Direct methane activation by atomically thin platinum nanolayers on two-dimensional metal carbides Z Li, Y Xiao, PR Chowdhury, Z Wu, T Ma, JZ Chen, G Wan, TH Kim, D Jing, ...
Nature Catalysis 4 (10), 882-891, 2021
89 2021 Machine learning maximized Anderson localization of phonons in aperiodic superlattices PR Chowdhury, C Reynolds, A Garrett, T Feng, SP Adiga, X Ruan
Nano Energy 69, 104428, 2020
85 2020 Wide range continuously tunable and fast thermal switching based on compressible graphene composite foams T Du, Z Xiong, L Delgado, W Liao, J Peoples, R Kantharaj, ...
Nature communications 12 (1), 4915, 2021
69 2021 Measurement of effective bulk and contact resistance of gas diffusion layer under inhomogeneous compression–Part I: Electrical conductivity A Vikram, PR Chowdhury, RK Phillips, M Hoorfar
Journal of Power Sources 320, 274-285, 2016
63 2016 Measurement of effective bulk and contact resistance of gas diffusion layer under inhomogeneous compression–Part II: Thermal conductivity PR Chowdhury, A Vikram, RK Phillips, M Hoorfar
Journal of Power Sources 320, 222-230, 2016
40 2016 Fast and accurate machine learning prediction of phonon scattering rates and lattice thermal conductivity Z Guo, P Roy Chowdhury, Z Han, Y Sun, D Feng, G Lin, X Ruan
npj Computational Materials 9 (1), 95, 2023
20 2023 Enhancement of Thermal Transfer From β-Ga2 O3 Nano-Membrane Field-Effect Transistors to High Thermal Conductivity Substrate by Inserting an Interlayer J Noh, PR Chowdhury, M Segovia, S Alajlouni, M Si, AR Charnas, ...
IEEE Transactions on Electron Devices 69 (3), 1186-1190, 2022
14 2022 Unexpected thermal conductivity enhancement in aperiodic superlattices discovered using active machine learning P Roy Chowdhury, X Ruan
NPJ Computational Materials 8 (1), 12, 2022
13 2022 Development of interatomic potentials for the complex binary compound P Roy Chowdhury, T Feng, X Ruan
Physical Review B 99 (15), 155202, 2019
13 2019 Prediction of Bi2 Te3 -Sb2 Te3 Interfacial Conductance and Superlattice Thermal Conductivity Using Molecular Dynamics Simulations P Roy Chowdhury, J Shi, T Feng, X Ruan
ACS Applied Materials & Interfaces 13 (3), 4636-4642, 2021
12 2021 Machine learning designed and experimentally confirmed enhanced reflectance in aperiodic multilayer structures P Roy Chowdhury, K Khot, J Song, Z He, D Kortge, Z Han, P Bermel, ...
Advanced Optical Materials 12 (4), 2300610, 2024
6 2024 Thermo-mechanical analysis of thermal compression bonding chip-join process PR Chowdhury, K Sakuma, S Raghavan, M Bergendahl, K Sikka, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 579-585, 2022
6 2022 Machine learning-based design optimization of aperiodic multilayer coatings for enhanced solar reflection K Khot, PR Chowdhury, X Ruan
International Journal of Heat and Mass Transfer 224, 125303, 2024
4 2024 Backside power distribution for nanosheet technologies beyond 2nm R Xie, W Hong, C Zhang, J Lee, K Brew, R Johnson, N Lanzillo, ...
2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2024
3 2024 Thermal characterization of 3-D stacked heterogeneous integration (HI) package for High-Power computing applications A Jain, R Miyazawa, S Raghavan, PR Chowdhury, MG Farooq, A Kumar, ...
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1219-1225, 2023
3 2023 Modeling of the temperature profile and residual stress during thermal compression bonding in 3D packages PR Chowdhury, S Raghavan, L Darling, A Jain, PR Chowdhury, ...
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1418-1425, 2023
3 2023 Stacked fets with contact placeholder structures S Mukesh, T Li, PR Chowdhury, QIN Liqiao, N Jain, R Xie
US Patent App. 17/946,546, 2024
1 2024 An iterative machine learning approach for discovering unexpected thermal conductivity enhancement in aperiodic superlattices PR Chowdhury, X Ruan
arXiv preprint arXiv:2012.08657, 2020
1 2020 Monolithic Stacked FET with Stepped Channels for Future Logic Technologies C Zhang, S Song, J Strane, L Zou, S Yun, K Park, A Shadman, J Lee, ...
IEEE International Electron Devices Meeting, 2024
2024 Die bending stiffness modification through grooving S Raghavan, MG Farooq, PR Chowdhury
US Patent App. 18/175,985, 2024
2024 
Xiulin RuanProfessor, School of Mechanical Engineering, Purdue UniversityПідтверджена електронна адреса в purdue.edu
