Ahmed Sharif

Citované v

	Všetky	Od 2020
Citácie	3173	1195
h-index	31	19
i10-index	70	42

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20052006200720082009201020112012201320142015201620172018201920202021202220232024202554 60 78 80 113 120 129 168 106 166 161 180 150 191 186 196 192 225 221 286 73

Verejný prístup

všetky položky

6 článkov

0 článkov

dostupné

nedostupné

Na základe mandátov na financovanie

Spoluautori

Y C ChanCity University of Hong KongOverená e-mailová adresa na: cityu.edu.hk
Dr. Asit Kumar GainResearch Associate Professor, Department of Mechanics and Aerospace Engineering, SUSTechOverená e-mailová adresa na: sustech.edu.cn
Prof Dr Md Enamul Hoque, FIMechE, F...Dept of Biomedical Engineering, Military Institute of Science and Technology, Dhaka, BangladeshOverená e-mailová adresa na: bme.mist.ac.bd
Zhong Chen (陳忠), SingaporeProfessor of Materials Science and Engineering, Nanyang Technological University, SingaporeOverená e-mailová adresa na: ntu.edu.sg
Shafiq.ICity University of Hong KongOverená e-mailová adresa na: my.cityu.edu.hk
Md Khairul IslamSenior Engineer, Bangladesh Council of Scientific and Industrial ResearchOverená e-mailová adresa na: bcsir.gov.bd
Riko I MadeA*STAROverená e-mailová adresa na: imre.a-star.edu.sg
Md. Rafiqul IslamDepartment of Mechanical and Aerospace Engineering, University of VirginiaOverená e-mailová adresa na: virginia.edu
Muhammad Usama HasanPhD Candidate, Materials Science and Engineering, Massachusetts Institute of TechnologyOverená e-mailová adresa na: mit.edu
Mohammad Mehedi HasanHDR, Swinburne University of TechnologyOverená e-mailová adresa na: swin.edu.au
Rubayyat MahbubMassachusetts Institute of Technology (MIT)Overená e-mailová adresa na: mit.edu
Dr. Md Muktadir BillahBangladesh University of Engineering and Technology, University of Central FloridaOverená e-mailová adresa na: knights.ucf.edu
Mohammad Sharear KabirAssociate Research Fellow, Institute for Frontier Materials, Deakin UniversityOverená e-mailová adresa na: deakin.edu.au
Quazi D. M. KhosruBangladesh University of Engineering and TechnologyOverená e-mailová adresa na: eee.buet.ac.bd
Mehedi Hasan RizviNorth Carolina State UniversityOverená e-mailová adresa na: ncsu.edu
Eric J.R. Phua, PhDNanyang Technological University - Technical University of MunichOverená e-mailová adresa na: nti-nanofilm.com
Tahrim AlamSenior Engineer, Enbridge Gas Inc.Overená e-mailová adresa na: dal.ca
Nadim ChowdhuryMIT, EECSOverená e-mailová adresa na: mit.edu
Sheik Md Kazi Nazrul-Islam, PhDCSIRO Manufacturing; University of WollongongOverená e-mailová adresa na: csiro.au
Stevin Snellius PramanaLecturer at Newcastle UniversityOverená e-mailová adresa na: ncl.ac.uk

Sledovať

Ahmed Sharif

Department of Materials and Metallurgical Engineering, BUET, BANGLADESH

Overená e-mailová adresa na: mme.buet.ac.bd

Electronic Packaging Polymers Waste Recycling High Temperature solders Electroceramics


Názov Zoradiť podľa citácií Zoradiť podľa roka Zoradiť podľa názvu	Citované v Citované v	Rok
Study on wear properties of aluminium–silicon piston alloy MM Haque, A Sharif Journal of Materials Processing Technology 118, 69–73, 2001	213	2001
Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging MN Islam, A Sharif, YC Chan Journal of electronic materials 34, 143-149, 2005	132	2005
The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads AK Gain, T Fouzder, YC Chan, A Sharif, NB Wong, WKC Yung Journal of Alloys and Compounds 506 (1), 216-223, 2010	107	2010
Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization A Sharif, YC Chan Journal of Alloys and Compounds 390 (1-2), 67-73, 2005	101	2005
Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging A Sharif, YC Chan, RA Islam Materials Science and Engineering: B 106 (2), 120-125, 2004	99	2004
Interfacial reactions of BGA Sn–3.5% Ag–0.5% Cu and Sn–3.5% Ag solders during high-temperature aging with Ni/Au metallization A Sharif, MN Islam, YC Chan Materials science and engineering: B 113 (3), 184-189, 2004	97	2004
Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads T Fouzder, I Shafiq, YC Chan, A Sharif, WKC Yung Journal of Alloys and Compounds 509 (5), 1885-1892, 2011	89	2011
Transient liquid phase Ag-based solder technology for high-temperature packaging applications A Sharif, CL Gan, Z Chen Journal of Alloys and Compounds 587, 365-368, 2014	88	2014
Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow A Sharif, YC Chan Materials Science and Engineering: B 106 (2), 126-131, 2004	88	2004
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3. 5Ag0. 5Cu solder alloy MN Islam, YC Chan, A Sharif, MO Alam Microelectronics Reliability 43 (12), 2031-2037, 2003	87	2003
Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy SK Das, A Sharif, YC Chan, NB Wong, WKC Yung Journal of alloys and compounds 481 (1-2), 167-172, 2009	83	2009
Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties MM Billah, KM Shorowordi, A Sharif Journal of Alloys and Compounds 585, 32-39, 2014	68	2014
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy M Ahmed, T Fouzder, A Sharif, AK Gain, YC Chan Microelectronics Reliability 50 (8), 1134-1141, 2010	62	2010
Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages AK Gain, YC Chan, A Sharif, NB Wong, WKC Yung Microelectronics Reliability 49 (7), 746-753, 2009	58	2009
The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing MJ Rizvi, YC Chan, C Bailey, H Lu, A Sharif Soldering & Surface Mount Technology 17 (2), 40-48, 2005	58	2005
Evidence of superparamagnetism and improved electrical properties in Ba and Ta co-doped BiFeO3 ceramics MR Islam, MS Islam, MA Zubair, HM Usama, MS Azam, A Sharif Journal of Alloys and Compounds 735, 2584-2596, 2018	56	2018
Polylactic acid (PLA)-based nanocomposites: Processing and properties A Sharif, S Mondal, ME Hoque Bio-based polymers and nanocomposites: Preparation, processing, properties …, 2019	55	2019
Dissolution of electroless Ni metallization by lead-free solder alloys A Sharif, YC Chan, MN Islam, MJ Rizvi Journal of Alloys and Compounds 388 (1), 75-82, 2005	54	2005
Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads T Fouzder, AK Gain, YC Chan, A Sharif, WKC Yung Microelectronics Reliability 50 (12), 2051-2058, 2010	53	2010
Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints A Sharif, YC Chan Microelectronic Engineering 84 (2), 328-335, 2007	51	2007

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