| Voltage waveform tailoring in radio frequency plasmas for surface charge neutralization inside etch trenches F Krüger, S Wilczek, T Mussenbrock, J Schulze Plasma Sources Science and Technology 28 (7), 075017, 2019 | 52 | 2019 |
| Machine learning plasma-surface interface for coupling sputtering and gas-phase transport simulations F Krüger, T Gergs, J Trieschmann Plasma Sources Science and Technology 28 (3), 035002, 2019 | 39 | 2019 |
| Voltage waveform tailoring for high aspect ratio plasma etching of SiO2 using Ar/CF4/O2 mixtures: Consequences of ion and electron distributions on etch profiles F Krüger, H Lee, SK Nam, MJ Kushner Journal of Vacuum Science & Technology A 41 (1), 2023 | 8 | 2023 |
| Electric field reversals resulting from voltage waveform tailoring in Ar/O2 capacitively coupled plasmas sustained in asymmetric systems F Krüger, H Lee, SK Nam, MJ Kushner Plasma Sources Science and Technology 30 (8), 085002, 2021 | 8 | 2021 |
| Formation and behaviour of plasma spots on the surface of titanium film P Hermanns, F Kogelheide, V Bracht, S Ries, F Krüger, S Böddeker, ... Journal of Physics D: Applied Physics 54 (8), 085203, 2020 | 8 | 2020 |
| Voltage waveform tailoring for high aspect ratio plasma etching of SiO2 using Ar/CF4/O2 mixtures: Consequences of low fundamental frequency biases F Krüger, H Lee, SK Nam, MJ Kushner Physics of Plasmas 31 (3), 2024 | 5 | 2024 |
| Comparison of glancing-angle scatterings on different materials in a high aspect ratio plasma etching process using molecular dynamics simulation Y Du, F Krüger, SK Nam, H Lee, S Yoo, J Eapen, MJ Kushner, S Shannon Journal of Vacuum Science & Technology A 40 (5), 2022 | 5 | 2022 |
| Modeling and Optimization of High Aspect Ratio Plasma Etching F Krueger | 1 | 2024 |
| ICP vs CCP in High Aspect Ratio Etching of SiO2 using Ar/C4F8/O2 Gas Mixtures F Krüger, MJ Kushner, S Shim, H Lee, SK Nam 2020 IEEE International Conference on Plasma Science (ICOPS), 88-88, 2020 | 1 | 2020 |
| Autonomous hybrid optimization of a SiO2 plasma etching mechanism F Krüger, D Zhang, P Luan, M Park, A Metz, MJ Kushner Journal of Vacuum Science & Technology A 42 (4), 2024 | | 2024 |
| Automatic Optimization of Reaction Mechanisms in Simulations of High Aspect Ratio Plasma Etching F Krueger, D Zhang, P Luan, M Oh, M Park, A Metz, M Kushner APS Annual Gaseous Electronics Meeting Abstracts, GW1. 003, 2023 | | 2023 |
| Voltage Waveform Tailoring in Plasma Etching of Dielectrics to Mitigate Surface Charging Effects F Krüger, MJ Kushner, H Lee, SK Nam 2022 IEEE International Conference on Plasma Science (ICOPS), 1-1, 2022 | | 2022 |
| Passivation and Redeposition During High Aspect Ratio Etching of p-Si Using HBr Containing Gas Mixtures MJK Florian Krüger, Hyunjae Lee, Sang Ki Nam AVS Symposium 67, 2021 | | 2021 |
| Mitigating the effects of surface charging during high aspect ratio plasma etching using voltage waveform tailoring F Krüger, H Lee, SK Nam, M Kushner APS Annual Gaseous Electronics Meeting Abstracts, PR22. 004, 2021 | | 2021 |
| Student Excellence Award Finalist: A potential remedy for etched trench deformations based on voltage waveform tailoring and electric field reversal F Krüger, S Wilczek, T Mussenbock, J Schulze APS Annual Gaseous Electronics Meeting Abstracts, ET2. 006, 2019 | | 2019 |
| Interface model of plasma-surface interactions using artificial neural networks F Krueger, T Gergs, T Mussenbrock, J Trieschmann APS Annual Gaseous Electronics Meeting Abstracts, GT1. 076, 2018 | | 2018 |
Mark J. KushnerUniversity of MichiganOverená e-mailová adresa na: umich.edu
