| Thermal performances and annual damages comparison of MMC using reverse conducting IGBT and conventional IGBT module B Wang, L Wang, W Mu, M Qin, F Yang, J Liu, Y Tomoyuki, F Tatsuhiko IEEE Transactions on Power Electronics 36 (9), 9806-9825, 2021 | 47 | 2021 |
| Direct integration of optimized phase-change heat spreaders into SiC power module for thermal performance improvements under high heat flux W Mu, L Wang, B Wang, T Zhang, F Yang, Y Gan, H Zhang IEEE transactions on power electronics 37 (5), 5398-5410, 2021 | 35 | 2021 |
| Air-cooling system optimization for IGBT modules in MMC using embedded O-shaped heat pipes B Wang, L Wang, F Yang, W Mu, M Qin, F Zhang, D Ma, J Wang, J Liu IEEE journal of emerging and selected topics in power electronics 9 (4 …, 2021 | 33 | 2021 |
| An ultrahigh step-down DC–DC converter based on switched-capacitor and coupled inductor techniques L Yu, L Wang, W Mu, C Yang IEEE Transactions on Industrial Electronics 69 (11), 11221-11230, 2021 | 31 | 2021 |
| A hybrid gallium-nitride–silicon direct-injection universal power flow and quality control circuit with reduced magnetics M Lu, M Qin, W Mu, J Fang, SM Goetz IEEE Transactions on Industrial Electronics, 2024 | 10 | 2024 |
| An evaluation on thermal performance improvements for sic power module integrated with vapor chamber in mmc B Wang, L Wang, S Wu, Z Hou, W Mu, F Yang, J Liu, Y Gan IEEE journal of emerging and selected topics in power electronics 10 (5 …, 2021 | 8 | 2021 |
| Symmetric four-phase inverse coupled inductors for GaN-based interleaving four-phase point-of-load converters L Yu, W Mu, C Yang, L Zhu, Z Qi, L Wang, Y Yao, Y Su, C Zhang 2021 IEEE Energy Conversion Congress and Exposition (ECCE), 5453-5458, 2021 | 5 | 2021 |
| Comparative study of thermal performance of a SiC MOSFET power module integrated with vapor chamber for traction inverter applications W Mu, B Wang, S Wang, H Jin, H Li, L Wang 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2021 | 5 | 2021 |
| Differential Detection of Feeder and Mesh Impedances Through a Series–Parallel Direct-Injection Soft Open Point M Lu, W Mu, M Qin, A Koehler, J Fang, SM Goetz IEEE Transactions on Power Electronics, 2024 | 4 | 2024 |
| A review of partial discharge in medium voltage SiC power modules under square wave excitation: Characterization, mitigation, and detection L Wang, J Gong, T Long, Y Wang, H Zheng, B Hu, W Mu, J Li, Z Zeng IEEE Journal of Emerging and Selected Topics in Power Electronics, 2024 | 4 | 2024 |
| Substrate Embedded Power Electronics Packaging for Silicon Carbide mosfets A Janabi, L Shillaber, W Ying, W Mu, B Hu, Y Jiang, N Iosifidis, L Ran, ... IEEE Transactions on Power Electronics, 2024 | 3 | 2024 |
| An Integrated GaN-Based Converter Based on Cooling-System-Inductor Structure for point-of-load converters L Yu, W Mu, H Li, C Yang, C Wang, L Wang 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2021 | 3 | 2021 |
| Grid impedance estimation and decoupling through a series–parallel direct-injection soft open point M Lu, W Mu, M Qin, J Fang, SM Goetz 2024 IEEE 10th International Power Electronics and Motion Control Conference …, 2024 | 2 | 2024 |
| An integrated planar inductor based on a novel magnetic core structure S Feng, Y Gan, L Yu, H Li, C Li, W Mu 2021 IEEE Energy Conversion Congress and Exposition (ECCE), 5496-5500, 2021 | 2 | 2021 |
| Simplified Discrete-Time Modeling for Convenient Stability Prediction of DAB Converter in Energy Storage System Z Xiao, W Lei, G Gao, H Wang, W Mu IEEE Transactions on Power Electronics, 2024 | 1 | 2024 |
| Directly Integrated Vapor Chamber as an Efficient Heat Spreader for High Heat Flux Density SiC MOSFET Dies in Power Modules W Mu, B Wang, S Wang, F Yang, D Ma, L Wang 2021 IEEE Energy Conversion Congress and Exposition (ECCE), 5642-5649, 2021 | 1 | 2021 |
| Near Junction Integration of Vapor Chamber for Transient Thermal Performance Improvements of SiC Power Module W Mu, L Wang, H Jin, B Hu, B Wang, J Zhang, L Wang, T Long IEEE Open Journal of Power Electronics, 2025 | | 2025 |
| A 3-D GaN-Based PoL Converters Based on the Planar Magnetic Component with Distributed Air Gap and High Thermal Conductivity L Yu, W Mu, S Zhao, X Song, Y Hao, J Zhang IEEE Journal of Emerging and Selected Topics in Power Electronics, 2024 | | 2024 |
| Separate Detection of Feeder and Mesh Impedances through a Series-Parallel Direct-Injection Soft Open Point Circuit M Lu, W Mu, M Qin, A Koehler, J Fang, S Goetz Authorea Preprints, 2024 | | 2024 |
| Forced Fluorinated Liquid Cooling for Medium Voltage SiC Power Modules: Concurrently Addressing Electrical and Thermal Challenges L Wang, H Zheng, Y Wang, J Gong, B Hu, W Mu, J Li, T Long, Z Zeng IEEE Transactions on Power Electronics, 2024 | | 2024 |
Fengtao yangXi'an Jiaotong UniversityВерификована је имејл адреса на stu.xjtu.edu.cn
