| Rapid method for fabricating polymeric biconvex parabolic lenslets R Sun, Y Li, L Li Optics letters 39 (18), 5391-5394, 2014 | 25 | 2014 |
| A double-sided cooled split-phase SiC power module with fuzz button interposer AI Emon, Y Wu, Y Li, AB Mirza, S Deng, F Luo IEEE Journal of Emerging and Selected Topics in Power Electronics 11 (5 …, 2023 | 9 | 2023 |
| A low inductance, high power density 3L-TNPC power module for more-electric aircraft applications Z Yuan, AI Emon, Z Wang, Y Li, Y Wang, F Luo IEEE Transactions on Transportation Electrification 8 (4), 4291-4302, 2022 | 8 | 2022 |
| State-of-the-art medium-and high-voltage silicon carbide power modules, challenges and mitigation techniques: A review Y Li, AB Mirza, Y Xie, S Deng, SS Vala, F Luo, X Feng, S Narumanchi, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | 5 | 2024 |
| High-power electronic applications enabled by medium voltage silicon-carbide technology: An overview MR Nielsen, S Deng, AB Mirza, BF Kjærsgaard, AB Jørgensen, H Zhao, ... IEEE Transactions on Power Electronics, 2024 | 3 | 2024 |
| Design and validation of a MVDC isolated active voltage injection based HCB AB Mirza, Y Azadeh, H Peng, Y Li, J Kaplun, F Luo IEEE Transactions on Industry Applications 59 (3), 2842-2855, 2023 | 2 | 2023 |
| A Comprehensive Evaluation of Al Heavy Wire Bonding and Ribbon Bonding Application in high power WBG Power Modules Y Li, M Hassan, Y Wu, AI Emon, S Deng, F Luo, A Deshpande, ... IMAPSource Proceedings 2022 (1), 000010-000017, 2023 | 1 | 2023 |
| Design, Fabrication and Testing of 3.3 kV/200A SiC Half-bridge Power Module Y Li, M Hassan, Y Wu, AI Emon, Y Xie, S Deng, F Luo, A Deshpande, ... 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 331-335, 2023 | 1 | 2023 |
| Optimized Channel Phase Estimation in Passive RF Tag Network Y Xie, Y Li, PM Djurić, SR Das, M Stanaćević 2024 IEEE International Conference on RFID (RFID), 1-6, 2024 | | 2024 |
| Reverse Voltage Blocking Switches Using Paralleled GaN Devices for Current Source Inverter Applications M Hassan, Y Wu, Y Li, A Muneeb, F Luo 2023 IEEE Energy Conversion Congress and Exposition (ECCE), 2023 | | 2023 |
| The influence of solder on the thermal stress in a FCOL device X Tao, M Li, J Wang 2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018 | | 2018 |
Fang LuoStony Brook University (SUNY Stony Brook), NYstonybrook.edu üzerinde doğrulanmış e-posta adresine sahip