| AlAl thermocompression bonding for wafer-level MEMS sealing N Malik, K Schjølberg-Henriksen, E Poppe, MMV Taklo, TG Finstad Sensors and Actuators A: Physical 211, 115-120, 2014 | 72 | 2014 |
| Impact of SiO2 on Al–Al thermocompression wafer bonding N Malik, K Schjølberg-Henriksen, EU Poppe, MMV Taklo, TG Finstad Journal of Micromechanics and Microengineering 25 (3), 035025, 2015 | 26 | 2015 |
| Interfacial characterization of Al-Al thermocompression bonds N Malik, PA Carvalho, E Poppe, TG Finstad Journal of Applied Physics 119 (20), 2016 | 18 | 2016 |
| Low-temperature aluminum-aluminum wafer bonding B Rebhan, A Hinterreiter, N Malik, K Schjølberg-Henriksen, V Dragoi, ... ECS Transactions 75 (9), 15, 2016 | 15 | 2016 |
| Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding MS Goorsky, K Schjølberg-Henriksen, B Beekley, T Bai, K Mani, ... Japanese Journal of Applied Physics 57 (2S1), 02BC03, 2017 | 12 | 2017 |
| Environmental stress testing of wafer-level Au-Au thermocompression bonds realized at low temperature: Strength and hermeticity N Malik, HR Tofteberg, E Poppe, TG Finstad, K Schjølberg-Henriksen ECS Journal of Solid State Science and Technology 4 (7), P236, 2015 | 12 | 2015 |
| Hermeticity and reliability of Au-Au thermocompression bonds, realized at low temperature N Malik, H Tofteberg, E Poppe, TG Finstad, K Schjolberg-Henriksen ECS Transactions 64 (5), 167, 2014 | 8 | 2014 |
| Ultraviolet sensing properties of polyvinyl alcohol-coated aluminium-doped zinc oxide nanorods K Saxena, A Kumar, N Malik, P Kumar, VK Jain Bulletin of Materials Science 37, 295-300, 2014 | 6 | 2014 |
| Wafer level capping technology for vacuum packaging of microbolometers K Zoschke, CA Manier, H Oppermann, D Meier, N Malik, E Zakizade, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1571-1578, 2023 | 4 | 2023 |
| Al-Al wafer-level thermocompression bonding applied for MEMS MMV Taklo, K Schjolberg-Henriksen, N Malik, E Poppe, ST Moe, ... 2017 5th International Workshop on Low Temperature Bonding for 3D …, 2017 | 4 | 2017 |
| Hermeticity and reliability of Al-Al thermocompression wafer bonding N Malik, E Poppe, K Schjolberg-Henriksen, MMV Taklo, TG Finstad ECS Transactions 64 (5), 149, 2014 | 4 | 2014 |
| Low-temperature bonding technologies for MEMS and 3D-IC MMV Taklo, K Schjølberg-Henriksen, N Malik, HR Tofteberg, E Poppe, ... 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D …, 2014 | 4 | 2014 |
| Texture of Al films for wafer-level thermocompression bonding N Malik, V Venkatachalapathy, W Dall, K Schjølberg-Henriksen, E Poppe, ... Superlattices and Microstructures 106, 216-233, 2017 | 3 | 2017 |
| Environmental stress testing of wafer-level Al-Al thermocompression bonds: strength and hermeticity N Malik, E Poppe, K Schjølberg-Henriksen, MMV Taklo, TG Finstad ECS Journal of Solid State Science and Technology 4 (7), P251, 2015 | 3 | 2015 |
| The synergistic roles of temperature and pressure in thermo-compression bonding of Au P Ambhore, K Mani, B Beekley, N Malik, K Schjølberg-Henriksen, S Iyer, ... ECS Transactions 86 (5), 129, 2018 | 2 | 2018 |
| Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding K Schjølberg-Henriksen, N Malik, A Sandvand, G Kittilsland, ST Moe ECS Transactions 64 (5), 305, 2014 | 2 | 2014 |
| Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints K Schjølberg-Henriksen, N Malik, EV Gundersen, OR Christiansen, ... ECS Journal of Solid State Science and Technology 4 (7), P265, 2015 | 1 | 2015 |
| Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints K Schjølberg-Henriksen, N Malik, EV Gundersen, OR Christiansen, ... ECS Transactions 64 (5), 275, 2014 | 1 | 2014 |
Maaike Margrete Visser TakloResearch Manager, SINTEFยืนยันอีเมลแล้วที่ sintef.no