| Molecular simulation of the plastic deformation and crack formation in single grit grinding of 4H-SiC single crystal S Gao, H Wang, H Huang, R Kang International Journal of Mechanical Sciences 247, 108147, 2023 | 82 | 2023 |
| Mechanical load-induced atomic-scale deformation evolution and mechanism of SiC polytypes using molecular dynamics simulation H Wang, S Gao, R Kang, X Guo, H Li Nanomaterials 12 (14), 2489, 2022 | 30 | 2022 |
| Influence of ingot rocking on the surface quality of multi-wire sawing monocrystalline silicon wafers Z Xu, Y Feng, L Pan, X Wang, H Wang, X Jia The International Journal of Advanced Manufacturing Technology 107, 15-24, 2020 | 14 | 2020 |
| Warping model of high-power IGBT modules subjected to reflow soldering process S Gao, R Wang, H Wang, R Kang International Journal of Mechanical Sciences 251, 108350, 2023 | 12 | 2023 |
| Atomic understanding of elastic-plastic deformation and crack evolution for single crystal AlN during nanoscratch S Gao, H Lang, H Wang, X Guo, R Kang Ceramics International 49 (22), 35357-35367, 2023 | 11 | 2023 |
| Environment-friendly chemical mechanical polishing using NaHCO3-activated H2O2 slurry for highly efficient finishing of 4H-SiC (0001) surface Y Shen, H Wang, X Guo, S Gao Journal of Manufacturing Processes 109, 213-221, 2024 | 10 | 2024 |
| Atomic understanding of the plastic deformation mechanism of 4H-SiC under different grain depth-of-cut during nano-grinding H Wang, S Gao, X Guo, Y Ding, R Kang Journal of Electronic Materials 52 (7), 4865-4877, 2023 | 8 | 2023 |
| Experimental research on hole wall integrity of TiBw/TC4 based on ultrasonic vibration assisted drilling Y Feng, H Wang, M Zhang, Z Zhu, X Wang, B Jia, X Jia International Journal of Precision Engineering and Manufacturing 21, 915-926, 2020 | 8 | 2020 |
| Surface characteristics and material removal mechanisms during nanogrinding on C-face and Si-face of 4H-SiC crystals: Experimental and molecular dynamics insights H Wang, Z Dong, R Kang, S Gao Applied Surface Science 665, 160293, 2024 | 7 | 2024 |
| Dynamical properties about ultrasonic vibration assisted drilling of TiBw/TC4 composite Y Feng, H Wang, M Zhang, Z Zhu, X Wang, B Jia, X Jia Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2021 | 7 | 2021 |
| Insight into Polishing Slurry and Material Removal Mechanism of Photoassisted Chemical Mechanical Polishing of YAG Crystals X Zhang, X Guo, H Wang, R Kang, S Gao Langmuir 39 (38), 13668-13677, 2023 | 5 | 2023 |
| Ultraprecision machining for single-crystal silicon carbide wafers: State-of-the-art and prospectives W Haoxiang, K Renke, D Zhigang, GAO Shang Journal of Advanced Manufacturing Science and Technology, 2025 | | 2025 |
| Exploring Influential Factors Affecting Baseplate Distortion and Residual Stress in Insulated-Gate Bipolar Transistor (IGBT) Modules During Reflow Soldering S Gao, C Teng, H Wang, H Li, R Kang Journal of Electronic Materials 53 (10), 6432-6447, 2024 | | 2024 |
| Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal H Xiang, H Wang, R Kang, S Gao Journal of Manufacturing Science and Engineering 146 (7), 2024 | | 2024 |
| 单晶碳化硅电化学机械抛光液的组分设计与优化 顾志斌， 王浩祥， 宋鑫， 康仁科， 高尚 金刚石与磨料磨具工程 44 (5), 675-684, 2024 | | 2024 |
