| A Sub-cm3Energy-Harvesting Stacked Wireless Sensor Node Featuring a Near-Threshold Voltage IA-32 Microcontroller in 14-nm Tri-Gate CMOS for Always-ON … S Paul, V Honkote, RG Kim, T Majumder, PA Aseron, V Grossnickle, ... IEEE Journal of Solid-State Circuits 52 (4), 961-971, 2017 | 69 | 2017 |
| Low cost, high performance, and high reliability 2.5 D silicon interposer V Sundaram, Q Chen, T Wang, H Lu, Y Suzuki, V Smet, M Kobayashi, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 342-347, 2013 | 27 | 2013 |
| Interconnect assemblies and methods of making and using same R Tummala, V Sundaram, MR Pulugurtha, T Wang, V Smet US Patent App. 14/160,136, 2014 | 15 | 2014 |
| A new era in manufacturable, low-temperature and ultra-fine pitch Cu interconnections and assembly without solders V Smet, M Kobayashi, T Wang, PM Raj, R Tummala 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 484-489, 2014 | 11 | 2014 |
| Copper filling process for small diameter, high aspect ratio Through Silicon Via (TSV) T Wei, J Cai, Q Wang, Z Liu, Y Li, T Wang, D Wang 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 10 | 2012 |
| Development of a BGA package based on Si interposer with through silicon via H Zhang, J Cai, Q Wang, T Wang, S Wang Tsinghua science and technology 16 (4), 408-413, 2011 | 10 | 2011 |
| Design and realize of 3D integration of a pressure sensor system with through silicon via (TSV) approach T Wang, J Cap, Q Wang, H Zhang, Z Wang 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 9 | 2011 |
| Modeling, design, and demonstration of low-temperature Cu interconnections to ultra-thin glass interposers at 20 μm pitch T Wang, V Smet, M Kobayashi, V Sundaram, PM Raj, R Tummala 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 284-289, 2014 | 3 | 2014 |
| Copper chemical mechanical polishing and wafer thinning with temporary bonding for Through Silicon Via interconnect Z Liu, J Cai, Q Wang, T Wang, T Wei, L Li 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 2 | 2012 |
| Heterogeneous integration of MEMS sensor array and CMOS readout IC with Through Silicon Via interconnects Q Wang, S Xie, T Wang, J Cai, Z Liu, D Wu, M Yue, Z Wang, S Wang, ... 2012 2nd IEEE CPMT Symposium Japan, 1-5, 2012 | 1 | 2012 |
| Design and fabrication of WLP compatible miniaturized pressure sensor system with through silicon via (TSV) interconnects T Wang, J Cai, Q Wang, H Zhang, Z Wang International Symposium on Microelectronics 2011 (1), 000033-000043, 2011 | 1 | 2011 |
Tiwei WeiAssistant Professor at Purdue University, Postdoc at Stanford University, Ph.D. in IMEC/KU Leuvenstanford.edu üzerinde doğrulanmış e-posta adresine sahip