Katayun Barmak

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Kevin R CoffeyUniversity of Central FloridaPreverjeni e-poštni naslov na ucf.edu
James C. HoneDepartment of Mechanical Engineering, Columbia UniversityPreverjeni e-poštni naslov na columbia.edu
L. H. LewisDistinguished University Professor, Northeastern UniversityPreverjeni e-poštni naslov na northeastern.edu
Jeffrey RickmanPreverjeni e-poštni naslov na lehigh.edu
Andrew P. Warren, PhDPlasmonics inc.Preverjeni e-poštni naslov na plasmonics-inc.com
Bumho KimUniversity of PennsylvaniaPreverjeni e-poštni naslov na sas.upenn.edu
Daniel RhodesUniversity of Wisconsin - MadisonPreverjeni e-poštni naslov na wisc.edu
Kenji WatanabeNational Institute for Materials SciencePreverjeni e-poštni naslov na nims.go.jp
Song LiuColumbia UniversityPreverjeni e-poštni naslov na columbia.edu
Anthony RollettProfessor of Materials Science and Engineering, Carnegie Mellon UniversityPreverjeni e-poštni naslov na andrew.cmu.edu
AmirAli ZangiabadiColumbia UniversityPreverjeni e-poštni naslov na columbia.edu
T.TaniguchiNational Institute for Materials SciencePreverjeni e-poštni naslov na nims.go.jp
Michael F ToneyUniversity of Colorado BoulderPreverjeni e-poštni naslov na colorado.edu
Luke N. HoltzmanColumbia UniversityPreverjeni e-poštni naslov na columbia.edu
Abhay PasupathyProfessor of Physics, Columbia University and Group Leader, Brookhaven National LaboratoryPreverjeni e-poštni naslov na columbia.edu
Gregory S RohrerCarnegie Mellon UniversityPreverjeni e-poštni naslov na andrew.cmu.edu
Cory R. DeanColumbia UnviersityPreverjeni e-poštni naslov na phys.columbia.edu
Dooho ChoiGachon UniversityPreverjeni e-poštni naslov na gachon.ac.kr
L.A. ClevengerIBM ResearchPreverjeni e-poštni naslov na us.ibm.com
Elyse BarréLawrence Berkeley National LaboratoryPreverjeni e-poštni naslov na lbl.gov

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Katayun Barmak

Druga imenaKatayun Barmak Vaziri

Philips Electronics Professor, Dept. of Applied Physics and Applied Mathematics, Columbia University

Preverjeni e-poštni naslov na columbia.edu - Domača stran

thin metallic films phase transformations grain growth 2D Materials


Naslov Razvrsti po navedbah Razvrsti po letniku Razvrsti po naslovu	Navedeno Navedeno	Leto
Simulation of Hubbard model physics in WSe₂/WS₂ moiré superlattices Y Tang, L Li, T Li, Y Xu, S Liu, K Barmak, K Watanabe, T Taniguchi, ... Nature 579 (7799), 353-358, 2020	831	2020
On the relationship of high coercivity and ordered phase in CoPt and FePt thin films RA Ristau, K Barmak, LH Lewis, KR Coffey, JK Howard Journal of applied physics 86 (8), 4527-4533, 1999	416	1999
Advancements in the treatment and processing of electronic waste with sustainability: a review of metal extraction and recovery technologies E Hsu, K Barmak, AC West, AHA Park Green chemistry 21 (5), 919-936, 2019	374	2019
Deterministic coupling of site-controlled quantum emitters in monolayer WSe₂ to plasmonic nanocavities Y Luo, GD Shepard, JV Ardelean, DA Rhodes, B Kim, K Barmak, JC Hone, ... Nature nanotechnology 13 (12), 1137-1142, 2018	279	2018
On the relationship of magnetocrystalline anisotropy and stoichiometry in epitaxial L10 CoPt (001) and FePt (001) thin films K Barmak, J Kim, LH Lewis, KR Coffey, MF Toney, AJ Kellock, JU Thiele Journal of Applied Physics 98 (3), 2005	252	2005
Surface and grain-boundary scattering in nanometric Cu films T Sun, B Yao, AP Warren, K Barmak, MF Toney, RE Peale, KR Coffey Physical Review B—Condensed Matter and Materials Physics 81 (15), 155454, 2010	248	2010
Investigating the thermodynamics and kinetics of thin film reactions by differential scanning calorimetry C Michaelsen, K Barmak, TP Weihs Journal of Physics D: Applied Physics 30 (23), 3167, 1997	246	1997
The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films LA Clevenger, A Mutscheller, JME Harper, C Cabral Jr, K Barmak Journal of Applied Physics 72 (10), 4918-4924, 1992	241	1992
Approaching the intrinsic limit in transition metal diselenides via point defect control D Edelberg, D Rhodes, A Kerelsky, B Kim, J Wang, A Zangiabadi, C Kim, ... Nano letters 19 (7), 4371-4379, 2019	231	2019
Infrared Interlayer Exciton Emission in Heterostructures O Karni, E Barré, SC Lau, R Gillen, EY Ma, B Kim, K Watanabe, ... Physical review letters 123 (24), 247402, 2019	187	2019
Scalable,“Dip‐and‐Dry” Fabrication of a Wide‐Angle Plasmonic Selective Absorber for High‐Efficiency Solar–Thermal Energy Conversion J Mandal, D Wang, AC Overvig, NN Shi, D Paley, A Zangiabadi, Q Cheng, ... Advanced Materials 29 (41), 1702156, 2017	158	2017
Experimental evidence for nucleation during thin‐film reactions KR Coffey, LA Clevenger, K Barmak, DA Rudman, CV Thompson Applied physics letters 55 (9), 852-854, 1989	151	1989
Dominant role of grain boundary scattering in the resistivity of nanometric Cu films T Sun, B Yao, AP Warren, K Barmak, MF Toney, RE Peale, KR Coffey Physical Review B—Condensed Matter and Materials Physics 79 (4), 041402, 2009	148	2009
Reactive phase formation in sputter-deposited Ni/Al multilayer thin films K Barmak, C Michaelsen, G Lucadamo Journal of materials research 12 (1), 133-146, 1997	148	1997
The early stages of solid‐state reactions in Ni/Al multilayer films C Michaelsen, G Lucadamo, K Barmak Journal of applied physics 80 (12), 6689-6698, 1996	146	1996
Failure of semiclassical models to describe resistivity of nanometric, polycrystalline tungsten films D Choi, X Liu, PK Schelling, KR Coffey, K Barmak Journal of Applied Physics 115 (10), 2014	140	2014
Inspired by nature: investigating tetrataenite for permanent magnet applications LH Lewis, A Mubarok, E Poirier, N Bordeaux, P Manchanda, A Kashyap, ... Journal of Physics: Condensed Matter 26 (6), 064213, 2014	139	2014
On the use of alloying elements for Cu interconnect applications K Barmak, C Cabral, KP Rodbell, JME Harper Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2006	139	2006
Phase, grain structure, stress, and resistivity of sputter-deposited tungsten films D Choi, B Wang, S Chung, X Liu, A Darbal, A Wise, NT Nuhfer, K Barmak, ... Journal of Vacuum Science & Technology A 29 (5), 2011	134	2011
Grain growth and the puzzle of its stagnation in thin films: The curious tale of a tail and an ear K Barmak, E Eggeling, D Kinderlehrer, R Sharp, S Ta’asan, AD Rollett, ... Progress in Materials Science 58 (7), 987-1055, 2013	119	2013

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