Atmospheric-pressure plasma sources for biomedical applications GY Park, SJ Park, MY Choi, IG Koo, JH Byun, JW Hong, JY Sim, ...
Plasma Sources Science and Technology 21 (4), 043001, 2012
442 2012 Wireless smart contact lens for diabetic diagnosis and therapy DH Keum, SK Kim, J Koo, GH Lee, C Jeon, JW Mok, BH Mun, KJ Lee, ...
Science advances 6 (17), eaba3252, 2020
383 2020 A fully-integrated 71 nW CMOS temperature sensor for low power wireless sensor nodes S Jeong, Z Foo, Y Lee, JY Sim, D Blaauw, D Sylvester
IEEE Journal of solid-state circuits 49 (8), 1682-1693, 2014
248 2014 A 1 GHz ADPLL With a 1.25 ps Minimum-Resolution Sub-Exponent TDC in 0.18 m CMOS SK Lee, YH Seo, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 45 (12), 2874-2881, 2010
220 2010 A 21 fJ/conversion-step 100 kS/s 10-bit ADC with a low-noise time-domain comparator for low-power sensor interface SK Lee, SJ Park, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 46 (3), 651-659, 2011
212 2011 Biomimetic anti-reflective triboelectric nanogenerator for concurrent harvesting of solar and raindrop energies D Yoo, SC Park, S Lee, JY Sim, I Song, D Choi, H Lim, DS Kim
Nano Energy 57, 424-431, 2019
166 2019 A digital-domain calibration of split-capacitor DAC for a differential SAR ADC without additional analog circuits JY Um, YJ Kim, EW Song, JY Sim, HJ Park
IEEE Transactions on Circuits and Systems I: Regular Papers 60 (11), 2845-2856, 2013
135 2013 5.8 A 9.3 nW all-in-one bandgap voltage and current reference circuit Y Ji, C Jeon, H Son, B Kim, HJ Park, JY Sim
2017 IEEE International Solid-State Circuits Conference (ISSCC), 100-101, 2017
120 2017 Bimetallic nanocatalysts immobilized in nanoporous hydrogels for long‐term robust continuous glucose monitoring of smart contact lens SK Kim, GH Lee, C Jeon, HH Han, SJ Kim, JW Mok, CK Joo, S Shin, ...
Advanced Materials 34 (18), 2110536, 2022
118 2022 A serpentine guard trace to reduce the far-end crosstalk voltage and the crosstalk induced timing jitter of parallel microstrip lines K Lee, HB Lee, HK Jung, JY Sim, HJ Park
IEEE transactions on advanced packaging 31 (4), 809-817, 2008
113 2008 A 1.25 ps Resolution 8b Cyclic TDC in 0.13 m CMOS YH Seo, JS Kim, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 47 (3), 736-743, 2011
112 2011 Toward sustainable output generation of liquid–solid contact triboelectric nanogenerators: The role of hierarchical structures H Cho, J Chung, G Shin, JY Sim, DS Kim, S Lee, W Hwang
Nano energy 56, 56-64, 2019
109 2019 5.7 A 29nW bandgap reference circuit JM Lee, Y Ji, S Choi, YC Cho, SJ Jang, JS Choi, B Kim, HJ Park, JY Sim
2015 IEEE International Solid-State Circuits Conference-(ISSCC) Digest of …, 2015
107 2015 12.6 A 160nW 63.9 fJ/conversion-step capacitance-to-digital converter for ultra-low-power wireless sensor nodes H Ha, D Sylvester, D Blaauw, JY Sim
2014 IEEE International Solid-State Circuits Conference Digest of Technical …, 2014
107 2014 A Global Model for the Identification of the Dominant Reactions for Atomic Oxygen in He/O2 Atmospheric‐Pressure Plasmas GY Park, YJ Hong, HW Lee, JY Sim, JK Lee
Plasma Processes and Polymers 7 (3‐4), 281-287, 2010
106 2010 A 192-pW Voltage Reference Generating Bandgap– With Process and Temperature Dependence Compensation Y Ji, J Lee, B Kim, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 54 (12), 3281-3291, 2019
88 2019 A 300-MS/s, 1.76-ps-resolution, 10-b asynchronous pipelined time-to-digital converter with on-chip digital background calibration in 0.13-µm CMOS JS Kim, YH Seo, Y Suh, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 48 (2), 516-526, 2012
83 2012 A 1.3 μW 0.6 V 8.7-ENOB successive approximation ADC in a 0.18 μm CMOS SK Lee, SJ Park, Y Suh, HJ Park, JY Sim
2009 Symposium on VLSI Circuits, 242-243, 2009
76 2009 A 0.63 ps resolution, 11b pipeline TDC in 0.13 µm CMOS YH Seo, JS Kim, HJ Park, JY Sim
2011 symposium on VLSI circuits-digest of technical papers, 152-153, 2011
72 2011 Serpentine microstrip lines with zero far-end crosstalk for parallel high-speed DRAM interfaces K Lee, HK Jung, HJ Chi, HJ Kwon, JY Sim, HJ Park
IEEE Transactions on Advanced Packaging 33 (2), 552-558, 2009
67 2009