| Packaged Ga2O3 Schottky Rectifiers With Over 60-A Surge Current Capability M Xiao, B Wang, J Liu, R Zhang, Z Zhang, C Ding, S Lu, K Sasaki, GQ Lu, ... IEEE Transactions on Power Electronics 36 (8), 8565-8569, 2021 | 112 | 2021 |
| Characterization of a nonlinear resistive polymer-nanoparticle composite coating for electric field reduction in a medium-voltage power module Z Zhang, KDT Ngo, GQ Lu IEEE Transactions on Power Electronics 37 (3), 2475-2479, 2021 | 42 | 2021 |
| Packaging of a 10-kV double-side cooled silicon carbide diode module with thin substrates coated by a nonlinear resistive polymer-nanoparticle composite Z Zhang, S Lu, B Wang, Y Zhang, N Yun, W Sung, KDT Ngo, GQ Lu IEEE Transactions on Power Electronics 37 (12), 14462-14470, 2022 | 39 | 2022 |
| Low parasitic-inductance packaging of a 650 V/150 a half-bridge module using enhancement-mode gallium-nitride high electron mobility transistors S Lu, T Zhao, Z Zhang, KDT Ngo, R Burgos, GQ Lu IEEE Transactions on Industrial Electronics 70 (1), 344-351, 2022 | 25 | 2022 |
| Desired properties of a nonlinear resistive coating for shielding triple point in a medium-voltage power module J Xu, Z Zhang, KDT Ngo, GQ Lu IEEE Transactions on Dielectrics and Electrical Insulation 28 (5), 1721-1728, 2021 | 23 | 2021 |
| Chip size minimization for wide and ultrawide bandgap power devices B Wang, M Xiao, Z Zhang, Y Wang, Y Qin, Q Song, GQ Lu, K Ngo, ... IEEE Transactions on Electron Devices 70 (2), 633-639, 2023 | 22 | 2023 |
| Packaging of an 8-kV silicon carbide diode module with double-side cooling and sintered-silver joints Z Zhang, J Zhang, J Xu, KDT Ngo, GQ Lu, E Cousineau, P Paret, ... 2021 IEEE Electric Ship Technologies Symposium (ESTS), 1-7, 2021 | 18 | 2021 |
| Double-side cooled SIC MOSFET power modules with sintered-silver interposers for a 100-kW/L traction inverter C Ding, S Lu, Z Zhang, K Zhang, T Nguyen, KDT Ngo, R Burgos, GQ Lu IEEE transactions on power electronics 38 (8), 9685-9694, 2023 | 17 | 2023 |
| Field-grading effect of a nonlinear resistive polymer-nanoparticle composite triple-point coating on direct-bond copper substrates for packaging medium-voltage power devices Z Zhang, Q Yuchi, F Boshkovski, KDT Ngo, GQ Lu 2022 IEEE Electrical Insulation Conference (EIC), 439-442, 2022 | 9 | 2022 |
| Improved measurement accuracy for junction-to-case thermal resistance of GaN HEMT packages by gate-to-gate electrical resistance and stacking thermal interface materials S Lu, Z Zhang, C Buttay, KDT Ngo, GQ Lu IEEE Transactions on Power Electronics 37 (6), 6285-6289, 2022 | 9 | 2022 |
| Packaging of a 15-kV silicon carbide MOSFET with insulation enhanced by a nonlinear resistive polymer-nanoparticle coating Z Zhang, S Lu, C Nicholas, N Yun, W Sung, KDT Ngo, GQ Lu 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-4, 2022 | 7 | 2022 |
| Package design and analysis of a 20-kV double-sided silicon carbide diode module with polymer nanocomposite field-grading coating Z Zhang, E Arriola, C Nicholas, J Lynch, N Yun, A Morgan, W Sung, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | 3 | 2024 |
| Effective field grading at 200° C of a nonlinear resistive polymer nanocomposite coating for medium-voltage power modules Z Zhang, Q Yuchi, C Nicholas, KDT Ngo, GQ Lu IEEE Transactions on Power Electronics 39 (4), 3974-3978, 2024 | 3 | 2024 |
| Double-Sided Cooling Half-Bridge Power Module of 650 V/150 A Gallium Nitride High-Electron-Mobility Transistor S Lu, B Li, E Arriola, Z Zhang, C Nicholas, KDT Ngo, GQ Lu IEEE Transactions on Industrial Electronics, 2024 | 2 | 2024 |
| Evaluation of a nonlinear resistive polymer-nanoparticle composite for field-grading in a double-side cooled 10-kV silicon carbide rectifier module Z Zhang, KDT Ngo, W Sung, GQ Lu CIPS 2022; 12th International Conference on Integrated Power Electronics …, 2022 | 2 | 2022 |
| Effects of encapsulant properties on the thermo-mechanical reliability of double-side cooled power modules for traction inverters F Boshkovski, C Nicholas, Z Zhang, P Paret, KDT Ngo, GQ Lu 2023 IEEE Energy Conversion Congress and Exposition (ECCE), 5934-5938, 2023 | 1 | 2023 |
| Packaging of 20 kV double-side cooled silicon carbide diode module with electrical insulation enhanced by a polymer-nanoparticle coating Z Zhang, C Nicholas, A Emmanuel, KDT Ngo, GQ Lu, J Lynch, N Yun, ... 2023 25th European Conference on Power Electronics and Applications (EPE'23 …, 2023 | 1 | 2023 |
| Field-grading in medium-voltage power modules using a nonlinear resistive polymer nanocomposite coating Z Zhang Doctoral Dissertations, Bradley Dept. Elect. Comput. Eng., Virginia Tech …, 2023 | 1 | 2023 |
| Package Design of a Double-Side Cooled 20-kV Gallium Nitride Diode Module With Improved Insulation by Nonlinear Resistive Polymer-Nanoparticle Coating Z Zhang, C Nicholas, KDT Ngo, GQ Lu 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 1622-1626, 2023 | 1 | 2023 |
| Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules Y Gao, K Yin, CL Bak, AB Jørgensen, Z Zhang, H Zhao, S Munk-Nielsen, ... IEEE Transactions on Power Electronics, 2024 | | 2024 |
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSEПідтверджена електронна адреса в vt.edu