Compact and broad-band three-dimensional MMIC balun K Nishikawa, I Toyoda, T Tokumitsu IEEE transactions on microwave theory and techniques 47 (1), 96-98, 1999 | 101 | 1999 |
A 60-GHz multilayer parasitic microstrip array antenna on LTCC substrate for system-on-package T Seki, N Honma, K Nishikawa, K Tsunekawa IEEE microwave and wireless components letters 15 (5), 339-341, 2005 | 99 | 2005 |
Millimeter-wave high-efficiency multilayer parasitic microstrip antenna array on teflon substrate T Seki, N Honma, K Nishikawa, K Tsunekawa IEEE Transactions on Microwave Theory and Techniques 53 (6), 2101-2106, 2005 | 89 | 2005 |
Three-dimensional passive circuit technology for ultra-compact MMICs H Hirano, K Nishikawa, I Toyoda, S Aoyama, S Sugitani, K Yamasaki IEEE Transactions on Microwave Theory and Techniques 43 (12), 2845-2850, 1995 | 81 | 1995 |
High frequency masterslice monolithic integrated circuit I Toyoda, T Tokumitsu, K Nishikawa, K Kamogawa US Patent 5,739,560, 1998 | 73 | 1998 |
A broadband and miniaturized V-band PHEMT frequency doubler B Piernas, H Hayashi, K Nishikawa, K Kamogawa, T Nakagawa IEEE Microwave and guided wave letters 10 (7), 276-278, 2000 | 56 | 2000 |
Miniaturized Wilkinson power divider using three-dimensional MMIC technology K Nishikawa, T Tokumitsu, I Toyoda IEEE microwave and guided wave letters 6 (10), 372-374, 1996 | 56 | 1996 |
A compact and low-phase-noise Ka-band pHEMT-based VCO B Piernas, K Nishikawa, T Nakagawa, K Araki IEEE transactions on microwave theory and techniques 51 (3), 778-783, 2003 | 53 | 2003 |
Three-dimensional masterslice MMIC on Si substrate I Toyoda, K Nishikawa, T Tokumitsu, K Kamogawa, C Yamaguchi, ... IEEE transactions on microwave theory and techniques 45 (12), 2524-2530, 1997 | 48 | 1997 |
Development of class-F load rectennas K Hatano, N Shinohara, T Mitani, K Nishikawa, T Seki, K Hiraga 2011 IEEE MTT-S International Microwave Workshop Series on Innovative …, 2011 | 46 | 2011 |
Development of 24 GHz rectennas for fixed wireless access N Shinohara, K Nishikawa, T Seki, K Hiraga 2011 XXXth URSI General Assembly and Scientific Symposium, 1-4, 2011 | 45 | 2011 |
Three-dimensional MMIC technology for low-cost millimeter-wave MMICs K Nishikawa, K Kamogawa, B Piernas, M Tokumitsu, S Sugitani, I Toyoda, ... IEEE Journal of Solid-State Circuits 36 (9), 1351-1359, 2001 | 44 | 2001 |
High-Q factor three-dimensional inductors B Piernas, K Nishikawa, K Kamogawa, T Nakagawa, K Araki IEEE Transactions on Microwave Theory and Techniques 50 (8), 1942-1949, 2002 | 43 | 2002 |
Highly integrated three-dimensional MMIC technology applied to novel masterslice GaAs-and Si-MMICs T Tokumitsu, N Hirano, K Yamasaki, C Yamaguchi, K Nishikawa, ... IEEE Journal of Solid-State Circuits 32 (9), 1334-1341, 1997 | 41 | 1997 |
Multilayer transmission line using ground metal with slit, and hybrid using the transmission line K Nishikawa, I Toyoda, T Tokumitsu, K Kamogawa US Patent 5,634,208, 1997 | 40 | 1997 |
An MMIC low-distortion variable-gain amplifier using active feedback K Nishikawa, T Tokumitsu IEEE Transactions on Microwave Theory and Techniques 43 (12), 2812-2816, 1995 | 40 | 1995 |
60GHz monolithic LTCC module for wireless communication systems T Seki, K Nishikawa, Y Suzuki, I Toyoda, K Tsunekawa 2006 European Conference on Wireless Technology, 376-379, 2006 | 39 | 2006 |
Compact six-sector antenna employing three intersecting dual-beam microstrip Yagi–Uda arrays with common director N Honma, T Seki, K Nishikawa, K Tsunekawa, K Sawaya IEEE transactions on antennas and propagation 54 (11), 3055-3062, 2006 | 38 | 2006 |
A novel high-Q and wide-frequency-range inductor using Si 3-D MMIC technology K Kamogawa, K Nishikawa, I Toyoda, T Tokumitsu, M Tanaka IEEE microwave and guided wave letters 9 (1), 16-18, 1999 | 36 | 1999 |
Miniaturized millimeter-wave masterslice 3-D MMIC amplifier and mixer K Nishikawa, K Kamogawa, R Inoue, K Onodera, T Tokumitsu, M Tanaka, ... IEEE transactions on microwave theory and techniques 47 (9), 1856-1862, 1999 | 34 | 1999 |