| Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology V Suntharalingam, R Berger, JA Burns, CK Chen, CL Keast, JM Knecht, ... ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State …, 2005 | 415 | 2005 |
| A wafer-scale 3-D circuit integration technology JA Burns, BF Aull, CK Chen, CL Chen, CL Keast, JM Knecht, ... IEEE Transactions on Electron Devices 53 (10), 2507-2516, 2006 | 361 | 2006 |
| 3D integrated superconducting qubits D Rosenberg, D Kim, R Das, D Yost, S Gustavsson, D Hover, P Krantz, ... npj quantum information 3 (1), 42, 2017 | 245 | 2017 |
| Solid-state qubits integrated with superconducting through-silicon vias DRW Yost, ME Schwartz, J Mallek, D Rosenberg, C Stull, JL Yoder, ... npj Quantum Information 6 (1), 59, 2020 | 123 | 2020 |
| Qubit and coupler circuit structures and coupling techniques WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker US Patent 10,134,972, 2018 | 117 | 2018 |
| High-speed Schottky-barrier pMOSFET with f/sub T/= 280 GHz M Fritze, CL Chen, S Calawa, D Yost, B Wheeler, P Wyatt, CL Keast, ... IEEE Electron Device Letters 25 (4), 220-222, 2004 | 114 | 2004 |
| Laser radar imager based on 3D integration of Geiger-mode avalanche photodiodes with two SOI timing circuit layers B Aull, J Burns, C Chen, B Felton, H Hanson, C Keast, J Knecht, A Loomis, ... 2006 IEEE International Solid State Circuits Conference-Digest of Technical …, 2006 | 105 | 2006 |
| Low-temperature oxide-bonded three-dimensional integrated circuits Warner, Burns, Keast, Kunz, Lennon, Loomis, Mowers, Yost 2002 IEEE International SOI Conference, 123-124, 2002 | 87 | 2002 |
| 100-nm node lithography with KrF? M Fritze, B Tyrrell, DK Astolfi, D Yost, P Davis, B Wheeler, RD Mallen, ... Optical Microlithography XIV 4346, 191-204, 2001 | 83 | 2001 |
| Interconnect structures and methods for fabricating interconnect structures WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker US Patent 10,121,754, 2018 | 66 | 2018 |
| Solid-state qubits: 3D integration and packaging D Rosenberg, SJ Weber, D Conway, DRW Yost, J Mallek, G Calusine, ... IEEE Microwave Magazine 21 (8), 72-85, 2020 | 63 | 2020 |
| Cryogenic qubit integration for quantum computing RN Das, JL Yoder, D Rosenberg, DK Kim, D Yost, J Mallek, D Hover, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 504-514, 2018 | 55 | 2018 |
| Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker US Patent 10,396,269, 2019 | 52 | 2019 |
| High-performance fully-depleted SOI RF CMOS CL Chen, SJ Spector, RM Blumgold, RA Neidhard, WT Beard, DR Yost, ... IEEE Electron Device Letters 23 (1), 52-54, 2002 | 46 | 2002 |
| Subwavelength optical lithography with phase-shift photomasks M Fritze, BM Tyrrell, DK Astolfi, RD Lambert, DRW Yost, AR Forte, ... Lincoln Laboratory Journal 14 (2), 237-250, 2003 | 43 | 2003 |
| Low polarization dependent diffraction grating for wavelength demultimlexing E Popov, J Hoose, B Frankel, C Keast, M Fritze, TY Fan, D Yost, S Rabe Optics Express 12 (2), 269-275, 2004 | 42 | 2004 |
| 3D integration and measurement of a semiconductor double quantum dot with a high-impedance TiN resonator N Holman, D Rosenberg, D Yost, JL Yoder, R Das, WD Oliver, ... npj Quantum Information 7 (1), 137, 2021 | 31 | 2021 |
| Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits CL Chen, DR Yost, JM Knecht, DC Chapman, DC Oakley, LJ Mahoney, ... 2009 IEEE International Conference on 3D System Integration, 1-4, 2009 | 29 | 2009 |
| Fabrication of superconducting through-silicon vias JL Mallek, DRW Yost, D Rosenberg, JL Yoder, G Calusine, M Cook, ... arXiv preprint arXiv:2103.08536, 2021 | 27 | 2021 |
| Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure RN Das, DRW Yost, C Chen, K Warner, SA Vitale, MA Gouker, CL Keast US Patent 10,418,350, 2019 | 25 | 2019 |