| Silicon-organic hybrid photonics: an overview of recent advances, electro-optical effects and CMOS integration concepts P Steglich, C Mai, C Villringer, B Dietzel, S Bondarenko, V Ksianzou, ... Journal of Physics: Photonics 3 (2), 022009, 2021 | 29 | 2021 |
| Grafting of amine functions on cellulose acetate fibers by plasma processing M Kajjout, Y Lemmouchi, C Jama, C Rolando, F Villasmunta, F Heinrich, ... Reactive and Functional Polymers 134, 40-48, 2019 | 13 | 2019 |
| Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process J Bauer, O Fursenko, S Marschmeyer, F Heinrich, F Villasmunta, ... Journal of Vacuum Science & Technology B 37 (6), 2019 | 9 | 2019 |
| Endoscopic orientation by multimodal data fusion S Pulwer, R Fiebelkorn, C Zesch, P Steglich, C Villringer, F Villasmunta, ... MOEMS and Miniaturized Systems XVIII 10931, 251-256, 2019 | 2 | 2019 |
| Numerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic Interconnections F Villasmunta, P Steglich, S Schrader, H Schenk, A Mai 2021 International Conference on Numerical Simulation of Optoelectronic …, 2021 | 1 | 2021 |
| Integrated optical waveguide P Steglich, C Mai, A Mai, F Villasmunta, C Villringer, S Schrader US Patent App. 18/557,444, 2024 | | 2024 |
| Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections F Villasmunta, P Steglich, C Villringer, S Schrader, H Schenk, A Mai, ... Optical Interconnects XXIV 12892, 118-129, 2024 | | 2024 |
| Optical Through-Silicon Waveguides for 3D-Chip-Interconnections F Villasmunta, P Steglich, F Heinrich, C Villringer, A Mai, S Schrader, ... | | 2023 |
| Messverfahren zur Kontrolle tiefer Siliziumstrukturen für die 3D-Chip-Integration J Bauer, F Villasmunta, F Heinrich, C Villringer, J Reck, S Peters, A Treffer, ... Deutsche Gesellschaft für angewandte Optik (DGaO), 2023 | | 2023 |
| Numerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic Interconnections H Schenk, F Villasmunta, P Steglich, S Schrader, A Mai IEEE, 2021 | | 2021 |
| PMMA Filled Through-Silicon Vias (TSVs) and Back Etch Process Controlled by Plasma Emission Interferometry F Villasmunta, P Steglich, C Mai, F Heinrich, V Ksianzou, S Schrader, ... MikroSystemTechnik 2019; Congress, 1-4, 2019 | | 2019 |
