| The metal-insulator-metal diodes for infrared energy harvesting and detection applications EG Arsoy, M Inac, A Shafique, M Ozcan, Y Gurbuz Infrared Technology and Applications XLII 9819, 93-97, 2016 | 16 | 2016 |
| Performance comparison of broadband traveling wave amplifiers in 130-nm SiGe: C SG13G2 and SG13G3 BiCMOS technologies M Inac, A Fatemi, F Korndörfer, H Rücker, F Gerfers, A Malignaggi IEEE Microwave and Wireless Components Letters 31 (6), 744-747, 2021 | 14 | 2021 |
| BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications M Inac, M Wietstruck, A Göritz, B Cetindogan, C Baristiran-Kaynak, ... Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 786-791, 2017 | 13 | 2017 |
| 0.13-μm SiGe BiCMOS technology with More-than-Moore modules M Kaynak, M Wietstruck, A Göritz, ST Wipf, M Inac, B Cetindogan, C Wipf, ... Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2017 IEEE, 62-65, 2017 | 12 | 2017 |
| Device characteristics of antenna-coupled metal-insulator-metal diodes (rectenna) using Al2O3, TiO2, and Cr2O3 as insulator layer for energy harvesting applications M Inac, A Shafique, M Ozcan, Y Gurbuz Thin Films for Solar and Energy Technology VII 9561, 61-64, 2015 | 11 | 2015 |
| Lumped Ultra-Broadband Linear Driver in 130 nm SiGe SG13G3 Technology F Iseini, A Malignaggi, F Korndörfer, M Inac, G Kahmen 2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and …, 2022 | 5 | 2022 |
| Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding M Inac, M Wietstruck, A Göritz, B Cetindogan, C Baristiran-Kaynak, ... Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th, 1-4, 2017 | 5 | 2017 |
| High-speed optical transceiver integrated chipset and module for on-board VCSEL-based satellite optical interconnects I Sourikopoulos, G Winzer, A Peczek, M Inac, P Ostrovskyy, ... International Conference on Space Optics—ICSO 2022 12777, 1966-1972, 2023 | 4 | 2023 |
| Monolithically Integrated Optoelectronic Transmitter based on Segmented Mach-Zehnder Modulator in EPIC 250 nm BiCMOS Technology F Iseini, M Inac, A Malignaggi, A Peczek, G Kahmen 2023 IEEE 23rd Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2023 | 4 | 2023 |
| Discrimination of Glioblastoma Cancer Stem Cells by measuring their UHF-Dielectrophoresis Crossover Frequency R Manczak, S Saada, C Dalmay, B Bessette, G Begaud, S Battu, P Blondy, ... 2018 IEEE International Microwave Biomedical Conference (IMBioC), 130-132, 2018 | 4 | 2018 |
| Accurate Depth Control of Through-Silicon Vias by Substrate Integrated Etch Stop Layers M Wietstruck, S Marschmeyer, M Lisker, A Krueger, D Wolansky, P Kulse, ... Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 53-60, 2017 | 4 | 2017 |
| Model, design, and fabrication of antenna coupled metal-insulator-metal diodes for IR sensing M Inac, A Shafique, M Ozcan, Y Gurbuz Infrared Technology and Applications XLI 9451, 421-424, 2015 | 4 | 2015 |
| Tracking cancer cells with microfluidic high frequency DEP cytometer implemented on BiCMOS lab-on-chip platform R Manczak, F Hjeij, T Provent, S Saada, C Dalmay, B Bessette, G Bégaud, ... 2018 IEEE/MTT-S International Microwave Symposium-IMS, 104-107, 2018 | 3 | 2018 |
| Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology M Wietstruck, S Marschmeyer, M Lisker, A Krüger, D Wolansky, ... Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th, 1-6, 2017 | 3 | 2017 |
| First 100 Gb/s monolithically integrated electronic-photonic coherent receiver with direct edge coupling to standard single mode fiber array A Osman, G Winzer, C Mai, A Peczek, K Voigt, W Dorward, S Lischke, ... 2023 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2023 | 2 | 2023 |
| Tunable and Highly Power Efficient Traveling Wave Amplifier in SiGe BiCMOS for Optical Modulators M Inac, F Korndoerfer, F Gerfers, A Malignaggi 2023 IEEE 23rd Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2023 | 2 | 2023 |
| Compact and Transfer Printable 64 Gb/s Differential Transimpedance Amplifier in 130-nm BiCMOS M Inac, A Fatemi, F Gerfers, A Malignaggi 2020 15th European Microwave Integrated Circuits Conference (EuMIC), 292-295, 2021 | 2 | 2021 |
| Inductorless 96 Gb/s PAM-4 Optical Modulators Driver in SiGe: C BiCMOS M Inac, A Peczek, F Gerfers, A Malignaggi 2022 17th European Microwave Integrated Circuits Conference (EuMIC), 284-287, 2022 | 1 | 2022 |
| The Effect of Surface Optimization on Post-grinding Yield of 200 mm Wafer Level Packaging Applications M Inac, M Wietstruck, A Göritz, B Cetindogan, C Baristiran-Kaynak, ... 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-4, 2018 | 1 | 2018 |
| 200 mm Wafer level graphene transfer by wafer bonding technique M Inac, G Lupina, M Wietstruck, M Lisker, M Fraschke, A Mai, F Coccetti, ... Solid-State Device Research Conference (ESSDERC), 2017 47th European, 216-219, 2017 | 1 | 2017 |