| Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads AK Gain, YC Chan, WKC Yung Microelectronics Reliability 51 (12), 2306-2313, 2011 | 132 | 2011 |
| A review on metallic porous materials: pore formation, mechanical properties, and their applications B Zhao, AK Gain, W Ding, L Zhang, X Li, Y Fu The International Journal of Advanced Manufacturing Technology 95, 2641–2659, 2018 | 128 | 2018 |
| Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1 wt% nano-TiO2 composite solder on flexible ball grid array substrates AK Gain, YC Chan, WKC Yung Microelectronics Reliability 51 (5), 975-984, 2011 | 127 | 2011 |
| Microstructure and mechanical properties of porous yttria stabilized zirconia ceramic using poly methyl methacrylate powder AK Gain, HY Song, BT Lee Scripta Materialia 54 (12), 2081-2085, 2006 | 111 | 2006 |
| Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads AK Gain, T Fouzder, YC Chan, WKC Yung Journal of Alloys and Compounds 509 (7), 3319-3325, 2011 | 108 | 2011 |
| The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads AK Gain, T Fouzder, YC Chan, A Sharif, NB Wong, WKC Yung Journal of Alloys and Compounds 506 (1), 216-223, 2010 | 107 | 2010 |
| Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder AK Gain, L Zhang Journal of Materials Science: Materials in Electronics 27, 781-794, 2016 | 88 | 2016 |
| Microstructure and material properties of porous hydroxyapatite-zirconia nanocomposites using polymethyl methacrylate powders AK Gain, L Zhang, W Liu Materials & Design 67, 136-144, 2015 | 86 | 2015 |
| Effect of Nano Ni Additions on the Structure and Properties of Sn-9Zn and Sn-8Sn-3Bi Solder in Ball Grid Array Packages AK Gain, YC Chan, KC Yung Materials Science and Engineering: B 162 (2), 92-98, 2009 | 81 | 2009 |
| Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1 wt% nano-ZrO2 composite solders AK Gain, YC Chan Microelectronics Reliability 54 (5), 945-955, 2014 | 79 | 2014 |
| The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads AK Gain, YC Chan Intermetallics 29, 48-55, 2012 | 69 | 2012 |
| Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate AK Gain, L Zhang Journal of Materials Science: Materials in Electronics 27, 3982–3994, 2016 | 68 | 2016 |
| Processing parameter optimisation for automated fibre placement (AFP) manufactured thermoplastic composites E Oromiehie, AK Gain, BG Prusty Composite structures 272, 114223, 2021 | 65 | 2021 |
| Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy M Ahmed, T Fouzder, A Sharif, AK Gain, YC Chan Microelectronics Reliability 50 (8), 1134-1141, 2010 | 62 | 2010 |
| Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy AK Gain, L Zhang, MZ Quadir Materials and Design 110, 275-283, 2016 | 59 | 2016 |
| Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages AK Gain, YC Chan, A Sharif, NB Wong, WKC Yung Microelectronics Reliability 49 (7), 746-753, 2009 | 58 | 2009 |
| Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads T Fouzder, AK Gain, YC Chan, A Sharif, WKC Yung Microelectronics Reliability 50 (12), 2051-2058, 2010 | 53 | 2010 |
| Effects of Ni nanoparticles addition on the microstructure, electrical and mechanical properties of Sn-Ag-Cu alloy AK Gain, L Zhang Materialia 5, 100234, 2019 | 49 | 2019 |
| Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel … AK Gain, L Zhang, YC Chan Journal of Materials Science: Materials in Electronics 26, 7039-7048, 2015 | 49 | 2015 |
| Microstructure, thermal analysis and damping properties of Ag and Ni nano-particles doped Sn–8Zn–3Bi solder on OSP–Cu substrate AK Gain, L Zhang Journal of alloys and compounds 617, 779-786, 2014 | 47 | 2014 |
