| A review of phase change materials for vehicle component thermal buffering NR Jankowski, FP McCluskey Applied energy 113, 1525-1561, 2014 | 511 | 2014 |
| Two-phase thermal ground planes: technology development and parametric results A Bar-Cohen, K Matin, N Jankowski, D Sharar Journal of Electronic Packaging 137 (1), 010801, 2015 | 115 | 2015 |
| Thermal performance of a flat polymer heat pipe heat spreader under high acceleration C Oshman, Q Li, LA Liew, R Yang, YC Lee, VM Bright, DJ Sharar, ... Journal of Micromechanics and Microengineering 22 (4), 045018, 2012 | 93 | 2012 |
| Numerical investigation and sensitivity analysis of manifold microchannel coolers L Boteler, N Jankowski, P McCluskey, B Morgan International Journal of Heat and Mass Transfer 55 (25-26), 7698-7708, 2012 | 90 | 2012 |
| Experimental evaluation of metallic phase change materials for thermal transient mitigation D Gonzalez-Nino, LM Boteler, D Ibitayo, NR Jankowski, D Urciuoli, ... International Journal of Heat and Mass Transfer 116, 512-519, 2018 | 78 | 2018 |
| Robust thermal performance of a flat-plate oscillating heat pipe during high-gravity loading SM Thompson, AA Hathaway, CD Smoot, CA Wilson, HB Ma, RM Young, ... | 68 | 2011 |
| Comparing microchannel technologies to minimize the thermal stack and improve thermal performance in hybrid electric vehicles NR Jankowski, L Everhart, B Morgan, B Geil, P McCluskey 2007 IEEE Vehicle Power and Propulsion Conference, 124-130, 2007 | 37 | 2007 |
| Review of two-phase electronics cooling for army vehicle applications D Sharar, NR Jankowski, B Morgan Army Research Laboratory, 2010 | 35 | 2010 |
| Thermal performance of a direct-bond-copper aluminum nitride manifold-microchannel cooler DJ Sharar, NR Jankowski, B Morgan 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010 | 33 | 2010 |
| Stereolithographically fabricated aluminum nitride microchannel substrates for integrated power electronics cooling NR Jankowski, L Everhart, BR Geil, CW Tipton, J Chaney, T Heil, ... 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 31 | 2008 |
| Manifold microchannel cooler for direct backside liquid cooling of SiC power devices L Everhart, N Jankowski, B Geil, A Bayba, D Ibitayo, P McCluskey International Conference on Nanochannels, Microchannels, and Minichannels …, 2007 | 31 | 2007 |
| The impact of GaN/substrate thermal boundary resistance on a HEMT device HC Nochetto, NR Jankowski, A Bar-Cohen ASME international mechanical engineering congress and exposition 54969, 241-249, 2011 | 29 | 2011 |
| Electrical supercooling mitigation in erythritol NR Jankowski, FP McCluskey International Heat Transfer Conference 49422, 409-416, 2010 | 29 | 2010 |
| Modeling transient thermal response of pulsed power electronic packages NR Jankowski, FP McCluskey 2009 IEEE Pulsed Power Conference, 820-825, 2009 | 25 | 2009 |
| Thermodynamic cycle optimization for pyroelectric energy conversion in the thin film regime BM Hanrahan, F Sze, AN Smith, NR Jankowski International Journal of Energy Research 41 (13), 1880-1890, 2017 | 24 | 2017 |
| Measurement of high-performance thermal interfaces using a reduced scale steady-state tester and infrared microscopy AN Smith, NR Jankowski, LM Boteler Journal of Heat Transfer 138 (4), 041301, 2016 | 24 | 2016 |
| GaN HEMT junction temperature dependence on diamond substrate anisotropy and thermal boundary resistance HC Nochetto, NR Jankowski, A Bar-Cohen 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), 1-4, 2012 | 22 | 2012 |
| Wireless power transmission via modulated laser irradiation of pyroelectric thin films B Hanrahan, C Neville, A Smith, N Ter‐Gabrielyan, N Jankowski, ... Advanced Materials Technologies 1 (9), 1600178, 2016 | 19 | 2016 |
| Process of forming an integrated multiplexed electrospray atomizer CM Waits, BR Geil, NR Jankowski US Patent 8,240,052, 2012 | 14 | 2012 |
| Kapitza resistance at the two-dimensional electron gas interface AA Wilson, NR Jankowski, F Nouketcha, R Tompkins 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 13 | 2019 |
Patrick McCluskeyProfessor, University of Maryland, College Parkยืนยันอีเมลแล้วที่ umd.edu