High frequency characterization and modeling of high density TSV in 3D integrated circuits C Bermond, L Cadix, A Farcy, T Lacrevaz, P Leduc, B Flechet
2009 IEEE Workshop on Signal Propagation on Interconnects, 1-4, 2009
87 2009 Investigation on TSV impact on 65nm CMOS devices and circuits H Chaabouni, M Rousseau, P Leduc, A Farcy, R El Farhane, A Thuaire, ...
2010 International Electron Devices Meeting, 35.1. 1-35.1. 4, 2010
68 2010 Modelling of through silicon via RF performance and impact on signal transmission in 3D integrated circuits L Cadix, A Farcy, C Bermond, C Fuchs, P Leduc, M Rousseau, M Assous, ...
2009 IEEE International Conference on 3D System Integration, 1-7, 2009
59 2009 Performance analysis of four nonlinearity analysis methods using a model with variable complexity and application to uterine EMG signals A Diab, M Hassan, C Marque, B Karlsson
Medical engineering & physics 36 (6), 761-767, 2014
44 2014 RF characterization and modelling of high density through silicon vias for 3D chip stacking L Cadix, C Bermond, C Fuchs, A Farcy, P Leduc, L DiCioccio, M Assous, ...
Microelectronic Engineering 87 (3), 491-495, 2010
42 2010 Time domain characterization of lossy arbitrary characteristic impedance transmission lines P Ferrari, B Flechet, G Angenieux
IEEE microwave and guided wave letters 4 (6), 177-179, 1994
40 1994 Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs L Cadix, M Rousseau, C Fuchs, P Leduc, A Thuaire, R El Farhane, ...
2010 IEEE International Interconnect Technology Conference, 1-3, 2010
35 2010 Ferroelectric properties of Pb (Zr, Ti) O3 thin films until 40 GHz E Defay, T Lacrevaz, TT Vo, V Sbrugnera, C Bermond, M Aid, B Flechet
Applied Physics Letters 94 (5), 2009
35 2009 Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic J Roullard, A Farcy, S Capraro, T Lacrevaz, C Bermond, G Houzet, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 8-13, 2012
32 2012 Intercomparison of permittivity measurement techniques for ferroelectric thin layers P Queffelec, V Laur, A Chevalier, JM Le Floch, D Passerieux, D Cros, ...
Journal of Applied Physics 115 (2), 2014
31 2014 Frequency Effect on Voltage Linearity of T Bertaud, S Blonkowski, C Bermond, C Vallee, P Gonon, M Gros-Jean, ...
IEEE electron device letters 31 (2), 114-116, 2009
29 2009 A complete calibration procedure for time domain network analyzers P Ferrari, G Angénieux, B Flechet
1992 IEEE MTT-S Microwave Symposium Digest, 1451-1454, 1992
28 1992 3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies P Coudrain, D Henry, A Berthelot, J Charbonnier, S Verrun, R Franiatte, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 674-682, 2013
24 2013 Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack M Brocard, P Le Maître, C Bermond, P Bar, R Anciant, A Farcy, T Lacrevaz, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 665-672, 2012
22 2012 Electrical Characterization of Advanced MIM Capacitors With T Bertaud, C Bermond, S Blonkowski, C Vallee, T Lacrevaz, A Farcy, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (3 …, 2012
20 2012 Keep on shrinking interconnect size: Is it still the best solution? D Deschacht, S De Rivaz, A Farcy, T Lacrevaz, B Flechet
2010 34th IEEE/CPMT International Electronic Manufacturing Technology …, 2010
19 2010 Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for HF integrated passives T Lacrevaz, B Flechet, A Farcy, J Torres, M Gros-Jean, C Bermond, TT Vo, ...
Microelectronic engineering 83 (11-12), 2184-2188, 2006
19 2006 Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors T Bertaud, C Bermond, T Lacrevaz, C Vallée, Y Morand, B Fléchet, ...
Microelectronic Engineering 87 (3), 301-305, 2010
18 2010 Extraction of (R, L, C, G) interconnect parameters in 2D transmission lines using fast and efficient numerical tools F Charlet, C Bermond, S Putot, G Le Carval, B Flechet
2000 International Conference on Simulation Semiconductor Processes and …, 2000
18 2000 mmW characterization of wafer level passivation for 3D silicon interposer Y Lamy, O El Bouayadi, C Ferrandon, A Schreiner, T Lacrevaz, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 1887-1891, 2013
17 2013 
Christophe ValleeProfesseur CNSE Albany / Professeur UGAПодтвержден адрес электронной почты в домене albany.edu
