| A High Efficiency Electrodeposited Cu2ZnSnS4 Solar Cell S Ahmed, KB Reuter, O Gunawan, L Guo, LT Romankiw, H Deligianni Advanced Energy Materials 2 (2), 253-259, 2012 | 676 | 2012 |
| Electrodeposited Cu2ZnSnSe4 thin film solar cell with 7% power conversion efficiency L Guo, Y Zhu, O Gunawan, T Gokmen, VR Deline, S Ahmed, ... Progress in Photovoltaics: Research and Applications 22 (1), 58-68, 2014 | 198 | 2014 |
| Self-assembly of vertically aligned nanorod supercrystals using highly oriented pyrolytic graphite S Ahmed, KM Ryan Nano letters 7 (8), 2480-2485, 2007 | 133 | 2007 |
| Controlled semiconductor nanorod assembly from solution: influence of concentration, charge and solvent nature A Singh, RD Gunning, S Ahmed, CA Barrett, NJ English, JA Garate, ... Journal of Materials Chemistry 22 (4), 1562-1569, 2012 | 100 | 2012 |
| Spontaneous Room Temperature Elongation of CdS and Ag2S Nanorods via Oriented Attachment C O’Sullivan, RD Gunning, A Sanyal, CA Barrett, H Geaney, FR Laffir, ... Journal of the American Chemical Society 131 (34), 12250-12257, 2009 | 98 | 2009 |
| The next frontier: electrodeposition for solar cell fabrication H Deligianni, S Ahmed, LT Romankiw The Electrochemical Society Interface 20 (2), 47, 2011 | 79 | 2011 |
| Electrochemical characterization of thin film electrodes toward developing a DNA transistor S Harrer, S Ahmed, A Afzali-Ardakani, B Luan, PS Waggoner, X Shao, ... Langmuir 26 (24), 19191-19198, 2010 | 54 | 2010 |
| Electrodeposition of indium on copper for CIS and CIGS solar cell applications Q Huang, K Reuter, S Amhed, L Deligianni, LT Romankiw, S Jaime, ... Journal of The Electrochemical Society 158 (2), D57, 2010 | 53 | 2010 |
| Impurities in the electroplated sub-50 nm Cu lines: The effects of the plating additives Q Huang, A Avekians, S Ahmed, C Parks, B Baker-O'Neal, S Kitayaporn, ... Journal of The Electrochemical Society 161 (9), D388, 2014 | 52 | 2014 |
| Centimetre scale assembly of vertically aligned and close packed semiconductor nanorods from solution S Ahmed, KM Ryan Chemical Communications, 6421-6423, 2009 | 51 | 2009 |
| Gold tip formation on perpendicularly aligned semiconductor nanorod assemblies C O'Sullivan, S Ahmed, KM Ryan Journal of Materials Chemistry 18 (43), 5218-5222, 2008 | 48 | 2008 |
| Real time observation by atomic force microscopy of spontaneous recrystallization at room temperature in electrodeposited copper metallization DN Buckley, S Ahmed Electrochemical and solid-state letters 6 (3), C33, 2003 | 40 | 2003 |
| Investigation of stress and morphology in electrodeposited copper nanofilms by cantilever beam method and in situ electrochemical atomic force microscopy S Ahmed, TT Ahmed, M O’Grady, S Nakahara, DN Buckley Journal of Applied Physics 103 (7), 2008 | 27 | 2008 |
| A model for spontaneous morphology change in electrodeposited metal films during room-temperature aging S Nakahara, S Ahmed, DN Buckley Electrochemical and solid-state letters 10 (2), D17, 2006 | 25 | 2006 |
| The evolution of pseudo-spherical silicon nanocrystals to tetrahedra, mediated byphosphonic acid surfactants CA Barrett, C Dickinson, S Ahmed, T Hantschel, K Arstila, KM Ryan Nanotechnology 20 (27), 275605, 2009 | 24 | 2009 |
| Close‐Packed Gold‐Nanocrystal Assemblies Deposited with Complete Selectivity into Lithographic Trenches S Ahmed, KM Ryan Advanced Materials 20 (24), 4745-4750, 2008 | 24 | 2008 |
| Study of the wear behaviour of Al–4.5% Cu–3.4% Fe in situ composite: Effect of thermal and mechanical processing S Ahmed, A Haseeb, ASW Kurny Journal of Materials Processing Technology 182 (1-3), 327-332, 2007 | 24 | 2007 |
| Water dispersible semiconductor nanorod assemblies via a facile phase transfer and their application as fluorescent biomarkers A Sanyal, T Bala, S Ahmed, A Singh, AV Piterina, TM McGloughlin, ... Journal of Materials Chemistry 19 (47), 8974-8981, 2009 | 22 | 2009 |
| Vacancy-induced plastic deformation in electrodeposited copper films S Nakahara, S Ahmed, TT Ahmed, DN Buckley Journal of The Electrochemical Society 154 (3), D145, 2007 | 16 | 2007 |
| An isothermal annealing study of spontaneous morphology change in electrodeposited copper metallization S Ahmed, DN Buckley, S Nakahara, TT Ahmed, Y Kuo Journal of The Electrochemical Society 154 (3), D103, 2007 | 14 | 2007 |
Oki GunawanResearch Staff Member IBM, Princeton UniversityPreverjeni e-poštni naslov na us.ibm.com
