| Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing S Gao, H Li, H Huang, R Kang Applied Surface Science 599, 153982, 2022 | 128 | 2022 |
| Recent advances in micro-and nano-machining technologies S Gao, H Huang Frontiers of Mechanical Engineering 12, 18-32, 2017 | 101 | 2017 |
| Molecular simulation of the plastic deformation and crack formation in single grit grinding of 4H-SiC single crystal S Gao, H Wang, H Huang, R Kang International Journal of Mechanical Sciences 247, 108147, 2023 | 87 | 2023 |
| Nanogrinding induced surface and deformation mechanism of single crystal β-Ga2O3 S Gao, Y Wu, R Kang, H Huang Materials Science in Semiconductor Processing 79, 165-170, 2018 | 72 | 2018 |
| Edge chipping of silicon wafers in diamond grinding S Gao, R Kang, Z Dong, B Zhang International Journal of Machine Tools and Manufacture 64, 31-37, 2013 | 71 | 2013 |
| Study on the subsurface damage distribution of the silicon wafer ground by diamond wheel S Gao, RK Kang, DM Guo, QS Huang Advanced Materials Research 126, 113-118, 2010 | 49 | 2010 |
| A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters Y Zhang, R Kang, S Gao, J Huang, X Zhu Precision Engineering 72, 461-468, 2021 | 42 | 2021 |
| Nanoscale removal mechanisms in abrasive machining of brittle solids H Shuiquan, GAO Shang, H Chuanzhen, H Han 金刚石与磨料磨具工程 42 (3), 257-267, 2022 | 37 | 2022 |
| Mechanical load-induced atomic-scale deformation evolution and mechanism of SiC polytypes using molecular dynamics simulation H Wang, S Gao, R Kang, X Guo, H Li Nanomaterials 12 (14), 2489, 2022 | 31 | 2022 |
| Design and evaluation of soft abrasive grinding wheels for silicon wafers S Gao, Z Dong, R Kang, D Guo Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2013 | 31 | 2013 |
| Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained using compression of micro-pillars YQ Wu, S Gao, RK Kang, H Huang Journal of Materials Science 54 (3), 1958-1966, 2019 | 30 | 2019 |
| Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates S Gao, RK Kang, ZG Dong, B Zhang, ZG Wang Materials and Manufacturing Processes 32 (2), 121-126, 2017 | 28 | 2017 |
| Surface integrity of quartz glass induced by ultra-precision grinding S Gao, Z Geng, Y Wu, Z Wang, R Kang Jixie Gongcheng Xuebao 55 (5), 186-195, 2019 | 23 | 2019 |
| High surface integrity fabrication of silicon wafers using a newly developed nonwoven structured grind-polishing wheel R Kang, Y Zhang, S Gao, J Huang, X Zhu Journal of Manufacturing Processes 77, 229-239, 2022 | 20 | 2022 |
| A novel reverse helical milling process for reducing push-out delamination of CFRP G Yang, Z Dong, S Gao, Y Bao, R Kang, D Guo Composite Structures 253, 112778, 2020 | 18 | 2020 |
| Subsurface damage distribution in silicon wafers ground with wafer rotation grinding method 高尚， 康仁科， 董志刚， 郭东明 Journal of Mechanical Engineering 49 (3), 88-94, 2013 | 18 | 2013 |
| Deformation and fracture behaviors of monocrystalline β-Ga2O3 characterized using indentation method and first-principles calculations S Gao, X Yang, J Cheng, X Guo, R Kang Materials Characterization 200, 112920, 2023 | 17 | 2023 |
| Study on grinding performance of soft abrasive wheel for silicon wafer RK Kang, S Gao, ZJ Jin, DM Guo Key Engineering Materials 416, 529, 2009 | 15 | 2009 |
| Analysis of factors affecting gravity-induced deflection for large and thin wafers in flatness measurement using three-point-support method H Liu, Z Dong, R Kang, P Zhou, S Gao Metrology and Measurement Systems 22 (4), 531-546, 2015 | 14 | 2015 |
| Surface layer damage of silicon wafers sliced by wire saw process RK Kang, YF Zeng, S Gao, ZG Dong, DM Guo Advanced Materials Research 797, 685-690, 2013 | 14 | 2013 |
