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Anil Kunwar
Anil Kunwar
Silesian University of Technology
Подтвержден адрес электронной почты в домене polsl.pl
Название
Процитировано
Процитировано
Год
3D printed biomedical devices and their applications: A review on state-of-the-art technologies, existing challenges, and future perspectives
HB Mamo, M Adamiak, A Kunwar
Journal of the Mechanical Behavior of Biomedical Materials 143, 105930, 2023
772023
A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
A Kunwar, L An, J Liu, S Shang, P Råback, H Ma, X Song
Journal of Materials Science & Technology 50, 115-127, 2020
502020
In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper
H Ma, A Kunwar, J Sun, B Guo, H Ma
Scripta Materialia 107, 88-91, 2015
482015
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5 Ag0. 5/Cu joints
A Kunwar, S Shang, P Råback, Y Wang, J Givernaud, J Chen, H Ma, ...
Microelectronics Reliability 80, 55-67, 2018
422018
Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface
A Kunwar, J Hektor, S Nomoto, YA Coutinho, N Moelans
International Journal of Mechanical Sciences 184, 105843, 2020
412020
Synthesis of Cu@ Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity
S Shang, A Kunwar, Y Wang, X Qi, H Ma, Y Wang
Applied Physics A 124, 1-8, 2018
412018
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints
B Guo, A Kunwar, N Zhao, J Chen, Y Wang, H Ma
Materials research bulletin 99, 239-248, 2018
412018
In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process
L Qu, HT Ma, HJ Zhao, A Kunwar, N Zhao
Applied surface science 305, 133-138, 2014
402014
Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
A Kunwar, YA Coutinho, J Hektor, H Ma, N Moelans
Journal of Materials Science & Technology 59, 203-219, 2020
322020
Fabrication of cerium myristate coating for a mechanochemically robust modifier-free superwettability system to enhance the corrosion resistance on 316L steel by one-step …
MM Hussain, H Ma, M Huang, Z Gao, J Cao, C Wang, C Dong, Y Wang, ...
Surface and Coatings Technology 398, 125970, 2020
312020
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient
A Kunwar, H Ma, H Ma, J Sun, N Zhao, M Huang
Materials Letters 172, 211-215, 2016
302016
A study on the physical properties and interfacial reactions with Cu substrate of rapidly solidified Sn-3.5 Ag lead-free solder
HT Ma, J Wang, L Qu, N Zhao, A Kunwar
Journal of electronic materials 42, 2686-2695, 2013
272013
Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows
HR Ma, A Kunwar, SY Shang, CR Jiang, YP Wang, HT Ma, N Zhao
Intermetallics 96, 1-12, 2018
262018
Surface tension of aluminum-oxygen system: A molecular dynamics study
E Yousefi, Y Sun, A Kunwar, M Guo, N Moelans, D Seveno
Acta Materialia 221, 117430, 2021
252021
Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows
H Ma, A Kunwar, R Huang, J Chen, Y Wang, N Zhao, H Ma
Intermetallics 90, 90-96, 2017
232017
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
A Kunwar, B Guo, S Shang, P Råback, Y Wang, J Chen, H Ma, X Song, ...
Intermetallics 93, 186-196, 2018
222018
Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage
B Guo, A Kunwar, C Jiang, N Zhao, J Sun, J Chen, Y Wang, M Huang, ...
Journal of Materials Science: Materials in Electronics 29, 589-601, 2018
192018
Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint
S Shang, Y Wang, Y Wang, H Ma, A Kunwar
Microelectronic Engineering 208, 47-53, 2019
182019
Size effect on interface reaction of Sn–xCu/Cu solder joints during multiple reflows
R Huang, H Ma, S Shang, A Kunwar, Y Wang, H Ma
Journal of Materials Science: Materials in Electronics 30, 4359-4369, 2019
182019
Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints
H Ma, A Kunwar, B Guo, J Sun, C Jiang, Y Wang, X Song, N Zhao, H Ma
Applied Physics A 122, 1-10, 2016
172016
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