| PVP-mediated galvanic replacement synthesis of smart elliptic Cu–Ag nanoflakes for electrically conductive pastes Y Zhang, P Zhu, G Li, Z Cui, C Cui, K Zhang, J Gao, X Chen, G Zhang, ... ACS applied materials & interfaces 11 (8), 8382-8390, 2019 | 42 | 2019 |
| Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study D Hu, Z Cui, J Fan, X Fan, G Zhang Results in Physics 19, 103486, 2020 | 40 | 2020 |
| General coupling model for electromigration and one-dimensional numerical solutions Z Cui, X Fan, G Zhang Journal of Applied Physics 125 (10), 2019 | 27 | 2019 |
| The influence of tilt grain boundaries on the mechanical properties of bicrystalline graphene nanoribbons N Xu, JG Guo, Z Cui Physica E: Low-dimensional Systems and Nanostructures 84, 168-174, 2016 | 26 | 2016 |
| Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis H Tang, D Hu, Z Cui, H Ye, G Zhang The Journal of Physical Chemistry C 125 (4), 2680-2690, 2021 | 22 | 2021 |
| Molecular dynamic study for concentration-dependent volume relaxation of vacancy Z Cui, X Fan, G Zhang Microelectronics Reliability 120, 114127, 2021 | 17 | 2021 |
| Hydrolysis kinetic study of CaAlSiN3: Eu2+ red phosphor with both water immersion test and first-principles calculation J Fan, L Zhou, Z Cui, S Chen, X Fan, G Zhang Journal of Luminescence 219, 116874, 2020 | 17 | 2020 |
| Theoretical investigations of the interfacial sliding and buckling of graphene on a flexible substrate Z Cui, JG Guo AIP Advances 6 (12), 2016 | 13 | 2016 |
| Coupling model of electromigration and experimental verification–Part I: Effect of atomic concentration gradient Z Cui, X Fan, Y Zhang, S Vollebregt, J Fan, G Zhang Journal of the Mechanics and Physics of Solids 174, 105257, 2023 | 11 | 2023 |
| Implementation of general coupling model of electromigration in ANSYS Z Cui, X Fan, G Zhang 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1632-1637, 2020 | 11 | 2020 |
| The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: A first principles study Z Cui, J Fan, HJ van Ginkel, X Fan, G Zhang Applied Surface Science 510, 145251, 2020 | 11 | 2020 |
| Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation Z Cui, Y Zhang, D Hu, S Vollebregt, J Fan, X Fan, G Zhang Journal of Physics: Condensed Matter 34 (17), 175401, 2022 | 9 | 2022 |
| Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study D Hu, T Gu, Z Cui, S Vollebregt, X Fan, G Zhang, J Fan Corrosion Science 192, 109846, 2021 | 9 | 2021 |
| Multi-physics driven electromigration study: multi-scale modeling and experiment Z Cui | 9 | 2021 |
| Coupling model of electromigration and experimental verification–Part II: Impact of thermomigration Z Cui, X Fan, Y Zhang, S Vollebregt, J Fan, G Zhang Journal of the Mechanics and Physics of Solids 174, 105256, 2023 | 7 | 2023 |
| Implementation of fully coupled electromigration theory in COMSOL Z Cui, X Fan, G Zhang 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 233-238, 2022 | 7 | 2022 |
| Sulfur-rich ageing mechanism of silicone encapsulant used in LED packaging: An experimental and molecular dynamic simulation study W Chen, Y Chen, Y Cao, Z Cui, X Fan, G Zhang, J Fan Frontiers in Materials 9, 819294, 2022 | 5 | 2022 |
| Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages Z Cui, X Chen, X Fan, G Zhang 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 3 | 2018 |
| Electromigration-induced local dewetting in Cu films Y Zhang, J Mo, Z Cui, S Vollebregt, G Zhang 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE …, 2023 | 2 | 2023 |
| Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect Z Cui, X Fan, G Zhang 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1327-1331, 2023 | 1 | 2023 |