| Enhanced adhesion and anticorrosion of silk fibroin coated biodegradable Mg-Zn-Ca alloy via a two-step plasma activation H Fang, C Wang, S Zhou, Z Zheng, T Lu, G Li, Y Tian, T Suga Corrosion Science 168, 108466, 2020 | 44 | 2020 |
| Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture Q Kang, C Wang, S Zhou, G Li, T Lu, Y Tian, P He ACS Applied Materials & Interfaces 13 (32), 38866-38876, 2021 | 40 | 2021 |
| Exploration of the enhanced performances for silk fibroin/sodium alginate composite coatings on biodegradable Mg− Zn− Ca alloy H Fang, C Wang, S Zhou, G Li, Y Tian, T Suga Journal of Magnesium and Alloys 9 (5), 1578-1594, 2021 | 37 | 2021 |
| Single-crystalline SiC integrated onto Si-based substrates via plasma-activated direct bonding Q Kang, C Wang, F Niu, S Zhou, J Xu, Y Tian Ceramics International 46 (14), 22718-22726, 2020 | 34 | 2020 |
| Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices C Wang, H Fang, S Zhou, X Qi, F Niu, W Zhang, Y Tian, T Suga Journal of Materials Science & Technology 46, 156-167, 2020 | 27 | 2020 |
| High-Efficient Vacuum Ultraviolet-Ozone Assist-Deposited Polydopamine for Poly(lactic-co-glycolic acid)-Coated Pure Zn toward Biodegradable Cardiovascular … H Fang, X Qi, S Zhou, S Yang, C Hang, Y Tian, C Wang ACS Applied Materials & Interfaces 14 (2), 3536-3550, 2021 | 21 | 2021 |
| Low-temperature direct bonding of Si and quartz glass using the APTES modification J Xu, C Wang, S Zhou, R Zhang, Y Tian Ceramics International 45 (13), 16670-16675, 2019 | 21 | 2019 |
| Low-temperature Cu/SiO2 hybrid bonding using a novel two-step cooperative surface activation Q Kang, C Wang, G Li, S Zhou, Y Tian 2021 22nd International Conference on Electronic Packaging Technology (ICEPT …, 2021 | 19 | 2021 |
| Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste H Fang, C Wang, S Zhou, Q Kang, T Wang, D Yang, Y Tian, T Suga Journal of Materials Science: Materials in Electronics 31, 6497-6505, 2020 | 18 | 2020 |
| Fabrication of Ag@ Ag2O-MnOx composite nanowires for high-efficient room-temperature removal of formaldehyde H Fang, C Wang, D Li, S Zhou, Y Du, H Zhang, C Hang, Y Tian, T Suga Journal of Materials Science & Technology 91, 5-16, 2021 | 17 | 2021 |
| Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging H Fang, C Wang, T Wang, H Wang, S Zhou, Y Huang, Y Tian Materials Letters 256, 126620, 2019 | 10 | 2019 |
| A multifunctional osteogenic system of ultrasonically spray deposited bone-active coatings on plasma-activated magnesium H Fang, S Zhou, X Qi, C Wang, Y Tian Journal of Magnesium and Alloys 11 (8), 2719-2739, 2023 | 8 | 2023 |
| Direct heterogeneous bonding of SiC to Si, SiO2, and glass for high-performance power electronics and bio-MEMS J Xu, C Wang, Q Kang, S Zhou, Y Tian 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1266-1271, 2019 | 8 | 2019 |
| Moiré-based alignment using centrosymmetric grating marks for high-precision wafer bonding B Huang, C Wang, H Fang, S Zhou, T Suga Micromachines 10 (5), 339, 2019 | 8 | 2019 |
| One-step PDA coating strategy on pure Zn for blood-contacting engineering X Qi, S Zhou, H Fang, S Yang, C Hang, Y Tian, C Wang Journal of Materials Science & Technology 123, 78-91, 2022 | 7 | 2022 |
| Low-temperature direct and indirect bonding using plasma activation for 3D integration S Zhou, X Qi, Q Kang, C Wang 2020 IEEE International Conference on Integrated Circuits, Technologies and …, 2020 | 6 | 2020 |
| Biocompatible Core–Shell Microneedle Sensor Filled with Zwitterionic Polymer Hydrogel for Rapid Continuous Transdermal Monitoring S Zhou, Y Chino, T Kasama, R Miyake, S Mitsuzawa, Y Luan, NB Ahmad, ... ACS nano 18 (39), 26541-26559, 2024 | 3 | 2024 |
| Investigation of Plasma Activation Directions for Low-Damage Direct Bonding S Zhou, X Qi, H Fang, C Wang ECS Journal of Solid State Science and Technology 9 (8), 081004, 2020 | 3 | 2020 |
| Fabrication of SiC-on-insulator substrate via a low-temperature plasma activated bonding process Q Kang, C Wang, S Zhou, J Xu, R An, Y Tian 2019 20th International Conference on Electronic Packaging Technology (ICEPT …, 2019 | 3 | 2019 |
| Hybrid Plasma Activation Strategy for the Protein‐Coated Magnesium Implants in Orthopedic Applications H Fang, S Zhou, X Qi, Y Tian, C Wang Advanced Materials Interfaces 9 (9), 2101724, 2022 | 2 | 2022 |