Lee, JH Lim, ... US Patent 9,716,181, 2017 | 9 | 2017 |
| Agglomeration characteristic of particles in alumina slurry by addition of chemicals and milling process for Cu CMP MH Choi, NH Kim, JH Lim, SY Kim, EG Chang Materials Science and Engineering: B 118 (1-3), 306-309, 2005 | 9 | 2005 |
| Nonvolatile memory device and a method for fabricating the same J Lim, HJ Kim, JW Im, K Kim US Patent 9,502,332, 2016 | 8 | 2016 |
| Apparatus for polishing a wafer and method for detecting a polishing end point by the same J Lim, SH Shin, BU Yoon, C Hong US Patent 8,038,508, 2011 | 8 | 2011 |
Nam-Hoon KimProfessor, Department of Electrical Engineering, Chosun UniversityПодтвержден адрес электронной почты в домене chosun.ac.kr
