| Present and future thermal interface materials for electronic devices KM Razeeb, E Dalton, GLW Cross, AJ Robinson International Materials Reviews 63 (1), 1-21, 2018 | 358 | 2018 |
| Bio‐derived carbon nanofibres from lignin as high‐performance Li‐ion anode materials M Culebras, H Geaney, A Beaucamp, P Upadhyaya, E Dalton, KM Ryan, ... ChemSusChem 12 (19), 4516-4521, 2019 | 170 | 2019 |
| Silver nanowire array-polymer composite as thermal interface material J Xu, A Munari, E Dalton, A Mathewson, KM Razeeb Journal of Applied Physics 106, 124310, 2009 | 144 | 2009 |
| Exploring the role of adsorption and surface state on the hydrophobicity of rare earth oxides R Lundy, C Byrne, J Bogan, K Nolan, MN Collins, E Dalton, R Enright ACS applied materials & interfaces 9 (15), 13751-13760, 2017 | 113 | 2017 |
| Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys E Dalton, G Ren, J Punch, MN Collins Materials & Design 154, 184-191, 2018 | 71 | 2018 |
| Controlled solvent vapor annealing of a high χ block copolymer thin film R Lundy, SP Flynn, C Cummins, SM Kelleher, MN Collins, E Dalton, ... Physical Chemistry Chemical Physics 19 (4), 2805-2815, 2017 | 60 | 2017 |
| Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys MN Collins, E Dalton, J Punch Journal of Alloys and Compounds 688, 164-170, 2016 | 54 | 2016 |
| Crystal morphology of strained ultra high molecular weight polyethylenes MN Collins, E Dalton, B Schaller, JJ Leahy, C Birkinshaw Polymer testing 31 (5), 629-637, 2012 | 33 | 2012 |
| Effects of tensile strain on the nanostructure of irradiated and thermally stabilised ultra high molecular weight polyethylenes for orthopaedic devices MN Collins, E Dalton, JJ Leahy, C Birkinshaw RSC Advances 3 (6), 1995-2007, 2013 | 29 | 2013 |
| Metal nanowire-polymer nanocomposite as thermal interface material A Munari, J Xu, E Dalton, A Mathewson, KM Razeeb 2009 59th Electronic Components and Technology Conference, 448-452, 2009 | 23 | 2009 |
| Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments K Hannigan, M Reid, MN Collins, E Dalton, C Xu, B Wright, K Demirkan, ... Journal of electronic materials 41 (3), 611-623, 2012 | 22 | 2012 |
| Lamella alignment ratio: a SAXS analysis technique for macromolecules E Dalton, MN Collins Applied Crystallography 47 (3), 847-851, 2014 | 20 | 2014 |
| Nanowire-Polymer Nanocomposites as Thermal Interface Material KM Razeeb, E Dalton | 20 | 2011 |
| Testing method for measuring corrosion resistance of surface mount chip resistors M Reid, MN Collins, E Dalton, J Punch, DA Tanner Microelectronics Reliability 52 (7), 1420-1427, 2012 | 11 | 2012 |
| SnZn SOLDER ALTERNATIVE FOR LOW-COST Pb-FREE SURFACE MOUNT ASSEMBLIES GJ Jackson, IJ Wilding, R Boyle, MN Collins, E Dalton, J Punch, P Liu, ... | 10 | 2012 |
| Pb-free solder—microstructural, material reliability, and failure relationships G Ren, MN Collins, J Punch, E Dalton, R Coyle Handbook of Materials Failure Analysis, 107-151, 2020 | 9 | 2020 |
| Nanoporous membrane production via block copolymer lithography for high heat dissipation systems R Lundy, SP Flynn, C Cummins, SM Kelleher, MN Collins, E Dalton, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 9 | 2016 |
| Thermal properties of carbon nanotube-polymer composites for thermal interface material applications KM Razeeb, A Munari, E Dalton, J Punch, S Roy Heat Transfer Summer Conference 42754, 817-823, 2007 | 8 | 2007 |
| Corrosion under mixed flowing gas conditions of various connector coatings MN Collins, M Reid, E Dalton, K Shannon, LF Garfias‐Mesias Materials and Corrosion 64 (1), 7-13, 2013 | 5 | 2013 |
| Piecewise analysis and modeling of circuit pack temperature cycling data T Joyce, EJ Lisay, Jr, DE Dalton, JM Punch, MS Shellmer, SN Kher, ... Bell Labs Technical Journal 11 (3), 21-37, 2006 | 5 | 2006 |
Maurice N CollinsBernal Institute, University of LimerickPreverjeni e-poštni naslov na ul.ie
