ToSHI-towards secure heterogeneous integration: Security risks, threat assessment, and assurance N Vashistha, ML Rahman, MSU Haque, A Uddin, MSUI Sami, AM Shuo, ... Cryptology ePrint Archive, 2022 | 25 | 2022 |
POCA: First power-on chip authentication in untrusted foundry and assembly MSUI Sami, F Rahman, A Cron, D Donchin, M Borza, F Farahmandi, ... 2021 IEEE International Symposium on Hardware Oriented Security and Trust …, 2021 | 18 | 2021 |
End-to-End Secure SoC Lifecycle Management MSUI Sami, F Rahman, F Farahmandi, A Cron, M Borza, M Tehranipoor 2021 58th ACM/IEEE Design Automation Conference (DAC), 1295-1298, 2021 | 17 | 2021 |
Enabling security of heterogeneous integration: From supply chain to in-field operations MSUI Sami, HM Kamali, F Farahmandi, F Rahman, M Tehranipoor IEEE Design & Test 40 (5), 86-95, 2023 | 15 | 2023 |
Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration MSUI Sami, T Zhang, AM Shuvo, MSU Haque, PE Calzada, KZ Azar, ... IEEE Access, 2024 | 12 | 2024 |
Heterogeneous integration supply chain integrity through blockchain and CHSM PE Calzada, MSUI Sami, KZ Azar, F Rahman, F Farahmandi, ... ACM Transactions on Design Automation of Electronic Systems 29 (1), 1-25, 2023 | 11 | 2023 |
ToSHI-Towards Secure Heterogeneous Integration: Security Risks, Threat Assessment N Vashistha, ML Rahman, MSU Haque, A Uddin, MSUI Sami, AM Shuo, ... and Assurance. Cryptology ePrint Archive, 2022 | 7 | 2022 |
Digital twin with a perspective from manufacturing industry H Wang, S Chen, MSUI Sami, F Rahman, M Tehranipoor Emerging Topics in Hardware Security, 27-59, 2020 | 5 | 2020 |
Efficiency enhancement and reflectance reduction of thin film silicon plasmonic solar cells MSUI Sami, R Rahman, F Pervin, FM Mohammedy 2016 IEEE 6th International Conference on Photonics (ICP), 1-3, 2016 | 4 | 2016 |
Photovoltaic characteristics and non-idealities of thin film silicon plasmonic solar cells F Pervin, MSU Islam, R Rahman, FM Mohammedy 2015 IEEE International Conference on Telecommunications and Photonics (ICTP …, 2015 | 2 | 2015 |
CAKE-SiP: Chiplet Authenticate & Key Exchange for Secure Provisioning in System-in-Package MSUI Sami, MSM Khan, F Farahmandi, N Asadizanjani, M Tehranipoor 2024 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-8, 2024 | | 2024 |
SECT-HI: Enabling Secure Testing for Heterogeneous Integration to Prevent SiP Counterfeits GI Haidar, MSUI Sami, J Zhou, KZ Azar, M Tehranipoor, F Farahmandi 2024 IEEE International Test Conference (ITC), 303-312, 2024 | | 2024 |
SYSFID—System-Aware Fault-Injection Attack Detection for System-In-Package Architectures AM Shuvo, MSUI Sami, ML Rahman, J Zhou, KZ Azar, F Farahmandi, ... ISTFA 2024, 332-341, 2024 | | 2024 |
HI-SST: Safeguarding SiP Authenticity Through Secure Split-Test in Heterogeneous Integration PE Calzada, MSUI Sami, J Zhou, KZ Azar, F Farahmandi, M Tehranipoor 2024 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 379-384, 2024 | | 2024 |
PQC-HI: PQC-enabled Chiplet Authentication and Key Exchange in Heterogeneous Integration MSUI Sami, KZ Azar, HM Kamali, F Farahmandi, M Tehranipoor 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 464-471, 2024 | | 2024 |
SAP: Silicon Authentication Platform for System-on-Chip Supply Chain Vulnerabilities MSUI Sami, J Zhou, SK Saha, F Rahman, F Farahmandi, M Tehranipoor 2024 IEEE International Symposium on Performance Analysis of Systems and …, 2024 | | 2024 |