| Wide bandgap technologies and their implications on miniaturizing power electronic systems HA Mantooth, MD Glover, P Shepherd IEEE Journal of emerging and selected topics in Power Electronics 2 (3), 374-385, 2014 | 297 | 2014 |
| Nickel–tin transient liquid phase bonding toward high-temperature operational power electronics in electrified vehicles SW Yoon, MD Glover, K Shiozaki IEEE Transactions on Power Electronics 28 (5), 2448-2456, 2012 | 181 | 2012 |
| A solution to press-pack packaging of SiC MOSFETS N Zhu, HA Mantooth, D Xu, M Chen, MD Glover IEEE Transactions on Industrial Electronics 64 (10), 8224-8234, 2017 | 121 | 2017 |
| Nonoperative management of the adult ruptured spleen MR Villalba, GA Howells, RJ Lucas, JL Glover, PJ Bendick, O Tran, ... Archives of Surgery 125 (7), 836-839, 1990 | 88 | 1990 |
| 3-D wire bondless switching cell using flip-chip-bonded silicon carbide power devices S Seal, MD Glover, HA Mantooth IEEE transactions on power electronics 33 (10), 8553-8564, 2017 | 83 | 2017 |
| A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications RR Lamichhane, N Ericsson, S Frank, C Britton, L Marlino, A Mantooth, ... 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's …, 2014 | 69 | 2014 |
| A 4H silicon carbide gate buffer for integrated power systems N Ericson, S Frank, C Britton, L Marlino, SH Ryu, D Grider, A Mantooth, ... IEEE transactions on power electronics 29 (2), 539-542, 2013 | 55 | 2013 |
| High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications B Whitaker, Z Cole, B Passmore, D Martin, T McNutt, A Lostetter, ... 2014 IEEE Workshop on Wide Bandgap Power Devices and Applications, 36-40, 2014 | 43 | 2014 |
| Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding S Seal, MD Glover, AK Wallace, HA Mantooth 2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2016 | 41 | 2016 |
| Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles SW Yoon, K Shiozaki, S Yasuda, MD Glover 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and …, 2012 | 36 | 2012 |
| Reliability of flexible thin-film embedded resistors and electrical characterization of thin-film embedded capacitors and inductors K Fairchild, G Morcan, T Lenihan, W Brown, L Schaper, S Ang, ... 1997 Proceedings 47th Electronic Components and Technology Conference, 730-738, 1997 | 34 | 1997 |
| High-performance and high-data-rate quasi-coaxial LTCC vertical interconnect transitions for multichip modules and system-on-package applications E Decrossas, MD Glover, K Porter, T Cannon, T Stegeman, ... IEEE transactions on components, packaging and manufacturing technology 5 (3 …, 2015 | 33 | 2015 |
| Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles SW Yoon, MD Glover, HA Mantooth, K Shiozaki Journal of Micromechanics and Microengineering 23 (1), 015017, 2012 | 31 | 2012 |
| A UVLO circuit in SiC compatible with power MOSFET integration MD Glover, P Shepherd, AM Francis, M Mudholkar, HA Mantooth, ... IEEE Journal of Emerging and Selected Topics in Power Electronics 2 (3), 425-433, 2014 | 27 | 2014 |
| Design and evaluation of press-pack SiC MOSFET N Zhu, M Chen, D Xu, HA Mantooth, MD Glover 2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2016 | 14 | 2016 |
| Metal layer losses in thin-film microstrip on LTCC AD Fund, WB Kuhn, JA Wolf, RJ Eatinger, KU Porter, MD Glover, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 14 | 2014 |
| Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications E Decrossas, MD Glover, K Porter, T Cannon, HA Mantooth, MC Hamilton 2013 European Microwave Conference, 104-107, 2013 | 13 | 2013 |
| An integrated gate driver in 4H-SiC for power converter applications MN Ericson, SS Frank, CL Britton, LD Marlino, DD Janke, DB Ezell, ... 2014 IEEE workshop on wide Bandgap Power Devices and Applications, 66-69, 2014 | 11 | 2014 |
| Nanosilver preform assisted die attach for high temperature applications S Seal, MD Glover, HA Mantooth 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 2925-2930, 2015 | 10 | 2015 |
| Design of a reduced form factor passive heat sink for high power applications S Seal, M Glover, HA Mantooth 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP), 44-47, 2015 | 7 | 2015 |
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