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Soavtorji
C.S. LeeCity University of Hong KongPreverjeni e-poštni naslov na cityu.edu.hk- CHEN Xianfeng (Michael)Institute for Bioengineering, School of Engineering, The University of EdinburghPreverjeni e-poštni naslov na ed.ac.uk
- Juan Antonio ZapienCity Uniiversity of Hong KongPreverjeni e-poštni naslov na cityu.edu.hk
- Chundong WangProfessor at Huazhong University of Science and TechnologyPreverjeni e-poštni naslov na hust.edu.cn
- NG Tsz-WaiCity University of Hong KongPreverjeni e-poštni naslov na cityu.edu.hk
- zhenyu.zhangDoctor of Chongqing Communication InstitutePreverjeni e-poštni naslov na cqu.edu.cn
- Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学微电子学院教授)Preverjeni e-poštni naslov na hfut.edu.cn
- Shuilin WuCity University of Hong KongPreverjeni e-poštni naslov na my.cityu.edu.hk
- Zhubing HESouthern University of Science and TechnologyPreverjeni e-poštni naslov na sustc.edu.cn
- Xin JiangProfessor, University of SiegenPreverjeni e-poštni naslov na uni-siegen.de
- CHENG JunyeShenzhen MSU-BIT UniversityPreverjeni e-poštni naslov na smbu.edu.cn
- Wenyue LiMoses Lake Industries Inc.Preverjeni e-poštni naslov na mlindustries.com
- Xiaoyue ZhuUniversity of Rhode IslandPreverjeni e-poštni naslov na uri.edu
- Guo HongCity University of Hong KongPreverjeni e-poštni naslov na cityu.edu.hk
- Kaili ZhangProfessor, Dept. of Mechanical Engineering, City University of Hong KongPreverjeni e-poštni naslov na cityu.edu.hk
- Hong-En Wang（王洪恩）Yunnan Normal University（云南师范大学）Preverjeni e-poštni naslov na ynnu.edu.cn
- Jinfeng ZhangSchool of Life Science, Beijing Institute of TechnologyPreverjeni e-poštni naslov na bit.edu.cn
- Chaoping LiuShantou UniversityPreverjeni e-poštni naslov na stu.edu.cn
- Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionPreverjeni e-poštni naslov na tx.technion.ac.il
- Shrawan Kumar Jha, PhD, SMIEEEImperial College LondonPreverjeni e-poštni naslov na imperial.ac.uk
