| Packaged Ga2O3 Schottky Rectifiers With Over 60-A Surge Current Capability M Xiao, B Wang, J Liu, R Zhang, Z Zhang, C Ding, S Lu, K Sasaki, GQ Lu, ... IEEE Transactions on Power Electronics 36 (8), 8565-8569, 2021 | 112 | 2021 |
| A double-side cooled SiC MOSFET power module with sintered-silver interposers: I-design, simulation, fabrication, and performance characterization C Ding, H Liu, KDT Ngo, R Burgos, GQ Lu IEEE Transactions on Power Electronics 36 (10), 11672-11680, 2021 | 90 | 2021 |
| Design and additive manufacturing of multipermeability magnetic cores L Liu, C Ding, S Lu, T Ge, Y Yan, Y Mei, KDT Ngo, GQ Lu IEEE Transactions on Industry Applications 54 (4), 3541-3547, 2018 | 55 | 2018 |
| Additive manufacturing of planar inductor for Power Electronics applications Y Yan, C Ding, KDT Ngo, Y Mei, GQ Lu 2016 International Symposium on 3D Power Electronics Integration and …, 2016 | 45 | 2016 |
| Magnetic paste as feedstock for additive manufacturing of power magnetics C Ding, L Liu, Y Mei, KDT Ngo, GQ Lu 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 615-618, 2018 | 24 | 2018 |
| Reliability and lifetime prediction model of sintered silver under high-temperature cycling P Paret, J Major, D DeVoto, S Narumanchi, C Ding, GQ Lu IEEE Journal of Emerging and Selected Topics in Power Electronics 10 (5 …, 2021 | 20 | 2021 |
| Additive manufacturing of magnetic components for heterogeneous integration Y Yan, L Liu, C Ding, L Nguyen, J Moss, Y Mei, GQ Lu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 324-330, 2017 | 20 | 2017 |
| Double-side cooled SIC MOSFET power modules with sintered-silver interposers for a 100-kW/L traction inverter C Ding, S Lu, Z Zhang, K Zhang, T Nguyen, KDT Ngo, R Burgos, GQ Lu IEEE transactions on power electronics 38 (8), 9685-9694, 2023 | 17 | 2023 |
| Fully printed resonance-free broadband conical inductors using engineered magnetic inks C Yi, R Fedderwitz, D Park, C Ding, GQ Lu, J Fleischer, P Li, P Kofinas, ... Additive Manufacturing 44, 102034, 2021 | 16 | 2021 |
| Additive manufacturing of hetero-magnetic coupled inductors C Ding, S Lu, L Liu, KDT Ngo, GQ Lu IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 16 | 2021 |
| Hetero-magnetic coupled inductor (HMCI) for high frequency interleaved multiphase DC/DC converters S Lu, C Ding, Y Mei, KDT Ngo, GQ Lu 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 2667-2672, 2019 | 14 | 2019 |
| Additive manufacturing of spiral windings for a pot-core constant-flux inductor C Ding, S Lu, J Moss, J Mullenix, Y Mei, KDT Ngo, GQ Lu IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 618-625, 2019 | 10 | 2019 |
| A soft magnetic moldable composite with tri-modal size distribution for power electronics applications C Ding, KDT Ngo, GQ Lu IEEE Transactions on Magnetics 57 (3), 1-6, 2021 | 9 | 2021 |
| Reliability assessment of 3D-printed pot-core constant-flux inductors C Ding, L Liu, J Moss, J Mullenix, KDT Ngo, GQ Lu 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 7045-7049, 2018 | 7 | 2018 |
| A (permalloy+ NiZn ferrite) moldable magnetic composite for heterogeneous integration of power electronics C Ding, Y Mei, KDT Ngo, G Lu Materials 12 (12), 1999, 2019 | 6 | 2019 |
| Tailoring a silver paste for additive manufacturing of co-fired ferrite magnetic components L Liu, C Ding, Y Mei, G Lu Materials 12 (5), 817, 2019 | 6 | 2019 |
| Heteromagnetic Swinging Inductor and Its Application for Power Factor Correction Converters S Lu, C Ding, L Liu, Y Mei, KDT Ngo, GQ Lu IEEE Transactions on Industry Applications 56 (5), 5292-5298, 2020 | 3 | 2020 |
| Hetero-magnetic swinging inductor (HMSI) and its application for power factor correction converters S Lu, Y Mei, C Ding, KDT Ngo, L Liu, GQ Lu 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 3522-3526, 2018 | 3 | 2018 |
| Reliability assessment of magnetic cores and 3-D-Printed constant-flux inductors C Ding, L Liu, J Moss, J Mullenix, KDT Ngo, GQ Lu IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 1 | 2020 |
| Double-side cooled power modules with sintered-silver interposers CD Guo-Quan Lu US Patent App. 18/549,443, 2024 | | 2024 |
